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1. 发明授权

US08295082B2 Gate level reconfigurable magnetic logic 有权
标题翻译：门级可重构磁逻辑
公开(公告)号：US08295082B2
公开(公告)日：2012-10-23
申请号：US12192386
申请日：2008-08-15
申请人： Lew G. Chua-Eoan , Xiaochun Zhu , Zhi Zhu
发明人： Lew G. Chua-Eoan , Xiaochun Zhu , Zhi Zhu
IPC分类号： G11C11/14 , H03K19/177
CPC分类号： G11C11/16
摘要： A re-programmable gate logic includes a plurality of non-volatile re-configurable resistance state-based memory circuits in parallel, wherein the circuits are re-configurable to implement or change a selected gate logic, and the plurality of non-volatile re-configurable resistance state-based memory circuits are each adapted to receive a logical input signal. An evaluation switch in series with the plurality of parallel non-volatile re-configurable resistance state-based memory circuits is configured to provide an output signal based on the programmed states of the memory circuits. A sensor is configured to receive the output signal and provide a logical output signal on the basis of the output signal and a reference signal provided to the sensor. The reconfigurable logic may be implemented based on using spin torque transfer (STT) magnetic tunnel junction (MTJ) magnetoresistance random access memory (MRAM) as the re-programmable memory elements. The logic configuration is retained without power.
摘要翻译：可再编程门逻辑并行包括多个非易失性可重新配置的基于电阻状态的存储器电路，其中电路可重新配置以实现或改变所选择的门逻辑，可配置电阻状态的存储器电路各自适于接收逻辑输入信号。与多个并行非易失性可重配置电阻状态存储电路串联的评估开关被配置为基于存储器电路的编程状态提供输出信号。传感器被配置为接收输出信号并且基于输出信号和提供给传感器的参考信号来提供逻辑输出信号。可重构逻辑可以基于使用自旋转矩传递（STT）磁性隧道结（MTJ）磁阻随机存取存储器（MRAM）作为可再编程存储器元件来实现。逻辑配置在没有电源的情况下保留。

2. 发明申请

US20100039136A1 Gate Level Reconfigurable Magnetic Logic 有权
标题翻译：门级可重构磁逻辑
公开(公告)号：US20100039136A1
公开(公告)日：2010-02-18
申请号：US12192386
申请日：2008-08-15
申请人： Lew G. Chua-Eoan , Xiaochun Zhu , Zhi Zhu
发明人： Lew G. Chua-Eoan , Xiaochun Zhu , Zhi Zhu
IPC分类号： H03K19/173
CPC分类号： G11C11/16
摘要： A re-programmable gate logic includes a plurality of non-volatile re-configurable resistance state-based memory circuits in parallel, wherein the circuits are re-configurable to implement or change a selected gate logic, and the plurality of non-volatile re-configurable resistance state-based memory circuits are each adapted to receive a logical input signal. An evaluation switch in series with the plurality of parallel non-volatile re-configurable resistance state-based memory circuits is configured to provide an output signal based on the programmed states of the memory circuits. A sensor is configured to receive the output signal and provide a logical output signal on the basis of the output signal and a reference signal provided to the sensor. The reconfigurable logic may be implemented based on using spin torque transfer (STT) magnetic tunnel junction (MTJ) magnetoresistance random access memory (MRAM) as the re-programmable memory elements. The logic configuration is retained without power.
摘要翻译：可再编程门逻辑并行包括多个非易失性可重新配置的基于电阻状态的存储器电路，其中电路可重新配置以实现或改变所选择的门逻辑，可配置电阻状态的存储器电路各自适于接收逻辑输入信号。与多个并行非易失性可重配置电阻状态存储电路串联的评估开关被配置为基于存储器电路的编程状态提供输出信号。传感器被配置为接收输出信号并且基于输出信号和提供给传感器的参考信号来提供逻辑输出信号。可重构逻辑可以基于使用自旋转矩传递（STT）磁性隧道结（MTJ）磁阻随机存取存储器（MRAM）作为可再编程存储器元件来实现。逻辑配置在没有电源的情况下保留。

