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1. 发明申请

WO2006135130A1 LIGHT EMITTING DIODE DEVICE USING ELECTRICALLY CONDUCTIVE INTERCONNECTION SECTION 审中-公开
标题翻译：使用电导体互连部分的发光二极管器件
公开(公告)号：WO2006135130A1
公开(公告)日：2006-12-21
申请号：PCT/KR2005/002859
申请日：2005-08-30
申请人： LG CHEM, LTD.
发明人： KANG, Jong-Hoon , LEE, Jae-Seung , SHIN, Bu-Gon , HA, Duk-Sik , CHOI, Min-Ho , YU, Min-A
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/24 , H01L24/82 , H01L33/0079 , H01L33/08 , H01L33/508 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12036 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting diode device, a manufacturing method thereof and a light emitting unit using the light emitting diode device. The light emitting diode device includes (a) a light emitting diode section, (b) an electrically conductive pad section being disposed outside the light emitting diode section and being electrically connected to an external power source, and (c) at least one electrically conductive interconnection section for connecting the electrically conductive pad section to one side or both sides of the light emitting diode section. In the light emitting diode device, a wire is connected to the electrically conductive pad section disposed outside the light emitting diode section, and the electrically conductive pad section is connected to one side of the light emitting diode section by means of at least one electrically conductive interconnection section, so that not only it is easy to uniformly coat a fluorescent substance, but also an area covering vertically emitted light can be reduced to enhance a light extraction efficiency of the light emitting diode device.
摘要翻译：公开了一种发光二极管器件及其制造方法以及使用该发光二极管器件的发光单元。发光二极管装置包括（a）发光二极管部分，（b）导电焊盘部分，其布置在发光二极管部分的外部并电连接到外部电源，以及（c）至少一个导电互连部分，用于将导电焊盘部分连接到发光二极管部分的一侧或两侧。在发光二极管装置中，导线连接到布置在发光二极管部分外侧的导电焊盘部分，并且导电焊盘部分通过至少一个导电的部分连接到发光二极管部分的一侧因此不仅容易均匀地涂布荧光物质，而且可以减少覆盖垂直发射光的区域，以提高发光二极管器件的光提取效率。

2. 发明申请

WO2007081120A1 ORGANIC LIGHT EMITTING DEVICE HAVING SURFACE-TREATED BOTTOM ELECTRODE 审中-公开
标题翻译：具有表面处理底层电极的有机发光装置
公开(公告)号：WO2007081120A1
公开(公告)日：2007-07-19
申请号：PCT/KR2007/000095
申请日：2007-01-08
申请人： LG CHEM, LTD. , LEE, Jae-Seung , KIM, Jung-Bum , LEE, Young-Chul
发明人： LEE, Jae-Seung , KIM, Jung-Bum , LEE, Young-Chul
IPC分类号： H05B33/26
CPC分类号： C09K11/06 , H05B33/14
摘要： Disclosed is a method of manufacturing an organic light emitting device, which comprises the steps of successively stacking a bottom electrode, an organic layer including an emission layer, and a top electrode, the method further comprising the step of: surface-treating the bottom electrode with ion beam etching before stacking the organic layer. By effectively removing impurities such as polymer materials or oxidation films, which are formed on the bottom electrode of the organic light emitting device, not only electron injection and hole injection in the organic light emitting device progress smoothly, but also an operation voltage is lowered and performance reliability can ensured because the surface roughness of the bottom electrode is maintained at the same level before and after ion milling.
摘要翻译：公开了一种制造有机发光器件的方法，其包括以下步骤：连续堆叠底电极，包括发射层的有机层和顶电极，所述方法还包括以下步骤：对所述底电极进行表面处理在堆叠有机层之前进行离子束蚀刻。通过有效地除去形成在有机发光器件的底部电极上的诸如聚合物材料或氧化膜的杂质，不仅有机发光器件中的电子注入和空穴注入进行顺利，还降低了操作电压，由于底电极的表面粗糙度在离子研磨前后维持在相同的水平，所以可确保性能的可靠性。

