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1. 发明授权

US08456961B1 Systems and methods for mounting and aligning a laser in an electrically assisted magnetic recording assembly 有权
标题翻译：用于在电辅助磁记录组件中安装和对准激光器的系统和方法
公开(公告)号：US08456961B1
公开(公告)日：2013-06-04
申请号：US13053466
申请日：2011-03-22
申请人： Lei Wang , Jih-Chiou Hser
发明人： Lei Wang , Jih-Chiou Hser
IPC分类号： G11B11/00
CPC分类号： G11B5/3163 , G11B5/314 , G11B5/6088 , G11B2005/0021
摘要： Systems and methods for mounting and aligning a laser in an electrically assisted magnetic recording (EAMR) assembly are described. In one embodiment, the invention relates to a submount assembly for a laser diode of an EAMR head, the submount assembly including a submount including a block shape including a first surface including a plurality of first conductive pads and a second surface including a second conductive pad, a laser including a main emitter and at least one alignment emitter, the laser having a block shape having a first surface including a plurality of first conductive pads attached to the first pads of the submount, and a slider including a top surface having a conductive pad configured to be attached to the second pad of the submount, wherein the at least one alignment emitter is configured to align the laser and the slider for attachment.
摘要翻译：描述了在电辅助磁记录（EAMR）组件中安装和对准激光器的系统和方法。在一个实施例中，本发明涉及一种用于EAMR头的激光二极管的底座组件，所述底座组件包括底座，所述底座组件包括底座，所述底座包括包括包括多个第一导电焊盘的第一表面的块形状，以及包括第二导电焊盘包括主发射器和至少一个对准发射器的激光器，所述激光器具有块形状，所述激光器具有第一表面，所述第一表面包括附接到所述基座的所述第一焊盘的多个第一导电焊盘，以及滑块，所述滑块包括具有导电衬垫，其被配置为附接到所述副座的所述第二焊盘，其中所述至少一个对准发射器被配置为使所述激光器和所述滑块对准以用于附接。

2. 发明授权

US08240545B1 Methods for minimizing component shift during soldering 有权
标题翻译：焊接时元件偏移最小化的方法
公开(公告)号：US08240545B1
公开(公告)日：2012-08-14
申请号：US13208248
申请日：2011-08-11
申请人： Lei Wang , Jih-Chiou Hser
发明人： Lei Wang , Jih-Chiou Hser
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K1/20 , H01L24/32 , H01L24/83 , H01L2224/2908
摘要： Methods for minimizing component shift during soldering are described. One such method includes forming a pedestal pad having a preselected shape on a substrate, forming at least one intervening layer on the substrate, the at least one intervening layer including a layer including a solidifying accelerant, and a layer including a solder, the solder layer having a preselected shape about the same as the preselected shape of the pedestal pad, positioning the component on the at least one intervening layer, and heating the solder to a predetermined process temperature, wherein the pedestal pad is configured to remain a solid during the heating the solder to the predetermined process temperature, and wherein the solidifying accelerant is configured to accelerate a solidification of the solder after the heating the solder to the predetermined process temperature.
摘要翻译：描述了在焊接期间最小化元件偏移的方法。一种这样的方法包括在衬底上形成具有预选形状的衬垫，在衬底上形成至少一个中间层，所述至少一个中间层包括包含凝固促进剂的层和包括焊料的层，所述焊料层具有与所述基座垫的预选形状大约相同的预选形状，将所述部件定位在所述至少一个中间层上，并将所述焊料加热到预定的工艺温度，其中所述基座垫构造成在加热期间保持固体所述焊料达到预定的工艺温度，并且其中所述固化促进剂被配置为在将所述焊料加热至预定工艺温度之后加速所述焊料的凝固。

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