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1. 发明申请

WO2010137899A2 LEADFRAME AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译： LEADFRAME及其制造方法
公开(公告)号：WO2010137899A2
公开(公告)日：2010-12-02
申请号：PCT/KR2010003384
申请日：2010-05-27
申请人： LG INNOTEK CO LTD , EOM SAI RAN , LEE HYUNG EUI , PARK CHUNG SIK , CHUN HYUN A , YOON HYE SUN
发明人： EOM SAI RAN , LEE HYUNG EUI , PARK CHUNG SIK , CHUN HYUN A , YOON HYE SUN
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49861 , H01L21/4832 , H01L23/49548 , H01L23/49582 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49 , H01L2224/85411 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/85471 , H01L2224/85871 , H01L2924/00014 , H01L2924/01005 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/3025 , H01L2224/45099 , H01L2924/00012
摘要： Disclosed is a leadframe. The leadframe comprises a die pad part, at least one lead part, and at least one supporting part. A semiconductor chip is mounted on a first surface of the leadframe at the die pad. The at least one lead part electrically connects the semiconductor chip to at least one external circuit. The at least one supporting part is adjacent to a second surface opposited the first surface, includes an insulating material, and insulates the at least one lead part from each other.
摘要翻译：披露的是引线框架。引线框架包括芯片焊盘部分，至少一个引线部分和至少一个支撑部分。半导体芯片安装在引线框架的芯片焊盘的第一表面上。至少一个引线部分将半导体芯片电连接到至少一个外部电路。所述至少一个支撑部分邻近与所述第一表面相对的第二表面，包括绝缘材料并使所述至少一个引线部分彼此绝缘。

2. 发明申请

WO2012005435A9 MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE MANUFACTURED USING THE SAME 审中-公开
标题翻译：使用其制造的芯片封装和芯片封装的制造方法
公开(公告)号：WO2012005435A9
公开(公告)日：2012-02-16
申请号：PCT/KR2011002628
申请日：2011-04-13
申请人： LG INNOTEK CO LTD , LEE HYUNG EUI , PARK CHUNG SIK , CHUN HYUN A , EOM SAI RAN
发明人： LEE HYUNG EUI , PARK CHUNG SIK , CHUN HYUN A , EOM SAI RAN
IPC分类号： H01L23/48 , H01L23/043
CPC分类号： H01L21/4832 , H01L23/49548 , H01L23/49582 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/83 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/01014 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15156 , H01L2924/157 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to a manufacturing method of a chip package, the method comprising: forming first leads and second leads, both having conductivity, on the top and bottom surfaces of a metal substrate; half-etching the top surface of the metal substrate to form a lead portion under the first leads and to form a die pad portion whose bottom is connected to the lead portion; attaching a chip onto the die pad portion and electrically connecting the chip and the first leads by a connector; forming an insulative molding portion on the metal substrate to bury the chip and the connector; and etching the bottom of the metal substrate to short-circuit the lead portion and the die pad portion, and a chip package manufactured using the same. Accordingly, the distance between a chip and first leads can be reduced by forming a conventional bump-shaped I/O pad in a lead shape, thus lead to cost reduction. Moreover, a large number of signal transmission systems can be reliably realized in a micro-pattern due to the lead shape. Moreover, the stability of the product can be improved by treating the thickness of the lead portion in the final step of the process.
摘要翻译：本发明涉及一种芯片封装的制造方法，该方法包括：在金属基板的顶表面和底表面上形成具有导电性的第一引线和第二引线; 半蚀刻金属基板的顶表面，以在第一引线下方形成引线部分并形成其底部连接到引线部分的芯片焊盘部分; 将芯片附接到芯片焊盘部分上并通过连接器电连接芯片和第一引线; 在所述金属基板上形成绝缘成型部，以埋设所述芯片和所述连接器; 并且蚀刻金属基板的底部以使引线部分和芯片焊盘部分短路，以及使用其形成的芯片封装。因此，可以通过形成引线形状的传统的凸起形状的I / O焊盘来减小芯片与第一引线之间的距离，从而降低成本。此外，由于引线形状，可以以微图案可靠地实现大量的信号传输系统。此外，通过在该方法的最后步骤中处理引线部分的厚度可以提高产品的稳定性。

