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    • 2. 发明授权
    • Methods for verifying gas flow rates from a gas supply system into a plasma processing chamber
    • 用于验证从气体供应系统到等离子体处理室的气体流速的方法
    • US09234775B2
    • 2016-01-12
    • US14045412
    • 2013-10-03
    • Lam Research Corporation
    • Dean J. LarsonRobert C. HeftyJames V. TietzWilliam S. KennedyEric H. LenzWilliam M. Denty, Jr.Enrico Magni
    • G01L1/00G01F1/42G01F1/36G01F25/00G05D7/06
    • G01F1/42G01F1/36G01F25/0007G05D7/0652
    • Methods of measuring gas flow rates in a gas supply system for supplying gas to a plasma processing chamber are provided. In a differential flow method, a flow controller is operated at different set flow rates, and upstream orifice pressures are measured for the set flow rates at ambient conditions. The measured orifice pressures are referenced to a secondary flow verification method that generates corresponding actual gas flow rates for the different set flow rates. The upstream orifice pressures can be used as a differential comparison for subsequent orifice pressure measurements taken at any temperature condition of the chamber. In an absolute flow method, some parameters of a selected gas and orifice are predetermined, and other parameters of the gas are measured while the gas is being flowed from a flow controller at a set flow rate through an orifice. In this method, any flow controller set point can be flowed at any time and at any chamber condition, such as during plasma processing operations. Gas supply systems are also disclosed.
    • 提供了在向等离子体处理室供应气体的气体供给系统中测量气体流量的方法。 在差分流动方法中,流量控制器以不同的设定流量运行,并且在环境条件下测量设定流量的上游孔口压力。 测量的孔口压力参考二次流量验证方法,该方法为不同的设定流量产生相应的实际气体流速。 上游孔压力可以用作在室的任何温度条件下进行的随后的孔口压力测量的差分比较。 在绝对流动方法中,预定了所选择的气体和孔口的一些参数,并且在气体以流量控制器以设定流量通过孔口流动时,测量气体的其它参数。 在该方法中,任何流量控制器设定点可以在任何时间和任何室条件下流动,例如在等离子体处理操作期间。 还公开了供气系统。