3. 发明申请

WO2008013402A1 METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DEVICE AND ORGANIC LIGHT EMITTING DEVICE MANUFACTURED BY USING THE METHOD 审中-公开
标题翻译：制造有机发光装置的方法和使用该方法制造的有机发光装置
公开(公告)号：WO2008013402A1
公开(公告)日：2008-01-31
申请号：PCT/KR2007/003570
申请日：2007-07-25
申请人： LG CHEM, LTD. , LEE, Jung-Hyoung , LEE, Jae-Seung , KIM, Jung-Bum
发明人： LEE, Jung-Hyoung , LEE, Jae-Seung , KIM, Jung-Bum
IPC分类号： H01L51/50
CPC分类号： H01L51/56 , H01L27/3246 , H01L27/3283 , H01L51/5088 , H01L51/5092
摘要： Disclosed is a method of manufacturing an organic light emitting device, an organic light emitting device manufactured by using the method, and an electronic device including the organic light emitting device. The method includes (a) forming an insulating layer on a lower electrode, (b) etching the insulating layer to form an opening ranging from an upper surface of the insulating layer to the lower electrode so that an overhang structure having a lowermost circumference that is larger than an uppermost circumference is formed, (c) forming a conductive layer on an upper surface of the lower electrode in the opening and a surface of the insulating layer other than the overhang structure, (d) forming an organic material layer on the conductive layer formed on the upper surface of the lower electrode in the opening, and (e) forming an upper electrode on an upper surface of the conductive layer disposed on the upper surface of the insulating layer and an upper surface of the organic material layer.
摘要翻译：公开了一种制造有机发光器件的方法，使用该方法制造的有机发光器件和包括该有机发光器件的电子器件。该方法包括：（a）在下电极上形成绝缘层，（b）蚀刻绝缘层以形成从绝缘层的上表面到下电极的开口，使得具有最小圆周的悬垂结构为（c）在开口中的下电极的上表面和除了突出结构之外的绝缘层的表面上形成导电层，（d）在导电上形成有机材料层并且（e）在设置在绝缘层的上表面上的导电层的上表面和有机材料层的上表面上形成上电极。

4. 发明申请

WO2007011154A1 LIGHT EMITTING DIODE DEVICE HAVING ADVANCED LIGHT EXTRACTION EFFICIENCY AND PREPARATION METHOD THEREOF 审中-公开
标题翻译：具有先进光提取效率的发光二极管装置及其制备方法
公开(公告)号：WO2007011154A1
公开(公告)日：2007-01-25
申请号：PCT/KR2006/002817
申请日：2006-07-19
申请人： LG CHEM, LTD.
发明人： SHIN, Bu-Gon , CHOI, Min-Ho , HA, Duk-Sik , YU, Min-A , KANG, Jong-Hoon , LEE, Jae-Seung , SHIN, Hyun-Woo
IPC分类号： H01L33/00
CPC分类号： H01L33/22 , H01L24/83 , H01L33/0079 , H01L2224/13 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48463 , H01L2224/49107 , H01L2224/73265 , H01L2224/83001 , H01L2224/92247 , H01L2924/12036 , H01L2924/12041 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is an LED device, a method for manufacturing the same, and a light emitting apparatus having the same. The LED device includes (a) a light emitting diode unit and (b) an adjustment layer laminated on a light emitting surface of the light emitting diode unit, a fine pattern having being formed on the adjustment layer by repeating a shape in a light emission direction. The adjustment layer is (i) at least one layer formed by aligning transparency adjustment particles having a shape or (ii) a polymer film layer having a fine pattern imprinted on the polymer film layer so as to adjust transparency. A fine pattern adjustment layer having various shapes and an adjustable size is introduced on the light emitting surface of the LED unit. As a result, the light extraction efficiency of the surface of the LED unit improves together with ease of manufacturing and secured uniformity.
摘要翻译：公开了一种LED器件及其制造方法以及具有该LED器件的发光装置。 LED装置包括（a）发光二极管单元和（b）层叠在发光二极管单元的发光面上的调整层，通过重复发光形状而在调整层上形成微细图案方向。调整层是（i）通过使具有形状的透明调整颗粒对准形成的至少一层，或者（ii）在聚合物膜层上印刷精细图案的聚合物膜层以调节透明度。在LED单元的发光面上引入具有各种形状和可调节尺寸的精细图案调整层。结果，LED单元的表面的光提取效率随着制造的容易性和固定的均匀性而提高。