3. 发明申请

US20110215863A1 Integrated Voltage Regulator with Embedded Passive Device(s) 审中-公开
标题翻译：带嵌入式无源器件的集成稳压器
公开(公告)号：US20110215863A1
公开(公告)日：2011-09-08
申请号：US13108335
申请日：2011-05-16
申请人： Yuancheng Christopher Pan , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
发明人： Yuancheng Christopher Pan , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
IPC分类号： H01L25/00
CPC分类号： H01L25/16 , H01L23/642 , H01L23/645 , H01L25/0652 , H01L2224/16225 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H02M3/00 , H05K1/0262 , H05K1/141 , H05K1/185
摘要： A method of supplying voltage to a die mounted on a packaging substrate includes mounting an active portion of a voltage regulator on the packaging substrate. The method also includes coupling the active portion of the voltage regulator to at least one passive component at least partially embedded in the packaging substrate and coupling the die to the at least one passive component. Mounting the active portion of the voltage regulator includes mounting the die on the packaging substrate where the die includes the active portion of the voltage regulator.
摘要翻译：向安装在封装基板上的管芯提供电压的方法包括将电压调节器的有源部分安装在封装基板上。该方法还包括将电压调节器的有源部分耦合到至少部分地嵌入封装衬底中的至少一个无源部件，并将管芯耦合到至少一个无源部件。安装电压调节器的有源部分包括将管芯安装在封装衬底上，其中管芯包括电压调节器的有源部分。

4. 发明申请

US20090172452A1 System and Method of Leakage Control in an Asynchronous System 有权
标题翻译：异步系统泄漏控制系统与方法
公开(公告)号：US20090172452A1
公开(公告)日：2009-07-02
申请号：US11964072
申请日：2007-12-26
申请人： Xiaohua Kong , Lew G. Chua-Eoan , Sei Seung Yoon , Zhi Zhu
发明人： Xiaohua Kong , Lew G. Chua-Eoan , Sei Seung Yoon , Zhi Zhu
IPC分类号： G06F1/26
CPC分类号： H03K19/0016 , G06F9/3871
摘要： Systems and methods of leakage control in an asynchronous pipeline are disclosed. In an embodiment, a signal is received from a preceding stage at an operative stage of an asynchronous circuit device, and a switch associated with the operative stage is activated in response to the control signal being sent to the operative stage to enable power to the operative stage.
摘要翻译：公开了异步管道中泄漏控制的系统和方法。在一个实施例中，在异步电路设备的操作阶段从前一级接收信号，并且响应于控制信号被发送到操作级而使与操作级相关联的开关被激活以使能到操作阶段。

5. 发明申请

US20120293972A1 Integrated Voltage Regulator Method with Embedded Passive Device(s) 有权
标题翻译：带嵌入式无源器件的集成稳压器方法
公开(公告)号：US20120293972A1
公开(公告)日：2012-11-22
申请号：US13367932
申请日：2012-02-07
申请人： Yuancheng Christopher Pan , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
发明人： Yuancheng Christopher Pan , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
IPC分类号： H01L23/12 , H01L21/50
CPC分类号： H01L25/16 , H01L23/642 , H01L23/645 , H01L25/0652 , H01L2224/16225 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H02M3/00 , H05K1/0262 , H05K1/141 , H05K1/185
摘要： A stacked integrated circuit (IC) device includes a semiconductor IC having an active face, and an interconnect structure. The active face receives a regulated voltage from a voltage regulator (MEG). An active portion of the VREG, which supplies the regulated voltage to the semiconductor IC is coupled to the interconnect structure. A packaging substrate includes one or more inductors including a first set of through vias. The first set of through vias are coupled to the interconnect structure and cooperate with the active portion to provide the regulated voltage for the semiconductor IC. The IC also includes a printed circuit board (PCB) coupled to the packaging substrate. The PCB includes a second set of through vias coupled to the first set of through vias. The IC also includes one or more conducting paths on the PCB. The conducting path(s) couple together at least two through vias of the second set of through vias.
摘要翻译：堆叠集成电路（IC）装置包括具有有源面的半导体IC和互连结构。主动面从电压调节器（MEG）接收稳压电压。将调节电压提供给半导体IC的VREG的有效部分耦合到互连结构。包装衬底包括一个或多个包括第一组通孔的电感器。第一组通孔耦合到互连结构并与有源部分配合以提供用于半导体IC的调节电压。 IC还包括耦合到封装衬底的印刷电路板（PCB）。 PCB包括耦合到第一组通孔的第二组通孔。 IC还包括PCB上的一个或多个导电路径。导电路径将第二组通孔的至少两个通孔耦合在一起。

