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    • 1. 发明申请
    • ORGANIC SILVER COMPLEX COMPOUND USED IN PASTE FOR CONDUCTIVE PATTERN FORMING
    • 用于导电图案形成的有机银复合化合物
    • WO2008038976A1
    • 2008-04-03
    • PCT/KR2007/004672
    • 2007-09-21
    • LG CHEM, LTD.YOON, Sung-HoKIM, So-WonCHUN, Sang-KiLEE, Dong-WookKIM, Seoung-WookKWON, Won-Jong
    • YOON, Sung-HoKIM, So-WonCHUN, Sang-KiLEE, Dong-WookKIM, Seoung-WookKWON, Won-Jong
    • H01B1/22
    • H01B1/22H05K1/097H05K2203/121Y10T428/24802Y10T428/24917
    • Disclosed is an organic silver complex compound in which an organic ligand, containing an amine group (-NH 2 ) and a hydroxyl group (-0H), is bonded with aliphatic silver (Ag) carboxylate at an equivalent ratio of 2:1 to form a complex. Also disclosed is a conductive paste comprising: a silver source selected from the group consisting of silver oxide powder, silver powder and silver flake; and organic silver complex compound in which an organic ligand, containing an amine group and a hydroxyl group, is bonded with an organic silver compound to form a complex. The organic silver complex compound has high solubility in a solvent and is present in the liquid state at room temperature. Thus, an extra solvent is not used in a conductive pattern-forming paste containing the complex compound or is used in a small amount, such that the content of silver in the conductive pattern-forming paste can be increased. Also, the conductive pattern-forming paste containing the complex compound has high viscosity, and thus shows excellent stability without adding a dispersant and, at the same time, is easily industrially applied.
    • 公开了一种有机银络合物,其中含有胺基(-NH 2/2)和羟基(-OH)的有机配体与脂肪族银(Ag)羧酸盐以等同物键合 比例为2:1,形成复合物。 还公开了一种导电膏,其包括:选自氧化银粉末,银粉和银片的银源; 和其中含有胺基和羟基的有机配体与有机银化合物键合以形成络合物的有机银络合物。 有机银络合物在溶剂中的溶解性高,在室温下呈液态。 因此,在含有配位化合物的导电图案形成用糊剂中不使用额外的溶剂,也可以少量使用,能够提高导电图案形成膏中的银含量。 此外,含有配合化合物的导电图形形成糊具有高粘度,因此在不添加分散剂的情况下显示出优异的稳定性,同时容易在工业上使用。
    • 3. 发明申请
    • METHOD OF MANUFACTURING GRAVURE PLATES FOR OFFSET PRINTING
    • 制造偏光片用于偏移打印的方法
    • WO2009091229A2
    • 2009-07-23
    • PCT/KR2009/000278
    • 2009-01-19
    • LG CHEM, LTD.LEE, Dong-WookHWANG, In-SeokCHUN, Sang-KiKIM, Seung-Wook
    • LEE, Dong-WookHWANG, In-SeokCHUN, Sang-KiKIM, Seung-Wook
    • B41N1/00
    • G03F7/40
    • There is provided a method of manufacturing a gravure plate for offset printing. The method includes: coating a glass substrate with a copper metal; forming a photoresist film on the coated copper metal; forming a desired photoresist pattern by exposing the photoresist film to light and then developing the photoresist film to remove photoresist from some of the photoresist film; plating the photoresist-removed region with nickel; and removing the remaining photoresist and grinding a nickel-plated surface. The method for manufacturing a gravure plate for offset printing may be useful to provide a gravure plate that has high pattern precision since the photoresist pattern is formed by the photolithography process, excellent thickness uniformity due to the use of the glass substrate, and excellent durability since the outermost surface of the gravure plate is made of nickel.
    • 提供了一种制造用于胶印的凹版印刷机的方法。 该方法包括:用铜金属涂覆玻璃基板; 在涂覆的铜金属上形成光致抗蚀剂膜; 通过将光致抗蚀剂膜曝光而形成期望的光致抗蚀剂图案,然后显影光致抗蚀剂膜以从一些光致抗蚀剂膜中去除光致抗蚀剂; 用镍电镀光刻胶去除区域; 并除去剩余的光致抗蚀剂并研磨镀镍表面。 制造用于胶版印刷的凹版印刷的方法可用于提供具有高图案精度的凹版印刷版,因为通过光刻工艺形成光致抗蚀剂图案,由于使用玻璃基板而具有优异的厚度均匀性,并且具有优异的耐久性 凹版的最外表面由镍制成。
    • 9. 发明申请
    • METHOD FOR PREPARING LIGHT EMITTING DIODE DEVICE HAVING HEAT DISSIPATION RATE ENHANCEMENT
    • 用于制备具有加热排放速率增强的发光二极管装置的方法
    • WO2007001144A1
    • 2007-01-04
    • PCT/KR2006/002478
    • 2006-06-27
    • LG CHEM, LTD.
    • LEE, Jae-SeungCHOI, Min-HoSHIN, Bu-GonKANG, Jong-HoonYU, Min-AHA, Duk-SikKHO, Dong-HanCHUN, Sang-KiCHANG, Suk-KyPARK, Soo-Min
    • H01L33/00
    • H01L33/0079H01L33/0095H01L2224/45144H01L2224/48091H01L2224/48247H01L2224/49107H01L2224/73265H01L2924/00014H01L2924/00
    • Disclosed are a method for fabricating a light emitting diode device having a light emitting diode section grown on a sapphire substrate, a boded structure fabricated through the method, a unit chip separated from the bonded structure, and a light emitting diode device having the unit chip. The method includes the steps of (a) bonding the light emitting diode section grown on a first surface of the sapphire substrate to a first surface of a first substrate by means of a first binder; (b) bonding a second surface of the first substrate to a first surface of a second substrate by means of a second binder; (c) removing the second substrate from a bonded structure obtained as a result of step (b) after polishing a second surface of the sapphire substrate; (d) separating the bonded structure into unit chips after the second substrate has been removed from the bonded structure; and (e) bonding the second surface of the polished sapphire substrate provided in each unit chip to a lead frame, and then removing the first substrate. In the manufacture of high-output light emitting diodes, such a method can remarkably improve heat dissipation efficiency by intentionally reducing the thickness of the sapphire substrate.
    • 公开了一种制造发光二极管器件的方法,该发光二极管器件具有在蓝宝石衬底上生长的发光二极管部分,通过该方法制造的结构结构,与接合结构分离的单元芯片和具有单元芯片的发光二极管器件 。 该方法包括以下步骤:(a)借助于第一粘结剂将在蓝宝石衬底的第一表面上生长的发光二极管部分与第一衬底的第一表面接合; (b)借助于第二粘合剂将所述第一基板的第二表面接合到第二基板的第一表面; (c)在抛光蓝宝石衬底的第二表面之后,从作为步骤(b)的结果获得的接合结构去除第二衬底; (d)在从接合结构移除第二基板之后将接合结构分离成单元芯片; 和(e)将设置在每个单元芯片中的经抛光的蓝宝石衬底的第二表面接合到引线框架,然后移除第一衬底。 在高输出发光二极管的制造中,通过有意地减小蓝宝石衬底的厚度,可以显着提高散热效率。