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1. 发明申请

US20030174468A1 Cooling system for integrated circuit chip 失效
标题翻译：集成电路芯片冷却系统
公开(公告)号：US20030174468A1
公开(公告)日：2003-09-18
申请号：US10183375
申请日：2002-06-28
申请人： LG Electronics Inc.
发明人： Jung-Sik Park , Eon-Pyo Hong , Yong-Dol Park , Dong-Koo Shin , Jin-Young Jung , Hyeong-Kook Lee
IPC分类号： H05K007/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： In a cooling system for an integrated circuit chip, by including an evaporator contacted-combined with an integrated circuit chip installed onto a board and absorbing heat generated at the integrated circuit chip; a compressor connected to the evaporator by a first connection pipe; a condenser connected to the compressor by a second connection pipe; an expansion means connected to the condenser by a third connection pipe and simultaneously connected to the evaporator by a fourth connection pipe; and a mounting board installed onto the board by a board combining means and mounted with the compressor, the condenser and the expansion means, it is possible to perform the operation of the integrated circuit chip smoothly, and accordingly a reliability of a product can be improved. In addition, although an integrated circuit chip is getting even more integrated, cooling of the integrated circuit chip can be efficiently performed.
摘要翻译：在用于集成电路芯片的冷却系统中，通过包括与安装在板上的集成电路芯片接触并吸收集成电路芯片产生的热量的蒸发器; 通过第一连接管连接到蒸发器的压缩机; 通过第二连接管连接到压缩机的冷凝器; 膨胀装置，通过第三连接管连接到冷凝器，并通过第四连接管同时连接到蒸发器; 以及通过板组合装置安装在板上的安装板，并与压缩机，冷凝器和膨胀装置一起安装，可以平滑地执行集成电路芯片的操作，从而可以提高产品的可靠性。此外，虽然集成电路芯片越来越集成，但是可以有效地执行集成电路芯片的冷却。

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