会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Encapsulation method for packaging semiconductor components with external leads
    • 用外部引线封装半导体元件的封装方法
    • US07943424B1
    • 2011-05-17
    • US12592597
    • 2009-11-30
    • Limin WangLei ShiLiang ZhaoFeng Ye
    • Limin WangLei ShiLiang ZhaoFeng Ye
    • H01L21/56
    • H01L21/561H01L21/4842H01L23/3107H01L24/97H01L2924/01033H01L2924/01079H01L2924/01082H01L2924/014
    • This invention discloses a method for packaging a semiconductor device with leads extending outside its encapsulation. The method comprises the following steps: Step 1, providing a lead frame comprising a plurality of lead frame units arranged in two dimensional array, each lead frame unit comprising a die pad and a plurality of leads located along two opposite sides of the die pad, attaching a semiconductor chip onto the die pad and electrically connecting the electrodes on each chip to its corresponding leads; Step 2, Encapsulating the chips, the die pads, and the leads with molding material into a plurality of one dimensional plastic encapsulation bars with the leads of each lead frame unit extending out along two opposite sides of the plastic encapsulation bars connecting to a plurality of tie bars substantially parallel to the plastic encapsulation bars; Step 3, Trimming off the tie bars therefore cutting off the connections between the leads to the tie bars while preserving a portion of the leads extending out of the plastic encapsulation bars; and Step 4, Sawing through the plastic encapsulation bars to form a plurality of individual semiconductor components with leads extending outside its encapsulation.
    • 本发明公开了一种用于封装半导体器件的方法,该半导体器件具有在其封装之外延伸的引线。 该方法包括以下步骤:步骤1,提供包括以二维阵列排列的多个引线框单元的引线框架,每个引线框架单元包括管芯焊盘和位于管芯焊盘的两个相对侧的多个引线, 将半导体芯片附接到芯片焊盘上并将每个芯片上的电极电连接到其对应的引线; 步骤2,通过模塑材料将芯片,芯片焊盘和引线封装成多个一维塑料封装棒,每个引线框架单元的引线沿塑料封装条的两个相对侧延伸,连接到多个 连接条基本上平行于塑料封装条; 步骤3,修剪连接杆,从而切断导线到连接杆之间的连接,同时保留从塑料封装棒伸出的一部分引线; 和步骤4,通过塑料封装条锯切以形成多个单独的半导体部件,其引线延伸到其封装外部。
    • 2. 发明申请
    • ENCAPSULATION METHOD FOR PACKAGING SEMICONDUCTOR COMPONENTS WITH EXTERNAL LEADS
    • 用于封装具有外部引线的半导体元件的封装方法
    • US20110129962A1
    • 2011-06-02
    • US12592597
    • 2009-11-30
    • Limin WangLei ShiLiang ZhaoFeng Ye
    • Limin WangLei ShiLiang ZhaoFeng Ye
    • H01L21/78
    • H01L21/561H01L21/4842H01L23/3107H01L24/97H01L2924/01033H01L2924/01079H01L2924/01082H01L2924/014
    • This invention discloses a method for packaging a semiconductor device with leads extending outside its encapsulation. The method comprises the following steps: Step 1, providing a lead frame comprising a plurality of lead frame units arranged in two dimensional array, each lead frame unit comprising a die pad and a plurality of leads located along two opposite sides of the die pad, attaching a semiconductor chip onto the die pad and electrically connecting the electrodes on each chip to its corresponding leads; Step 2, Encapsulating the chips, the die pads, and the leads with molding material into a plurality of one dimensional plastic encapsulation bars with the leads of each lead frame unit extending out along two opposite sides of the plastic encapsulation bars connecting to a plurality of tie bars substantially parallel to the plastic encapsulation bars; Step 3, Trimming off the tie bars therefore cutting off the connections between the leads to the tie bars while preserving a portion of the leads extending out of the plastic encapsulation bars; and Step 4, Sawing through the plastic encapsulation bars to form a plurality of individual semiconductor components with leads extending outside its encapsulation.