6. 发明授权

US08527797B2 System and method of leakage control in an asynchronous system 有权
标题翻译：异步系统中的泄漏控制系统和方法
公开(公告)号：US08527797B2
公开(公告)日：2013-09-03
申请号：US11964072
申请日：2007-12-26
申请人： Xiaohua Kong , Lew G. Chua-Eoan , Sei Seung Yoon , Zhi Zhu
发明人： Xiaohua Kong , Lew G. Chua-Eoan , Sei Seung Yoon , Zhi Zhu
IPC分类号： G06F1/32
CPC分类号： H03K19/0016 , G06F9/3871
摘要： Systems and methods of leakage control in an asynchronous pipeline are disclosed. In an embodiment, a signal is received from a preceding stage at an operative stage of an asynchronous circuit device, and a switch associated with the operative stage is activated in response to the control signal being sent to the operative stage to enable power to the operative stage.
摘要翻译：公开了异步管道中泄漏控制的系统和方法。在一个实施例中，在异步电路设备的操作阶段从前一级接收信号，并且响应于控制信号被发送到操作级而使与操作级相关联的开关被激活以使能到操作阶段。

7. 发明申请

US20110050334A1 Integrated Voltage Regulator with Embedded Passive Device(s) 审中-公开
标题翻译：带嵌入式无源器件的集成稳压器
公开(公告)号：US20110050334A1
公开(公告)日：2011-03-03
申请号：US12552321
申请日：2009-09-02
申请人： Yuancheng Christopher Pan , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
发明人： Yuancheng Christopher Pan , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
IPC分类号： H01L25/00
CPC分类号： H01L25/16 , H01L23/642 , H01L23/645 , H01L25/0652 , H01L2224/16225 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H02M3/00 , H05K1/0262 , H05K1/141 , H05K1/185
摘要： A semiconductor packaging system has a packaging substrate into which inductors and/or capacitors are partially or completely embedded. An active portion of a voltage regulator is mounted on the packaging substrate and supplies regulated voltage to a die also mounted on the packaging substrate. Alternatively, the active portion of the voltage regulator is integrated into the die the voltage regulator supplies voltage to. The voltage regulator cooperates with the inductors and/or capacitors to supply voltage to the die. The inductors may be through vias in the packaging substrate. For additional inductance, through vias in a printed circuit board on which the packaging substrate is mounted may couple to the through vias in the packaging substrate.
摘要翻译：半导体封装系统具有其中部分或完全嵌入电感器和/或电容器的封装衬底。电压调节器的有源部分安装在封装基板上，并将稳定的电压提供给也安装在封装基板上的管芯。或者，电压调节器的有源部分集成到管芯中，电压调节器将电压提供给。电压调节器与电感器和/或电容器配合以向模具提供电压。电感器可以穿过封装衬底中的通孔。对于额外的电感，通过安装封装衬底的印刷电路板中的通孔可以耦合到封装衬底中的通孔。

8. 发明授权

US09048112B2 Integrated voltage regulator with embedded passive device(s) for a stacked IC 有权
标题翻译：具有嵌入式无源器件的集成稳压器，用于堆叠IC
公开(公告)号：US09048112B2
公开(公告)日：2015-06-02
申请号：US12825937
申请日：2010-06-29
申请人： Yuancheng Christopher Pan , Fifin Sweeney , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
发明人： Yuancheng Christopher Pan , Fifin Sweeney , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
IPC分类号： H01R12/16 , H01L25/065 , H01L23/498 , H01L23/64 , H01L25/18 , H01L23/00
CPC分类号： H01L23/5384 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L24/02 , H01L24/16 , H01L24/48 , H01L25/0657 , H01L25/18 , H01L2224/02371 , H01L2224/05624 , H01L2224/13025 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/48227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06544 , H01L2924/00014 , H01L2924/1205 , H01L2924/1206 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H05K1/11 , H05K1/165 , H05K1/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked integrated circuit includes a first tier IC and a second tier IC. Active faces of the first tier IC and the second tier IC face each other. An interconnect structure, such as microbumps, couples the first tier IC to the second tier IC. An active portion of a voltage regulator is integrated in the first semiconductor IC and coupled to passive components (for example a capacitor or an inductor) embedded in a packaging substrate on which the stacked IC is mounted. The passive components may be multiple through vias in the packaging substrate providing inductance to the active portion of the voltage regulator. The inductance provided to the active portion of the voltage regulator is increased by coupling the through via in the packaging substrate to through vias in a printed circuit board that the packaging substrate is mounted on.
摘要翻译：堆叠式集成电路包括第一层IC和第二层IC。第一层IC和第二层IC的主动面相互面对。互连结构，例如microbumps，将第一层IC耦合到第二层IC。电压调节器的有源部分集成在第一半导体IC中并耦合到嵌入在其上安装有堆叠IC的封装衬底中的无源组件（例如，电容器或电感器）。无源部件可以是在封装衬底中的多个通孔，为电压调节器的有源部分提供电感。通过将封装衬底中的通孔耦合到安装有封装衬底的印刷电路板中的通孔，增加了提供给电压调节器的有源部分的电感。