3. 发明申请

WO2011059205A2 LEAD FRAME AND MANUFACTURING METHOD OF THE SAME 审中-公开
标题翻译：铅框架及其制造方法
公开(公告)号：WO2011059205A2
公开(公告)日：2011-05-19
申请号：PCT/KR2010007783
申请日：2010-11-05
申请人： LG INNOTEK CO LTD , EOM SAI RAN , CHUN HYUN A , PARK CHUNG SIK , LEE HYUNG EUI
发明人： EOM SAI RAN , CHUN HYUN A , PARK CHUNG SIK , LEE HYUNG EUI
CPC分类号： H01L23/49861 , H01L21/486 , H01L23/3121 , H01L24/48 , H01L24/49 , H01L2224/48011 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： An aspect of the present invention provides a lead frame, comprising lead portions each composed of a vertical portion and a horizontal portion, a die pad portion disconnected from the lead portions by support portions made of an insulating material, inner leads disposed to neighbor the die pad portion and formed on a top surface of the horizontal portions of the lead portions, and outer leads formed on a bottom surface of the vertical portions of the lead portions. In accordance with the present invention, a lead frame having a reduced wire length due to a fine circuit pattern, enabling flipchip bonding due to routability, and improving adhesive strength upon soldering due to a swell structure can be fabricated. Further, a warpage phenomenon in a manufacturing process can be prevented.
摘要翻译：本发明的一个方面提供了一种引线框架，其包括由垂直部分和水平部分构成的引线部分，通过由绝缘材料制成的支撑部分与引线部分断开的管芯焊盘部分，设置成邻近管芯的内部引线并且形成在引线部分的水平部分的顶表面上，以及形成在引线部分的垂直部分的底表面上的外引线。根据本发明，可以制造由于精细电路图形而具有减少的线长的引线框架，由于可布线性而实现倒装芯片接合，并且可以提高由于膨胀结构而导致的焊接时的粘合强度。此外，可以防止制造过程中的翘曲现象。

4. 发明申请

WO2011055984A2 LEADFRAME AND METHOD OF MANUFACURING THE SAME 审中-公开
标题翻译： LEADFRAME及其制造方法
公开(公告)号：WO2011055984A2
公开(公告)日：2011-05-12
申请号：PCT/KR2010007730
申请日：2010-11-04
申请人： LG INNOTEK CO LTD , CHUN HYUN A , PARK CHUNG SIK , EOM SAI RAN , LEE HYUNG EUI
发明人： CHUN HYUN A , PARK CHUNG SIK , EOM SAI RAN , LEE HYUNG EUI
IPC分类号： H01L23/495 , H01L23/498
CPC分类号： H01L21/4828 , H01L23/495 , H01L23/49558 , H01L24/48 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a leadframe and a method for manufacturing the same. The leadframe includes a lead unit having vertical and horizontal parts, a die pad unit separated from the lead unit by an support unit formed of insulating material, an inner lead formed adjacent to the die pad unit and on the horizontal part of the lead unit, and an outer lead formed on a bottom surface of the vertical part of the lead unit. Such a structure of the leadframe shortens a wire length, allows flip chip bonding, and improves soldering adhesive. The structure of the leadframe enhances physical strength thereof by enhancing a support force of an insulator. Moreover, the leadframe includes a fine plating pattern having a small plating deviation and a superior structure, and has excellent durability and improved thermal conduction by entirely plating surfaces of the die pad.
摘要翻译：引线框架及其制造方法技术领域本发明涉及一种引线框架及其制造方法。引线框架包括具有垂直和水平部分的引线单元，通过由绝缘材料形成的支撑单元与引线单元分离的管芯焊盘单元，邻近管芯焊盘单元和引线单元的水平部分形成的内部引线，以及形成在引线单元的垂直部分的底表面上的外部引线。引线框架的这种结构缩短了导线长度，允许倒装芯片结合，并改善了焊接粘合剂。引线框架的结构通过增强绝缘体的支撑力来提高其物理强度。此外，引线框架包括具有小电镀偏差和优良结构的精细电镀图案，并且通过整个电镀芯片焊盘的表面而具有优异的耐久性和改善的热传导。