    • 本发明公开了一种用于封装半导体器件的方法,该半导体器件具有在其封装之外延伸的引线。 该方法包括以下步骤:步骤1,提供包括以二维阵列排列的多个引线框单元的引线框架,每个引线框架单元包括管芯焊盘和位于管芯焊盘的两个相对侧的多个引线, 将半导体芯片附接到芯片焊盘上并将每个芯片上的电极电连接到其对应的引线; 步骤2,通过模塑材料将芯片,芯片焊盘和引线封装成多个一维塑料封装棒,每个引线框架单元的引线沿塑料封装条的两个相对侧延伸,连接到多个 连接条基本上平行于塑料封装条; 步骤3,修剪连接杆,从而切断导线到连接杆之间的连接,同时保留从塑料封装棒伸出的一部分引线; 和步骤4,通过塑料封装条锯切以形成多个单独的半导体部件,其引线延伸到其封装外部。
    • 5. 发明申请
    • Compact and high performance opto-mechanical switch
    • 紧凑型高性能光机械开关
    • US20060132938A1
    • 2006-06-22
    • US11249888
    • 2005-10-12
    • Yong WangFeng Ye
    • Yong WangFeng Ye
    • G02B5/04
    • G02B6/3524G02B6/3528G02B6/3548G02B6/3564
    • A 2×2 opto-mechanical switch is disclosed. A first embodiment of the present invention utilizes a transmitting compact parallel prism and four or two pieces of the 45-degree prism to increase the beam separation. The compact parallel prism keeps a much smaller load to the relay arm. This makes the current invention less sensitive to the ambient shock and vibration. A second embodiment of the present invention utilizes a similar transmitting compact parallel prism and two wedge prisms which has similar advantages. The compact prism applies a small loading force to the relay arm. Both of these embodiments also feature superior thermal and mechanical stability. An opto-mechanical switch in accordance with the present invention utilizes a transmitting design and thus is more stable to ambient thermal or mechanical change. The embodiments of the present invention also feature much better repeatability than the conventional 2×2 optical switches.
    • 公开了一种2x2光机械开关。 本发明的第一实施例利用发射紧凑的平行棱镜和四个或两个45度棱镜来增加光束分离。 紧凑的平行棱镜对继电器臂的负载要小得多。 这使得本发明对周围的冲击和振动不那么敏感。 本发明的第二实施例利用类似的发射紧凑平行棱镜和两个具有类似优点的楔形棱镜。 紧凑型棱镜对继电器臂施加小的加载力。 这两个实施例也具有优异的热和机械稳定性。 根据本发明的光机械开关利用透射设计,因此对环境热或机械变化更加稳定。 与传统的2x2光开关相比,本发明的实施例还具有更好的重复性。
    • 6. 发明授权
    • Method, equipment and system for implementing coordinated multi-point transmission
    • 实现协调多点传输的方法,设备和系统
    • US08599810B2
    • 2013-12-03
    • US13338358
    • 2011-12-28
    • Guolin SunFeng YeXiujuan Gao
    • Guolin SunFeng YeXiujuan Gao
    • H04W4/00H04J3/16H04B3/10
    • H04B7/024H04B7/0626H04L27/2657H04L27/2689H04L27/2695
    • A method, equipment and system for implementing coordinated multi-point transmission are provided for resolving the problem that there exists phase noise in the signals received by a User Equipment (UE) end in coordinated multi-point transmission. The method for implementing coordinated multi-point transmission includes: obtaining phase differences between the current service cell and other coordinated cells by calculating channel cross-covariance matrixes between the current service cell and other coordinated cells in a coordinated multi-point transmission system (101); feeding back the phase differences corresponding to the base stations of said other coordinated cells respectively to the base stations of said other coordinated cells, in order to implement phase compensation (102); receiving the signals transmitted after the phase compensation by base stations of all the coordinated cells (103). The method, terminal and system provided by the embodiments of the present invention are applicable to the coordinated communication in various wireless networks.
    • 提供了一种用于实现协调多点传输的方法,设备和系统,用于解决用户设备(UE)在协调多点传输中接收的信号中存在相位噪声的问题。 实现协调多点传输的方法包括:通过计算协调多点传输系统(101)中当前服务小区与其他协同小区之间的信道协方差矩阵,获得当前业务小区与其他协同小区的相位差, ; 将与所述其他协调小区的基站相对应的相位差反馈到所述其他协作小区的基站,以实现相位补偿(102); 接收在所有协调小区(103)的基站进行相位补偿之后发送的信号。 本发明实施例提供的方法,终端和系统适用于各种无线网络中的协调通信。
    • 10. 发明授权
    • Optical circulator
    • 光循环器
    • US06624938B1
    • 2003-09-23
    • US09881780
    • 2001-06-14
    • Feng YeHo-Shang Lee
    • Feng YeHo-Shang Lee
    • G02B530
    • G02B27/288G02B6/272G02B6/2746G02B6/2766G02B6/2773G02B27/283
    • An optical circulator for transmitting light along a first optical path from a first optical port to a second optical port and along a second optical path from the second optical port to a third optical port, an optical interface in the first and second optical paths that passes the first beam but deflects the second beam to a highly reflective surface, wherein the plane of the highly reflective surface is at an angle to the optical interface such that the second beam is deflected from the highly reflective surface to the third port, and wherein the first port and the third port can be configured to utilize the same GRIN lens.
    • 一种光循环器,用于沿着第一光路从第一光口到第二光口以及沿着从第二光口到第三光口的第二光路传输光;第一和第二光路中的光接口, 第一光束但是将第二光束偏转到高反射表面,其中高反射表面的平面与光学界面成角度,使得第二光束从高反射表面偏转到第三端口,并且其中 第一个端口和第三个端口可以配置为使用相同的GRIN镜头。