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1. 发明申请

US20070240826A1 Gas supply device and apparatus for gas etching or cleaning substrates 审中-公开
标题翻译：用于气体蚀刻或清洁衬底的气体供应装置和装置
公开(公告)号：US20070240826A1
公开(公告)日：2007-10-18
申请号：US11405618
申请日：2006-04-18
申请人： Liang-Gi Yao , Chia-Lin Chen , Ming-Feng Wang , Ming-Feng Yoo , Kuen-Chyr Lee , Shih-Chang Chen
发明人： Liang-Gi Yao , Chia-Lin Chen , Ming-Feng Wang , Ming-Feng Yoo , Kuen-Chyr Lee , Shih-Chang Chen
IPC分类号： H01L21/306 , C23F1/00
CPC分类号： H01L21/67069
摘要： A gas supply device, including: a first source of an inert carrier gas, communicated with a first pipeline; a second source of anhydrous reactive gas, communicated with a second pipeline; a third source of enabling chemical gas of an enabling chemical compound, communicated with a third pipeline; a main pipeline, communicated with the first, second, and third pipelines; and a temperature controller, located on the second pipeline.
摘要翻译：一种气体供应装置，包括：与第一管道连通的惰性载气的第一源; 与第二管道连通的第二无水反应气源; 与第三管道连通的使能化学化合物化学气体的第三个来源; 一条主要管道，与第一条，第二条和第三条管道通信; 和位于第二管道上的温度控制器。

2. 发明申请

US20080047578A1 METHOD FOR PREVENTING CLOGGING OF REACTION CHAMBER EXHAUST LINES 审中-公开
标题翻译：防止反应室排气管线的方法
公开(公告)号：US20080047578A1
公开(公告)日：2008-02-28
申请号：US11466922
申请日：2006-08-24
申请人： Ming-Feng Yoo , Jean Wang , Jyh-Cherng Sheu
发明人： Ming-Feng Yoo , Jean Wang , Jyh-Cherng Sheu
IPC分类号： B08B9/02
CPC分类号： B08B9/027 , B08B7/0035
摘要： An apparatus and method are disclosed for cleaning exhaust lines from a reaction chamber used in manufacturing semiconductor devices. In particular, an apparatus is disclosed for receiving an exhaust gas from a semiconductor processing reaction chamber, mixing said exhaust gas with a cleaning gas, exciting the mixture to a plasma state, and pumping the mixture away via an exhaust line. A vacuum pump is provided for pumping the mixture, and a scrubber may be provided to remove particulate and other matter from the gas mixture. Radio-frequency or microwave energy may be used to excite the gas mixture, and the cleaning gas may comprise argon.
摘要翻译：公开了一种用于从用于制造半导体器件的反应室清洁排气管线的装置和方法。特别地，公开了一种用于从半导体处理反应室接收废气的装置，将所述废气与清洁气体混合，将混合物激发成等离子体状态，并通过排气管线将混合物泵送。提供用于泵送混合物的真空泵，并且可以提供洗涤器以从气体混合物中除去微粒和其它物质。可以使用射频或微波能量来激发气体混合物，并且清洁气体可以包括氩气。

3. 发明申请

US20090000769A1 Temperature Controlled Loadlock Chamber 有权
标题翻译：温控负荷箱
公开(公告)号：US20090000769A1
公开(公告)日：2009-01-01
申请号：US11769589
申请日：2007-06-27
申请人： Chun-Hsien Lin , Jyh-Cherng Sheu , Ming-Feng Yoo , Kewei Zuo
发明人： Chun-Hsien Lin , Jyh-Cherng Sheu , Ming-Feng Yoo , Kewei Zuo
IPC分类号： F28F7/00
CPC分类号： H01L21/67201 , H01L21/67248
摘要： A temperature controlled loadlock chamber for use in semiconductor processing is provided. The temperature controlled loadlock chamber may include one or more of an adjustable fluid pump, mass flow controller, one or more temperature sensors, and a controller. The adjustable fluid pump provides fluid having a predetermined temperature to a temperature-controlled plate. The mass flow controller provides gas flow into the chamber that may also aid in maintaining a desired temperature. Additionally, one or more temperature sensors may be combined with the adjustable fluid pump and/or the mass flow controller to provide feedback and to provide a greater control over the temperature. A controller may be added to control the adjustable fluid pump and the mass flow controller based upon temperature readings from the one or more temperature sensors.
摘要翻译：提供了一种用于半导体处理的温度控制负载锁定室。温度控制的负载锁定室可以包括可调节流体泵，质量流量控制器，一个或多个温度传感器和控制器中的一个或多个。可调节流体泵向温度控制板提供具有预定温度的流体。质量流量控制器提供气体进入腔室，这也有助于维持所需的温度。此外，一个或多个温度传感器可以与可调节流体泵和/或质量流量控制器组合以提供反馈并且提供对温度的更大控制。可以基于来自一个或多个温度传感器的温度读数来添加控制器来控制可调节流体泵和质量流量控制器。

4. 发明授权

US08905124B2 Temperature controlled loadlock chamber 有权
标题翻译：温度控制负载锁定室
公开(公告)号：US08905124B2
公开(公告)日：2014-12-09
申请号：US11769589
申请日：2007-06-27
申请人： Chun-Hsien Lin , Jyh-Cherng Sheu , Ming-Feng Yoo , Kewei Zuo
发明人： Chun-Hsien Lin , Jyh-Cherng Sheu , Ming-Feng Yoo , Kewei Zuo
IPC分类号： H01L21/306 , G05D23/00 , F28F7/00 , F28D15/00 , H01L21/67
CPC分类号： H01L21/67201 , H01L21/67248
摘要： A temperature controlled loadlock chamber for use in semiconductor processing is provided. The temperature controlled loadlock chamber may include one or more of an adjustable fluid pump, mass flow controller, one or more temperature sensors, and a controller. The adjustable fluid pump provides fluid having a predetermined temperature to a temperature-controlled plate. The mass flow controller provides gas flow into the chamber that may also aid in maintaining a desired temperature. Additionally, one or more temperature sensors may be combined with the adjustable fluid pump and/or the mass flow controller to provide feedback and to provide a greater control over the temperature. A controller may be added to control the adjustable fluid pump and the mass flow controller based upon temperature readings from the one or more temperature sensors.
摘要翻译：提供了一种用于半导体处理的温度控制负载锁定室。温度控制的负载锁定室可以包括可调节流体泵，质量流量控制器，一个或多个温度传感器和控制器中的一个或多个。可调节流体泵向温度控制板提供具有预定温度的流体。质量流量控制器提供气体进入腔室，这也有助于维持所需的温度。此外，一个或多个温度传感器可以与可调节流体泵和/或质量流量控制器组合以提供反馈并且提供对温度的更大控制。可以基于来自一个或多个温度传感器的温度读数来添加控制器来控制可调节流体泵和质量流量控制器。

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