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    • 4. 发明授权
    • Method of filling intervals and fabricating shallow trench isolation structures
    • 填充间隔和制造浅沟槽隔离结构的方法
    • US06855617B1
    • 2005-02-15
    • US10707083
    • 2003-11-20
    • Chien-Hung LuChin-Ta SuKuang-Chao Chen
    • Chien-Hung LuChin-Ta SuKuang-Chao Chen
    • H01L21/762H01L21/76
    • H01L21/76224
    • A method of filling intervals between protruding structures is provided. A substrate with a plurality of protruding structures thereon is provided. The protruding structures are distributed over the substrate such that intervals are formed between adjacent protruding structures. A first dielectric layer is formed over the substrate so that the dielectric material fills the intervals between the protruding structures and covers the protruding structures as well. The first dielectric layer has a plurality of apertures therein located at a level above a top section of the protruding structures. A chemical/mechanical polishing operation is performed to remove a portion of the dielectric layer and expose the apertures to form a plurality of openings. An anisotropic etching operation is performed to increase the width of these openings. Finally, a second dielectric layer is formed over the first dielectric layer to fill the openings completely.
    • 提供了一种在突出结构之间填充间隔的方法。 提供其上具有多个突出结构的基板。 突出结构分布在基板上,使得在相邻突出结构之间形成间隔。 第一电介质层形成在衬底上,使得介电材料填充突出结构之间的间隔并且也覆盖突出结构。 第一电介质层具有位于突出结构的顶部的上方的多个孔。 执行化学/机械抛光操作以去除电介质层的一部分并暴露孔以形成多个开口。 进行各向异性蚀刻操作以增加这些开口的宽度。 最后,在第一介电层上形成第二电介质层,以完全填充开口。