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1. 发明申请

WO2008109813A2 SEALED LIGHT EMITTING DIODE ASSEMBLIES AND METHODS OF MAKING SAME 审中-公开
标题翻译：密封发光二极管组件及其制造方法
公开(公告)号：WO2008109813A2
公开(公告)日：2008-09-12
申请号：PCT/US2008/056193
申请日：2008-03-07
申请人： LUMINATION, LLC , NALL, Jeffrey , SAHA, Babi, Koushik , WANG, Bill, Xin
发明人： NALL, Jeffrey , SAHA, Babi, Koushik , WANG, Bill, Xin
IPC分类号： H01J40/14
CPC分类号： H05K3/284 , F21K9/00 , F21V31/005 , F21V31/04 , F21Y2115/10 , H05K2201/0989 , H05K2201/10106 , H05K2201/2018 , H05K2203/1316
摘要： An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device.
摘要翻译：光电子器件组件包括电路板和布置在电路板上并与电路板电连接的光电子器件。环形垫圈设置在电路板上并围绕光电子器件。密封剂布置在电路板的至少一部分上并且密封该电路板的至少一部分，并且还至少覆盖环形垫圈的外部环形部分。密封剂没有布置在光电子器件上。在一种方法中，光电子器件设置在电路板上，所述设置包括将光电子器件与电路板电连接。环形垫圈设置在电路板上以围绕光电子器件。电路板用密封剂密封，该密封剂也覆盖至少环形垫圈的外部环形部分，但不覆盖光电子器件。

2. 发明公开

EP2135273A2 SEALED LIGHT EMITTING DIODE ASSEMBLIES AND METHODS OF MAKING SAME 无效转让
标题翻译： VERFAEGELTE LED-BAUGRUPPEN UND VERFAHREN ZU IHRER HERSTELLUNG
公开(公告)号：EP2135273A2
公开(公告)日：2009-12-23
申请号：EP08743723.2
申请日：2008-03-07
申请人： Lumination, LLC
发明人： NALL, Jeffrey , SAHA, Babi, Koushik , WANG, Bill, Xin
IPC分类号： H01J40/14
CPC分类号： H05K3/284 , F21K9/00 , F21V31/005 , F21V31/04 , F21Y2115/10 , H05K2201/0989 , H05K2201/10106 , H05K2201/2018 , H05K2203/1316
摘要： An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device.
摘要翻译：光电子器件组件包括电路板和设置在电路板上并与电路板电连接的光电器件。环形垫圈设置在电路板上并围绕光电器件。密封剂设置在电路板的至少一部分上并且密封电路板的至少一部分外环形部分。密封剂未设置在光电子器件上。在一种方法中，光电子器件设置在电路板上，所述布置包括将光电器件与电路板电连接。环形垫圈设置在电路板上以围绕光电器件。电路板用密封剂密封，该密封剂还覆盖环形垫片的至少外环形部分，但不覆盖光电子器件。

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