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    • 2. 发明授权
    • Optical apparatuses providing optical interconnections among a plurality of electronic components
    • 在多个电子部件之间提供光学互连的光学装置
    • US07209621B2
    • 2007-04-24
    • US10888308
    • 2004-07-09
    • Alexei GlebovMichael G. LeeKishio Yokouchi
    • Alexei GlebovMichael G. LeeKishio Yokouchi
    • G02B6/10
    • G02B6/43G02B6/322
    • Optical apparatuses providing optical interconnections among a plurality N of electronic components. One exemplary apparatus comprises a slab waveguide having a core layer that enables light beams to propagate in a plurality of directions, a plurality of N reception ports, and a plurality of N transmission ports, each reception port and each transmission port serving a respective electronic component, and each being optically coupled to the core layer of the slab waveguide. Each transmission port is configured to receive a plurality of light beams from its assigned electronic component and to transmit each received light beam onto the slab waveguide in a direction toward a reception port. Each reception port is configured to receive from the slab waveguide a plurality of light beams transmitted to it from at least two different transmission ports. Light beams within the slab waveguide are permitted to cross paths. Other exemplary embodiments are disclosed.
    • 在多个N个电子部件之间提供光学互连的光学装置。 一个示例性装置包括具有能够使光束在多个方向上传播的核心层的平板波导,多个N个接收端口和多个N个传输端口,每个接收端口和每个传输端口服务于相应的电子部件 ,并且每个光学耦合到平板波导的芯层。 每个传输端口被配置为从其分配的电子部件接收多个光束,并且在朝向接收端口的方向上将每个接收的光束发射到平板波导上。 每个接收端口被配置为从平板波导接收从至少两个不同传输端口传输到其的多个光束。 平板波导内的光束被允许交叉路径。 公开了其它示例性实施例。
    • 4. 发明授权
    • Optical bumps for low-loss interconnection between a device and its supported substrate and related methods
    • 用于器件与其支撑衬底之间低损耗互连的光学凸块及相关方法
    • US07453058B2
    • 2008-11-18
    • US11080200
    • 2005-03-15
    • Michael G. LeeKishio Yokouchi
    • Michael G. LeeKishio Yokouchi
    • H01J5/02
    • H01L31/12
    • The present invention is directed to an apparatus and related methods related to an optical bump for optically coupling devices. An exemplary apparatus includes a first device, a second device, and at least one optical bump. The first device has a first surface including at least one first optically active area. The second device has a second surface including at least one second optically active area positioned in an opposed and spaced-apart relationship with respect to the at least one first optically active area. The first surface is separated from the second surface by a distance. The at least one optical bump is coupled to the first surface between the at least one first optically active area and the at least one second optically active area. The at least one optical bump has a height that is less than the distance between the first surface and the second surface. The at least one optical bump is configured to couple light between the at least one second optically active area and the at least one first optically active area.
    • 本发明涉及一种与用于光耦合器件的光学凸块相关的装置和相关方法。 示例性装置包括第一装置,第二装置和至少一个光学凸块。 第一装置具有包括至少一个第一光学活性区域的第一表面。 第二装置具有第二表面,该第二表面包括相对于至少一个第一光学活性区域以相对且间隔开的关系定位的至少一个第二光学有源区域。 第一表面与第二表面分开一段距离。 所述至少一个光学凸块耦合到所述至少一个第一光学活性区域和所述至少一个第二光学有源区域之间的所述第一表面。 所述至少一个光学凸块的高度小于第一表面和第二表面之间的距离。 所述至少一个光学凸块配置成在所述至少一个第二光学有效区域和所述至少一个第一光学有源区域之间耦合光。
    • 6. 发明授权
    • Apparatuses and methods for integrating opto-electric components into the optical pathways of routing substrates with precision optical coupling and compact electrical interconnection
    • 将光电组件集成到具有精密光耦合和紧凑电气互连的布线基板的光路中的装置和方法
    • US07229219B2
    • 2007-06-12
    • US10944082
    • 2004-09-17
    • Michael G. LeeKishio Yokouchi
    • Michael G. LeeKishio Yokouchi
    • G02B6/42
    • G02B6/4232G02B6/305
    • Disclosed are apparatuses and methods for fast and reliable integration of opto-electric components onto optical routing substrates. Accurate alignment of optical signals to and from the opto-electric components, and short electrical interconnect paths to the components to reduce signal delays to the devices on the components are enabled. In an exemplary embodiment, an attachment area is set out on the optical routing substrate to receive each component. One or more optical waveguides for coupling optical signals with the component are located adjacent to the attachment area. A plurality of conductive pads are located within the attachment area, and are for interconnecting to the component by way of bodies of solder, conductive adhesive, or the like. Interspersed between the conductive pads are a plurality of spacers that set a spacing distance between the attachment area and the opposing surface of the component, resulting in accurate alignment of optical signals.