5. 发明申请

WO2007001144A1 METHOD FOR PREPARING LIGHT EMITTING DIODE DEVICE HAVING HEAT DISSIPATION RATE ENHANCEMENT 审中-公开
标题翻译：用于制备具有加热排放速率增强的发光二极管装置的方法
公开(公告)号：WO2007001144A1
公开(公告)日：2007-01-04
申请号：PCT/KR2006/002478
申请日：2006-06-27
申请人： LG CHEM, LTD.
发明人： LEE, Jae-Seung , CHOI, Min-Ho , SHIN, Bu-Gon , KANG, Jong-Hoon , YU, Min-A , HA, Duk-Sik , KHO, Dong-Han , CHUN, Sang-Ki , CHANG, Suk-Ky , PARK, Soo-Min
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L33/0095 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a method for fabricating a light emitting diode device having a light emitting diode section grown on a sapphire substrate, a boded structure fabricated through the method, a unit chip separated from the bonded structure, and a light emitting diode device having the unit chip. The method includes the steps of (a) bonding the light emitting diode section grown on a first surface of the sapphire substrate to a first surface of a first substrate by means of a first binder; (b) bonding a second surface of the first substrate to a first surface of a second substrate by means of a second binder; (c) removing the second substrate from a bonded structure obtained as a result of step (b) after polishing a second surface of the sapphire substrate; (d) separating the bonded structure into unit chips after the second substrate has been removed from the bonded structure; and (e) bonding the second surface of the polished sapphire substrate provided in each unit chip to a lead frame, and then removing the first substrate. In the manufacture of high-output light emitting diodes, such a method can remarkably improve heat dissipation efficiency by intentionally reducing the thickness of the sapphire substrate.
摘要翻译：公开了一种制造发光二极管器件的方法，该发光二极管器件具有在蓝宝石衬底上生长的发光二极管部分，通过该方法制造的结构结构，与接合结构分离的单元芯片和具有单元芯片的发光二极管器件。该方法包括以下步骤：（a）借助于第一粘结剂将在蓝宝石衬底的第一表面上生长的发光二极管部分与第一衬底的第一表面接合; （b）借助于第二粘合剂将所述第一基板的第二表面接合到第二基板的第一表面; （c）在抛光蓝宝石衬底的第二表面之后，从作为步骤（b）的结果获得的接合结构去除第二衬底; （d）在从接合结构移除第二基板之后将接合结构分离成单元芯片; 和（e）将设置在每个单元芯片中的经抛光的蓝宝石衬底的第二表面接合到引线框架，然后移除第一衬底。在高输出发光二极管的制造中，通过有意地减小蓝宝石衬底的厚度，可以显着提高散热效率。