9. 发明授权

US08692368B2 Integrated voltage regulator method with embedded passive device(s) 有权
标题翻译：嵌入式无源器件的集成稳压器方法
公开(公告)号：US08692368B2
公开(公告)日：2014-04-08
申请号：US13367932
申请日：2012-02-07
申请人： Yuancheng Christopher Pan , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
发明人： Yuancheng Christopher Pan , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
IPC分类号： H01L23/34
CPC分类号： H01L25/16 , H01L23/642 , H01L23/645 , H01L25/0652 , H01L2224/16225 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H02M3/00 , H05K1/0262 , H05K1/141 , H05K1/185
摘要： A stacked integrated circuit (IC) device includes a semiconductor IC having an active face, and an interconnect structure. The active face receives a regulated voltage from a voltage regulator (MEG). An active portion of the VREG, which supplies the regulated voltage to the semiconductor IC is coupled to the interconnect structure. A packaging substrate includes one or more inductors including a first set of through vias. The first set of through vias are coupled to the interconnect structure and cooperate with the active portion to provide the regulated voltage for the semiconductor IC. The IC also includes a printed circuit board (PCB) coupled to the packaging substrate. The PCB includes a second set of through vias coupled to the first set of through vias. The IC also includes one or more conducting paths on the PCB. The conducting path(s) couple together at least two through vias of the second set of through vias.
摘要翻译：堆叠集成电路（IC）装置包括具有有源面的半导体IC和互连结构。主动面从电压调节器（MEG）接收稳压电压。将调节电压提供给半导体IC的VREG的有效部分耦合到互连结构。包装衬底包括一个或多个包括第一组通孔的电感器。第一组通孔耦合到互连结构并与有源部分配合以提供用于半导体IC的调节电压。 IC还包括耦合到封装基板的印刷电路板（PCB）。 PCB包括耦合到第一组通孔的第二组通孔。 IC还包括PCB上的一个或多个导电路径。导电路径将第二组通孔的至少两个通孔耦合在一起。

10. 发明申请

US20110317387A1 Integrated Voltage Regulator with Embedded Passive Device(s) for a Stacked IC 有权
标题翻译：集成稳压器与嵌入式IC的嵌入式无源器件
公开(公告)号：US20110317387A1
公开(公告)日：2011-12-29
申请号：US12825937
申请日：2010-06-29
申请人： Yuancheng Christopher Pan , Fifin Sweeney , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
发明人： Yuancheng Christopher Pan , Fifin Sweeney , Lew G. Chua-Eoan , Zhi Zhu , Junmou Zhang
IPC分类号： H05K7/06 , H01L23/48 , H01L29/92 , H01L29/86 , H01L25/16 , H01L21/50
CPC分类号： H01L23/5384 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L24/02 , H01L24/16 , H01L24/48 , H01L25/0657 , H01L25/18 , H01L2224/02371 , H01L2224/05624 , H01L2224/13025 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/48227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06544 , H01L2924/00014 , H01L2924/1205 , H01L2924/1206 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H05K1/11 , H05K1/165 , H05K1/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked integrated circuit includes a first tier IC and a second tier IC. Active faces of the first tier IC and the second tier IC face each other. An interconnect structure, such as microbumps, couples the first tier IC to the second tier IC. An active portion of a voltage regulator is integrated in the first semiconductor IC and coupled to passive components (for example a capacitor or an inductor) embedded in a packaging substrate on which the stacked IC is mounted. The passive components may be multiple through vias in the packaging substrate providing inductance to the active portion of the voltage regulator. The inductance provided to the active portion of the voltage regulator is increased by coupling the through via in the packaging substrate to through vias in a printed circuit board that the packaging substrate is mounted on.
摘要翻译：堆叠式集成电路包括第一层IC和第二层IC。第一层IC和第二层IC的主动面相互面对。互连结构，例如microbumps，将第一层IC耦合到第二层IC。电压调节器的有源部分集成在第一半导体IC中并耦合到嵌入在其上安装有堆叠IC的封装衬底中的无源组件（例如，电容器或电感器）。无源部件可以是在封装衬底中的多个通孔，为电压调节器的有源部分提供电感。通过将封装衬底中的通孔耦合到安装有封装衬底的印刷电路板中的通孔，增加了提供给电压调节器的有源部分的电感。

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