专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07816710B2 Packaging for an interferometric modulator with a curved back plate 有权
标题翻译：具有弯曲背板的干涉式调制器的封装
公开(公告)号：US07816710B2
公开(公告)日：2010-10-19
申请号：US12019590
申请日：2008-01-24
申请人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
发明人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
IPC分类号： H01L29/80
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译：封装由具有干涉式调制器和背板的透明基板制成。非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。背板包括相对于基板的弯曲部分。弯曲部分基本上遍及后板。背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

2. 发明授权

US07443563B2 Packaging for an interferometric modulator 有权
标题翻译：用于干涉式调制器的包装
公开(公告)号：US07443563B2
公开(公告)日：2008-10-28
申请号：US11653088
申请日：2007-01-12
申请人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
发明人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
IPC分类号： G02F1/03
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译：封装由具有干涉式调制器和背板的透明基板制成。非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。设置背板，并将干燥剂施加到背板上。背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

3. 发明授权

US08853747B2 Method of making an electronic device with a curved backplate 有权
标题翻译：制造具有弯曲背板的电子设备的方法
公开(公告)号：US08853747B2
公开(公告)日：2014-10-07
申请号：US12904825
申请日：2010-10-14
申请人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
发明人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
IPC分类号： H01L29/80 , G02B26/00
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译：封装由具有干涉式调制器和背板的透明基板制成。非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。背板包括相对于基板的弯曲部分。弯曲部分基本上遍及后板。背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

4. 发明申请

US20080164544A1 PACKAGING FOR AN INTERFEROMETRIC MODULATOR WITH A CURVED BACK PLATE 有权
标题翻译：具有弯曲背板的干涉式调制器的包装
公开(公告)号：US20080164544A1
公开(公告)日：2008-07-10
申请号：US12019590
申请日：2008-01-24
申请人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
发明人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译：封装由具有干涉式调制器和背板的透明基板制成。非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。背板包括相对于基板的弯曲部分。弯曲部分基本上遍及后板。背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

5. 发明申请

US20110053304A1 METHOD OF MAKING AN ELECTRONIC DEVICE WITH A CURVED BACKPLATE 有权
标题翻译：制造具有弯曲背板的电子设备的方法
公开(公告)号：US20110053304A1
公开(公告)日：2011-03-03
申请号：US12904825
申请日：2010-10-14
申请人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
发明人： Lauren Palmateer , Brian J. Gally , William J. Cummings , Manish Kothari , Clarence Chui
IPC分类号： H01L21/00
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译：封装由具有干涉式调制器和背板的透明基板制成。非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。背板包括相对于基板的弯曲部分。弯曲部分基本上遍及后板。背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

6. 发明授权

US08244092B2 System and method of testing humidity in a sealed MEMS device 失效
标题翻译：在密封的MEMS器件中测试湿度的系统和方法
公开(公告)号：US08244092B2
公开(公告)日：2012-08-14
申请号：US12577016
申请日：2009-10-09
申请人： Brian J. Gally , Lauren Palmateer , Manish Kothari , William J. Cummings
发明人： Brian J. Gally , Lauren Palmateer , Manish Kothari , William J. Cummings
IPC分类号： G02B6/00
CPC分类号： B81C99/0045 , G01M3/002 , G01M3/02 , G01M3/186 , G01M3/229 , G02B26/001 , Y10T29/49002
摘要： One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.
摘要翻译：一个实施例提供了一种测试湿度的方法，包括：i）确定包围多个干涉式调制器的设备的属性，以及ii）至少部分地基于以下方式确定设备内的相对湿度值或相对湿度的程度所确定的性质，其中所确定的性质包括i）所述装置的密封件的厚度和宽度以及ii）所述装置的部件的粘合剂渗透性中的至少一种。在一个实施例中，确定的属性还包括以下至少一个：i）设备内部的温度 - 湿度组合，ii）设备内部的干燥剂容量，以及iii）设备尺寸。

7. 发明授权

US07623752B2 System and method of testing humidity in a sealed MEMS device 失效
标题翻译：在密封的MEMS器件中测试湿度的系统和方法
公开(公告)号：US07623752B2
公开(公告)日：2009-11-24
申请号：US12021196
申请日：2008-01-28
申请人： Brian J. Gally , Lauren Palmateer , Manish Kothari , William J. Cummings
发明人： Brian J. Gally , Lauren Palmateer , Manish Kothari , William J. Cummings
IPC分类号： G02B6/00
CPC分类号： B81C99/0045 , G01M3/002 , G01M3/02 , G01M3/186 , G01M3/229 , G02B26/001 , Y10T29/49002
摘要： One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.
摘要翻译：一个实施例提供了一种测试湿度的方法，包括：i）确定包围多个干涉式调制器的设备的属性，以及ii）至少部分地基于以下方式确定设备内的相对湿度值或相对湿度的程度所确定的性质，其中所确定的性质包括i）所述装置的密封件的厚度和宽度以及ii）所述装置的部件的粘合剂渗透性中的至少一种。在一个实施例中，确定的属性还包括以下至少一个：i）设备内部的温度 - 湿度组合，ii）设备内部的干燥剂容量，以及iii）设备尺寸。