5. 发明申请

WO2012150777A3 THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：WO2012150777A3
公开(公告)日：2013-03-21
申请号：PCT/KR2012003236
申请日：2012-04-26
申请人： LG INNOTEK CO LTD , PARK CHUNG SIK , KIM DUK NAM , AHN JAE HYUN
发明人： PARK CHUNG SIK , KIM DUK NAM , AHN JAE HYUN
IPC分类号： H05K3/46 , H05K1/18
CPC分类号： H05K3/388 , H01L21/4857 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L2224/48227 , H05K1/0201 , H05K1/0206 , H05K3/4038 , H05K2201/096 , H05K2201/09854 , H05K2203/0369
摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a first insulating layer, a second insulating layer on the first insulating layer, and at least one via formed through the first and second insulating layers and having a layer structure. The via includes a first via layer formed through the first insulating layer, a second via layer formed on the first via layer while passing through the second insulating layer, and an adhesive layer between the first and second via layers. The first via layer has a section different from a section of the second via layer.
摘要翻译：公开了一种印刷电路板及其制造方法。印刷电路板包括第一绝缘层，第一绝缘层上的第二绝缘层，以及通过第一和第二绝缘层形成并具有层结构的至少一个通孔。通孔包括通过第一绝缘层形成的第一通孔层，在穿过第二绝缘层时形成在第一通孔层上的第二通孔层，以及在第一和第二通孔层之间的粘合剂层。第一通孔层具有与第二通孔层的一部分不同的部分。

6. 发明公开

KR20120016968A Leadframe and method for manufacturing the same 有权
标题翻译： LEADFRAME及其制造方法
公开(公告)号：KR20120016968A
公开(公告)日：2012-02-27
申请号：KR20100079536
申请日：2010-08-17
申请人： LG INNOTEK CO LTD
发明人： PARK CHUNG SIK , LEE HYUNG EUI , CHUN HYUN A , EOM SAI RAN
IPC分类号： H01L23/495
CPC分类号： H01L2224/45139 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE: A lead frame and a manufacturing method thereof are provided to improve processing efficiency by forming 2 lead frames at the same time. CONSTITUTION: A semiconductor chip is mounted on the first surface of a die-pad part. A plurality of lead parts(100) electrically interlinks the semiconductor chip to an external circuit. A plurality of lead parts is extended from the first surface to a second surface which is opposed to the first surface. A plurality of lead parts is separated each other. An insulating layer(140) is formed on the first surface and insulates between the lead parts and between the lead part and the die-pad part. A supporting part(110) is formed on the second surface and includes insulating materials and insulates between the lead parts.
摘要翻译：目的：提供引线框及其制造方法，以通过同时形成2个引线框来提高加工效率。构成：半导体芯片安装在芯片部分的第一表面上。多个引线部分（100）将半导体芯片电连接到外部电路。多个引线部分从第一表面延伸到与第一表面相对的第二表面。多个引线部分彼此分离。绝缘层（140）形成在第一表面上并且在引线部分之间以及引线部分和芯片焊盘部分之间绝缘。支撑部分（110）形成在第二表面上并且包括绝缘材料并且在引线部分之间绝缘。

