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    • 9. 发明申请
    • EPOXY RESIN COMPOSITIONS AND PROCESS FOR PREPARING THEM
    • 环氧树脂组合物及其制备方法
    • US20100105856A1
    • 2010-04-29
    • US12518175
    • 2007-11-30
    • Michael HenningsenLars Wittenbecher
    • Michael HenningsenLars Wittenbecher
    • C08G59/02
    • C07D301/28C07D303/28C08G59/24
    • The preparation of epoxy resin compositions which comprise glycidyl ethers comprising cyclohexyl groups and have a low oligomer content is carried out by distillation of compositions which are obtainable by ring hydrogenation of compounds of the general formula (I) where -X- is —CR2—, —CO—, —O, —S—, —SO2—, the radicals R are each, independently of one another, H, C1-6-alkyl, C3-6-cycloalkyl, in which one or more H atoms can be replaced by halogen, the radicals R′ are each, independently of one another, C1-4-alkyl, halogen, the indices n are each, independently of one another, 0, 1, 2 or 3, and subsequent reaction of the hydroxyl groups with epichlorohydrin, in thin film evaporators or short path evaporators at a temperature in the range from 150 to 270° C. and a pressure in the range from 0.001 to 1 mbar.
    • 包含环己基并且具有低低聚物含量的缩水甘油醚的环氧树脂组合物的制备通过蒸馏可通过环化氢化通式(I)的化合物获得的组合物进行,其中-X-为-CR 2 - -CO - , - O - , - S - , - SO 2 - ,基团R各自独立地为氢,C 1-6 - 烷基,C 3-6 - 环烷基,其中一个或多个H原子可以被替换 通过卤素,基团R'各自独立地为C 1-4 - 烷基,卤素,指数n各自彼此独立地为0,1,2或3,随后羟基与 表氯醇,薄膜蒸发器或短程蒸发器,温度范围为150至270℃,压力范围为0.001至1毫巴。