8. 发明申请

US20100024523A1 SYSTEM AND METHOD OF TESTING HUMIDITY IN A SEALED MEMS DEVICE 失效
标题翻译：密封MEMS器件测试湿度的系统和方法
公开(公告)号：US20100024523A1
公开(公告)日：2010-02-04
申请号：US12577016
申请日：2009-10-09
申请人： Brian J. Gally , Lauren Palmateer , Manish Kothari , William J. Cummings
发明人： Brian J. Gally , Lauren Palmateer , Manish Kothari , William J. Cummings
IPC分类号： G01B9/02 , G01N5/02
CPC分类号： B81C99/0045 , G01M3/002 , G01M3/02 , G01M3/186 , G01M3/229 , G02B26/001 , Y10T29/49002
摘要： One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.
摘要翻译：一个实施例提供了一种测试湿度的方法，包括：i）确定包围多个干涉式调制器的设备的属性，以及ii）至少部分地基于以下方式确定设备内的相对湿度值或相对湿度的程度所确定的性质，其中所确定的性质包括i）所述装置的密封件的厚度和宽度以及ii）所述装置的部件的粘合剂渗透性中的至少一种。在一个实施例中，确定的属性还包括以下至少一个：i）设备内部的温度 - 湿度组合，ii）设备内部的干燥剂容量，以及iii）设备尺寸。

9. 发明授权

US07570865B2 System and method of testing humidity in a sealed MEMS device 失效
标题翻译：在密封的MEMS器件中测试湿度的系统和方法
公开(公告)号：US07570865B2
公开(公告)日：2009-08-04
申请号：US12021218
申请日：2008-01-28
申请人： Brian J. Gally , Lauren Palmateer , Manish Kothari , William J. Cummings
发明人： Brian J. Gally , Lauren Palmateer , Manish Kothari , William J. Cummings
IPC分类号： G02B6/00
CPC分类号： B81C99/0045 , G01M3/002 , G01M3/02 , G01M3/186 , G01M3/229 , G02B26/001 , Y10T29/49002
摘要： One embodiment provides a method of testing humidity. The method includes measuring i) a first weight of a first device which encloses a plurality of interferometric modulators and ii) a second weight of a second device which encloses a plurality of interferometric modulators, wherein the first and second devices contain a different amount of water vapor. The method further includes comparing the weights of the first and second devices and determining a relative humidity value or a degree of the relative humidity inside one of the two devices based at least in part upon the weight comparison. In one embodiment, the relative humidity value or degree is determined considering at least one of the following parameters: i) temperature-humidity combination inside at least one of the devices, ii) the thickness and width of a seal of the at least one device, iii) adhesive permeability of a component of the at least one device, iv) a desiccant capacity inside the at least one device and v) a device size.
摘要翻译：一个实施例提供了测试湿度的方法。该方法包括测量i）包围多个干涉式调制器的第一装置的第一权重和ii）封闭多个干涉式调制器的第二装置的第二权重，其中第一和第二装置含有不同量的水汽。该方法还包括比较第一和第二装置的重量，并且至少部分地基于重量比较来确定两个装置之一内的相对湿度值或相对湿度的程度。在一个实施例中，考虑以下参数中的至少一个来确定相对湿度值或度数：i）至少一个装置内的温度 - 湿度组合，ii）至少一个装置的密封件的厚度和宽度，iii）所述至少一个装置的部件的粘合剂渗透性，iv）所述至少一个装置内的干燥剂容量，以及v）装置尺寸。

10. 发明授权

US07343080B2 System and method of testing humidity in a sealed MEMS device 失效
标题翻译：在密封的MEMS器件中测试湿度的系统和方法
公开(公告)号：US07343080B2
公开(公告)日：2008-03-11
申请号：US11173822
申请日：2005-07-01
申请人： Brian J. Gally , Lauren Palmateer , Manish Kothari , William J. Cummings
发明人： Brian J. Gally , Lauren Palmateer , Manish Kothari , William J. Cummings
IPC分类号： G02B6/00
CPC分类号： B81C99/0045 , G01M3/002 , G01M3/02 , G01M3/186 , G01M3/229 , G02B26/001 , Y10T29/49002
摘要： One embodiment provides a method of testing humidity, comprising: determining a property of a device which encloses a plurality of interferometric modulators; and determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property. In one embodiment, the property of the device includes one of the following: i) a weight of the device, ii) a color change of a desiccant enclosed in the device, iii) a resistance inside the device, iv) whether frost formed in an inside area of the device which is contacted by a cold finger device, v) whether a desiccant enclosed in the device, when water vapor is provided into the device, is working properly, and vi) combination of at lest two of i)-v).
摘要翻译：一个实施例提供一种测试湿度的方法，包括：确定包围多个干涉式调制器的装置的属性; 以及至少部分地基于所确定的属性来确定所述装置内的相对湿度值或相对湿度的程度。在一个实施例中，设备的特性包括以下之一：i）设备的重量，ii）封装在设备中的干燥剂的颜色变化，iii）设备内部的电阻，iv）是否形成设备的内部区域，其由冷指装置接触，v）当在设备中提供水蒸气时，包封在设备中的干燥剂是否正常工作，以及vi）至少两个组合，i） - v）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式