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    • 2. 发明授权
    • Alignment mark shielding ring without arcing defect and method for using
    • 对准标记屏蔽环没有电弧缺陷和使用方法
    • US06676812B2
    • 2004-01-13
    • US10143623
    • 2002-05-09
    • Chen-Fang Chung
    • Chen-Fang Chung
    • C23C1434
    • H01L21/68721H01J37/32477
    • An alignment mark shielding ring for use in a physical vapor deposition chamber and a method for using the ring to avoid arcing problems on the wafer. The alignment mark shielding ring can be constructed of a ring that has a generally L-shaped cross-section, at least one hood portion to function as the shield for the alignment mark, at least one alignment pin for engaging at least one alignment sleeve mounted in a lower chamber shield for holding the alignment mark shielding ring in place. The alignment sleeve is constructed in two halves, each having an aperture therethrough. The aperture in the top half is larger than the aperture in the bottom half such that even when the apertures are coated with a metal layer deposited in the PVD process, the alignment pin does not electrically short to the lower chamber shield and thus, any possibility of arcing is avoided.
    • 用于物理气相沉积室的对准标记屏蔽环以及使用该环以避免晶片上的电弧问题的方法。 对准标记屏蔽环可以由具有大致L形横截面的环构成,至少一个罩部分用作对准标记的屏蔽件,至少一个对准销用于接合至少一个对准套筒安装 在用于将对准标记屏蔽环保持在适当位置的下室屏蔽件中。 对准套筒构造成两半,每个具有穿过其中的孔。 上半部分的孔径大于下半部分中的孔径,使得即使当在PVD工艺中沉积的金属层涂覆孔时,对准销不会与下室屏蔽件电短路,因此,任何可能性 的电弧避免。
    • 3. 发明授权
    • Multiple chamber vacuum processing system configuration for improving the stability of mark shielding process
    • 多室真空处理系统配置,提高标记屏蔽过程的稳定性
    • US06328815B1
    • 2001-12-11
    • US09253292
    • 1999-02-19
    • Shwangming JengChen-Fang Chung
    • Shwangming JengChen-Fang Chung
    • B08B102
    • H01L21/67167H01L21/67184H01L21/67745Y10S134/902Y10S438/908
    • A new configuration of a basic concatenatable integrated modular multiple chamber vacuum processing system for wafer manufacturing vacuum processes is disclosed. The basic system includes at least one multiple ported transfer vacuum chamber, an R-&thgr; transfer means contained within each chamber, a multiplicity of ports adaptable for appending a variety of vacuum process chambers as well as forming entrance/exit ports with at least one dual port pass through chamber attached to one entrance/exit port. Each pass through chamber contains a wafer alignment and/or orientation means for aligning or orienting the wafer as necessary in any of the appended process chambers. The configuration minimizes alignment or orientation errors due to inherent instability of the concatenated transfer means operations.
    • 公开了一种用于晶片制造真空工艺的基本可连接的集成模块化多室真空处理系统的新配置。 基本系统包括至少一个多端口转移真空室,每个室内包含的R-θ转移装置,适用于附加各种真空处理室的多个端口,以及形成具有至少一个双重端口的入口/出口端口 港口通过一个入口/出口连接室。 每个通过室包含用于在任何附加的处理室中根据需要对准或定向晶片的晶片对准和/或取向装置。 由于连接的传送装置操作的固有不稳定性,该配置使对准或取向误差最小化。