6. 发明申请

WO2007021149A1 SIDE EMITTING LENS, LIGHT EMITTING DEVICE USING THE SIDE EMITTING LENS, MOLD ASSEMBLY FOR PREPARING THE SIDE EMITTING LENS AND METHOD FOR PREPARING THE SIDE EMITTING LENS 审中-公开
标题翻译：侧发光透镜，使用侧发光透镜的发光装置，用于制备侧发光透镜的模具组件和用于制备侧发射透镜的方法
公开(公告)号：WO2007021149A1
公开(公告)日：2007-02-22
申请号：PCT/KR2006/003240
申请日：2006-08-18
申请人： LG CHEM, LTD.
发明人： HA, Duk-Sik , SHIN, Bu-Gon , CHOI, Min-Ho , KANG, Jong-Hoon , YU, Min-A , LEE, Jae-Seung
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , B29C33/005 , B29C33/44 , B29D11/0074 , B29L2011/0016 , G02B19/0028 , G02B19/0061 , H01L33/60
摘要： Disclosed are a side emitting lens, a light emitting device using the side emitting lens, a mold assembly for preparing the side emitting lens and a method for preparing the side emitting using the mold assembly. The lens of the present invention has a simple structure so the lens is easily fabricated through a molding process. If the lens is applied to the light emitting member, light generated from the light emitting member is laterally guided by means of the lens.
摘要翻译：公开了一种侧面发射透镜，使用侧面发射透镜的发光装置，用于制备侧面发射透镜的模具组件以及使用模具组件制备侧面发射的方法。本发明的透镜具有简单的结构，因此通过成型工艺容易地制造透镜。如果透镜被施加到发光部件，则从发光部件产生的光通过透镜被横向引导。

7. 发明申请

WO2006065010A1 METHOD FOR MANUFACTURING G a N-BASED LIGHT EMITTING DIODE USING LASER LIFT-OFF TECHNIQUE AND LIGHT EMITTING DIODE MANUFACTURED THEREBY 审中-公开
标题翻译：使用激光提升技术制造基于N的发光二极管的方法和制造的发光二极管
公开(公告)号：WO2006065010A1
公开(公告)日：2006-06-22
申请号：PCT/KR2005/002031
申请日：2005-06-29
申请人： LG CHEM, LTD.
发明人： LEE, Jae-Seung , SHIN, Bu-Gon , CHOI, Min-Ho , KANG, Jong-Hoon , YU, Min-A , OH, Byung-Du
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L33/22 , H01L33/38 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a method for manufacturing an LED, which has a superior light emitting efficiency as well as a superior heat discharging efficiency, by means of a simplified manufacturing process for its massive production. The invention is capable of substantially reducing the steps of manufacturing process and enhancing the heat discharging efficiency by employing a laser lift-off technique instead of the flip-chip bonding technique. Also, unlike the conventional laser lift-off technique of forming LED chips as unit chips after irradiating the laser to remove sapphire substrates, on which the LEDs have grown, the present invention forms the LED chips as unit chips before irradiating the laser, thereby increasing the yield and realizing the mass production by preventing cleavage of the crystal structures of LEDs caused due to irradiation of laser. Furthermore, the invention can enhance the heat discharging efficiency by roughening the surface of an n-type GaN layer. The present invention does not require a photolithography process. As a result, the steps of manufacturing process can be drastically reduced in comparison with the flip-chip bonding technique. Also, the light emitting area can be widened 30% more than in case of employing the flip-chip technique. Thus, the present invention serves to increase the light output as well as the heat discharging area, thereby drastically enhancing the performance of manufacturing high-output LEDs.
摘要翻译：本发明提供了一种制造LED的方法，其通过简化的大规模制造工艺具有优异的发光效率以及优异的散热效率。通过采用激光剥离技术代替倒装芯片接合技术，本发明能够显着地减少制造工艺的步骤和提高散热效率。此外，与照射激光去除蓝宝石衬底之后的LED芯片形成LED芯片的常规激光剥离技术不同，LED在其上生长，本发明在照射激光之前形成作为单元芯片的LED芯片，从而增加通过防止由于激光的照射而导致的LED的晶体结构的裂开，实现了大量生产。此外，本发明可以通过粗糙化n型GaN层的表面来提高散热效率。本发明不需要光刻工艺。结果，与倒装芯片接合技术相比，制造工艺的步骤可以大大降低。此外，与使用倒装芯片技术的情况相比，发光面积可以扩大30％以上。因此，本发明用于增加光输出以及放热面积，从而大大提高制造高输出LED的性能。