    • 公开了用于将光电组件快速可靠地集成到光路由基板上的装置和方法。 光信号与光电组件的准确对准,以及到组件的短电互连路径,以减少组件上的器件的信号延迟。 在示例性实施例中,在光学布线基板上设置附接区域以接收每个部件。 用于将光信号与该组件耦合的一个或多个光波导位于附接区附近。 多个导电垫位于附接区域内,并且用于通过焊料体,导电粘合剂等与部件互连。 散布在导电焊盘之间的是多个间隔件,其设置附接区域和部件的相对表面之间的间隔距离,导致光信号的精确对准。
    • 9. 发明授权
    • Optical interconnect apparatuses and electro-optic modulators for processing systems
    • 用于处理系统的光学互连装置和电光调制器
    • US07522783B2
    • 2009-04-21
    • US11447525
    • 2006-06-05
    • Alexei GlebovMichael G. LeeDashun Steve Zhou
    • Alexei GlebovMichael G. LeeDashun Steve Zhou
    • G02F1/35
    • G02F1/0356G02F2001/212
    • Disclosed are optical modulators that provide high-speed modulation capability and compact size. In exemplary modulator embodiments, the branch waveguide cores are formed in different processing layers than the input waveguide core, and light is coupled from an input waveguide core to two branch waveguide cores along diagonal directions. The construction enables the input waveguide core to be made of low-loss material compared to the electro-optic material of the branch waveguide cores. Also disclosed are interconnect apparatuses that can be used in processing systems. Exemplary interconnect apparatuses provide various configurations of components that enable high-speed modulation and compact size. The exemplary interconnect apparatuses may use the exemplary optical modulators disclosed herein.
    • 公开了提供高速调制能力和紧凑尺寸的光学调制器。 在示例性调制器实施例中,分支波导芯形成在与输入波导芯不同的处理层中,并且光沿着对角线方向从输入波导芯耦合到两个分支波导芯。 与分支波导芯的电光材料相比,该结构能够使输入波导芯由低损耗材料制成。 还公开了可以在处理系统中使用的互连装置。 示例性互连装置提供能够进行高速调制和紧凑尺寸的各种组件配置。 示例性互连装置可以使用本文公开的示例性光学调制器。
    • 10. 发明申请
    • Optical interconnect apparatuses and electro-optic modulators for processing systems
    • 用于处理系统的光学互连装置和电光调制器
    • US20070280578A1
    • 2007-12-06
    • US11447525
    • 2006-06-05
    • Alexei GlebovMichael G. LeeDashun Steve Zhou
    • Alexei GlebovMichael G. LeeDashun Steve Zhou
    • G02F1/035
    • G02F1/0356G02F2001/212
    • Disclosed are optical modulators that provide high-speed modulation capability and compact size. In exemplary modulator embodiments, the branch waveguide cores are formed in different processing layers than the input waveguide core, and light is coupled from an input waveguide core to two branch waveguide cores along diagonal directions. The construction enables the input waveguide core to be made of low-loss material compared to the electro-optic material of the branch waveguide cores. Also disclosed are interconnect apparatuses that can be used in processing systems. Exemplary interconnect apparatuses provide various configurations of components that enable high-speed modulation and compact size. The exemplary interconnect apparatuses may use the exemplary optical modulators disclosed herein.
    • 公开了提供高速调制能力和紧凑尺寸的光学调制器。 在示例性调制器实施例中,分支波导芯形成在与输入波导芯不同的处理层中,并且光沿着对角线方向从输入波导芯耦合到两个分支波导芯。 与分支波导芯的电光材料相比,该结构能够使输入波导芯由低损耗材料制成。 还公开了可以在处理系统中使用的互连装置。 示例性互连装置提供能够进行高速调制和紧凑尺寸的各种组件配置。 示例性互连装置可以使用本文公开的示例性光学调制器。