7. 发明公开

KR20120003125A Leadframe and method of manufacturig same 有权
标题翻译： LEADFRAME和制造方法
公开(公告)号：KR20120003125A
公开(公告)日：2012-01-10
申请号：KR20100063798
申请日：2010-07-02
申请人： LG INNOTEK CO LTD
发明人： PARK CHUNG SIK , LEE HYUNG EUI , CHUN HYUN A , EOM SAI RAN
IPC分类号： H01L23/495 , H01L23/52
CPC分类号： H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE: A lead frame and a manufacturing method thereof are provided to improve adhesion between a completed package and a PCB by thickening the lower thickness of a bump than the upper thickness of the bump. CONSTITUTION: A bump is formed on the side of an insulation unit. A first metal unit(195b) is formed on the bump. A lead unit(165a) is formed on the insulation unit and is connected to the first metal unit. An inner lead(180a) is plated on the upper side of the lead unit which is adjacent to a die pad unit. An outer lead(180b) is formed on the lower side of the bump.
摘要翻译：目的：提供一种引线框架及其制造方法，通过增加突起的厚度比凸起的较高厚度来增加完成的封装和PCB之间的粘合。构成：在绝缘单元的侧面形成凸点。第一金属单元（195b）形成在凸块上。引线单元（165a）形成在绝缘单元上并连接到第一金属单元。内引线（180a）被电镀在与引线单元相邻的引线单元的上侧。在凸块的下侧形成有外引线（180b）。

8. 发明授权

KR102191570B1 퍼즐 조립 기반 증강현실 서비스 제공 시스템 有权
公开(公告)号：KR102191570B1
公开(公告)日：2020-12-15
申请号：KR20190077849
申请日：2019-06-28
申请人： PARK CHUNG SIK
发明人： PARK CHUNG SIK
IPC分类号： G06Q50/10 , A63F9/08 , G06Q50/20 , G06T19/00
摘要： 본발명은퍼즐조립기반증강현실서비스제공시스템에관한것이다. 보다상세하게는본 발명에의하면, 퍼즐조각들을이용하여만든퍼즐결과물을통해증강현실로결과물을확인함으로써, 학습능력을배가하며학습자의호기심을증대시키고, 지속적인흥미를증진시킬수 있고, 이벤트선택출력모듈을구비함으로써, 하나의퍼즐이미지로피사체의다양한동적영상을선택적으로선택하고, 증강현실로그 결과물을확인할수 있어퍼즐이미지주제와관련된다양한증강현실컨텐츠로사용자가선택하여습득할수 있어, 증강현실을기반으로한교육용컨텐츠의다양화에기여하는퍼즐조립기반증강현실서비스제공시스템에관한것이다. 이를위해, 본발명은퍼즐판에맞춰지거나상호끼워맞춤되어특정밑그림을형성하도록하고, 정적인퍼즐이미지에특정피사체의동적인영상으로발현되어입체적콘텐츠로출력될수 있도록하는다수의퍼즐; 맞춰진퍼즐로형성된특정밑그림과무선통신으로연동되고, 퍼즐과소정간격을두고인식시키면, 퍼즐내 정적인이미지가동적인영상으로발현되어입체적콘텐츠로화면에출력하는스마트기기; 및스마트기기로특정퍼즐이인식되었을때 인식된퍼즐의완성도를산출하고, 퍼즐내 정적인이미지와연계된특정피사체의동적인이벤트가저장되어이를스마트기기로제공하는서버를포함할수 있다.

9. 发明公开

EP2705736A4 THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME 有权转让
标题翻译： FITTED光学梯板及其制造方法
公开(公告)号：EP2705736A4
公开(公告)日：2014-11-26
申请号：EP12780038
申请日：2012-04-26
申请人： LG INNOTEK CO LTD
发明人： PARK CHUNG SIK , KIM DUK NAM , AHN JAE HYUN
IPC分类号： H05K3/46 , H05K1/18
CPC分类号： H05K3/388 , H01L21/4857 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L2224/48227 , H05K1/0201 , H05K1/0206 , H05K3/4038 , H05K2201/096 , H05K2201/09854 , H05K2203/0369
摘要： A printed circuit board includes a first insulating layer, a second insulating layer on the first insulating layer, and at least one via formed through the first and second insulating layers in a layered structure. The via includes a first via layer formed through the first insulating layer, a second via layer formed on the first via layer while passing through the second insulating layer, and an adhesive layer between the first and second via layers. The first via layer has a section different from a section of the second via layer. The adhesive property between the copper layer and the insulating layer is improved. The vias used to connect interlayer circuits to each other are formed between a plurality of insulating layers through an etching process instead of a laser process or a polishing process, thereby improving the process ability and reducing the manufacturing cost.

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