8. 发明申请

WO2005041620A1 ELECTRODE FOR ORGANIC LIGHT EMITTING DEVICE AND ORGANIC LIGHT EMITTING DEVICE COMPRISING THE SAME 审中-公开
标题翻译：用于有机发光装置的电极和包含该有机发光装置的有机发光装置
公开(公告)号：WO2005041620A1
公开(公告)日：2005-05-06
申请号：PCT/KR2004/002692
申请日：2004-10-21
申请人： LG CHEM, LTD. , LEE, Jae-Seung , SON, Se-Hwan , LEE, Young-Chul , NOH, Jeoung-Kwen
发明人： LEE, Jae-Seung , SON, Se-Hwan , LEE, Young-Chul , NOH, Jeoung-Kwen
IPC分类号： H05B33/26
CPC分类号： H05B33/26 , H01L51/442 , H01L51/5212 , H01L51/5215 , H01L2251/308 , Y02E10/549
摘要： The present invention provides a light-transmitting electrode in which metal lines made of a metal with the same or superior electric conductivity to a material for the electrode are arranged linearly on the upper surface, lower surface or both surface of the electrode in the direction away from the connection part between the electrode and an electrode pad. Also, the present invention provides an electrode with a structure in which different electrically conductive compounds are alternately layered. The electrode of the present invention is excellent in transparency and electric conductivity. Also, the present invention provides organic light-emitting devices comprising the electrode.
摘要翻译：本发明提供一种透光电极，其中与电极材料具有相同或优异的导电性的金属制成的金属线在电极的上表面，下表面或两个表面上以离开的方向直线地布置从电极和电极焊盘之间的连接部分。另外，本发明提供具有交替层叠不同导电性化合物的结构的电极。本发明的电极透明性和导电性优异。此外，本发明提供了包括该电极的有机发光器件。

9. 发明公开

EP1943881A1 METHOD OF MANUFACTURING DEVICE HAVING FLEXIBLE SUBSTRATE AND DEVICE HAVING FLEXIBLE SUBSTRATE MANUFACTURED USING THE SAME 有权转让
标题翻译：方法在组件上的柔性衬底
公开(公告)号：EP1943881A1
公开(公告)日：2008-07-16
申请号：EP06812351.2
申请日：2006-11-01
申请人： LG Chem, Ltd.
发明人： LEE, Young-Chul , LEE, Jae-Seung , NOH, Jeoung-Kwen
IPC分类号： H05B33/10
CPC分类号： H01L51/56 , H01L51/003 , H01L51/5253 , H01L2227/326 , H01L2251/5338
摘要： The present invention relates to a method of manufacturing a device having a flexible substrate and a device having a flexible substrate manufactured using the method. According to the method of manufacturing a device having a flexible substrate of the invention, glass is used as a mother substrate, a polymer layer, which is used as a substrate, is formed on the mother substrate using a chemical vapor deposition method or a vacuum evaporation method, a device is formed, and finally, the substrate where the device is formed is separated from the mother substrate, such that a large-scale device having a flexible substrate can be manufactured. Further, as a substrate forming an organic light emitting device and a sealant are formed of the same material, the device is not bent due to stress generated from the device itself after the device is manufactured.

10. 发明授权

EP1943881B1 METHOD OF MANUFACTURING DEVICE HAVING FLEXIBLE SUBSTRATE 有权转让
标题翻译：方法在组件上的柔性衬底
公开(公告)号：EP1943881B1
公开(公告)日：2013-09-11
申请号：EP06812351.2
申请日：2006-11-01
申请人： LG Chem, Ltd.
发明人： LEE, Young-Chul LG Chem Ltd. , LEE, Jae-Seung , NOH, Jeoung-Kwen
IPC分类号： H01L51/52 , H01L51/56
CPC分类号： H01L51/56 , H01L51/003 , H01L51/5253 , H01L2227/326 , H01L2251/5338

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