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1. 发明申请

WO2007066934A1 CORE-SHELL TYPE NANOPARTICLES AND METHOD FOR PREPARING THE SAME 审中-公开
标题翻译：核壳类型纳米颗粒及其制备方法
公开(公告)号：WO2007066934A1
公开(公告)日：2007-06-14
申请号：PCT/KR2006/005165
申请日：2006-12-04
申请人： LG CHEM, LTD.
发明人： KIM, Sang-Ho , LEE, Woo-Ram , LIM, Young-Soo
IPC分类号： B82B3/00
CPC分类号： B01J13/02 , B22F1/02 , B22F2998/00 , B22F2998/10 , B82Y30/00 , C01G23/053 , C01P2004/80 , Y10S977/778 , Y10S977/81 , Y10S977/811 , Y10T428/2991 , Y10T428/2993 , B22F1/0018 , B22F1/0022 , B22F1/0074
摘要： Disclosed herein are core-shell type nanoparticles comprising nanoparticle cores made of a metal or semiconductor, and shells made of crystalline metal oxide formed on the surfaces of the nanoparticle cores, as well as a preparation method thereof. According to the disclosed invention, the core-shell nanoparticles, consisting of metallic or semiconductor cores and crystalline metal oxide shells, can be prepared by epitaxially growing metal oxide on the surfaces of the metallic or semiconductor nanoparticle cores. By virtue of the crystalline metal oxide shells, the core nanoparticle made of metal or semiconductor can ensure excellent chemical and mechanical stability, and the core-shell nanoparticles can show new properties resulting from the interaction between the metal cores and the metal oxide crystal shells.
摘要翻译：本文公开了包含由金属或半导体制成的纳米颗粒芯和由形成在纳米颗粒芯的表面上的结晶金属氧化物制成的壳的核 - 壳型纳米颗粒及其制备方法。根据所公开的发明，由金属或半导体芯和结晶金属氧化物壳组成的核 - 壳纳米颗粒可以通过在金属或半导体纳米颗粒芯的表面上外延生长金属氧化物来制备。由于结晶金属氧化物壳，由金属或半导体制成的芯纳米颗粒可以确保优异的化学和机械稳定性，并且核 - 壳纳米颗粒可以显示由金属芯和金属氧化物晶体壳之间的相互作用产生的新特性。

2. 发明申请

WO2009014320A2 SPHERICAL ASSEMBLY PARTICLE COMPOSITION OF CUPROUS OXIDE AND PREPARATION METHOD THEREOF 审中-公开
标题翻译：氧化丙烯的球形组装颗粒组合物及其制备方法
公开(公告)号：WO2009014320A2
公开(公告)日：2009-01-29
申请号：PCT/KR2008/003643
申请日：2008-06-25
申请人： LG CHEM, LTD. , LEE, Woo-Ram , KIM, Sang-Ho , YOON, Sung-Ho
发明人： LEE, Woo-Ram , KIM, Sang-Ho , YOON, Sung-Ho
IPC分类号： C01G3/02
CPC分类号： C01G3/02 , B01J23/72 , B01J35/0013 , B01J35/08 , B01J37/16 , B82Y30/00 , C01P2002/72 , C01P2004/03 , C01P2004/04 , C01P2004/32 , C01P2004/50 , C01P2004/52 , C01P2004/61 , C01P2004/62 , H01L31/0328 , H01L31/035281 , Y02E10/50 , Y10T428/2991 , Y10T428/2998
摘要： A Cu2O spherical assembly particle composition is composed of Cu2O spherical assembly particles, each of which is formed by agglomerating a plurality of Cu2O ultrafine particles that have an average diameter in the range from 1 to 100 nm and a standard deviation on the diameter in the range from 0 to 10%. The Cu2O spherical assembly particles have an average diameter in the range from 0.1 to 10 μm and a standard deviation on the diameter in the range from 0 to 40%. This Cu2O spherical assembly particle composition is composed of Cu2O assembly particles with excellent uniformity, so it shows excellent properties such as realizing a good electric con¬ ductivity during a curing process for wiring. Accordingly, the spherical Cu2O assembly particle composition may be usefully used as precursors for solar energy conversion, magnetic storage medium, catalyst, gas sensor, and copper wire formation.
摘要翻译： Cu2O球形组件颗粒组合物由Cu2O球形组件颗粒组成，每个颗粒通过使平均直径在1至100nm范围内的多个Cu 2 O超细颗粒聚集而形成，并且在该范围内的直径的标准偏差从0到10％。 Cu2O球形组件颗粒的平均直径在0.1至10μm的范围内，直径的标准偏差在0至40％的范围内。该Cu 2 O球形组装粒子组合物由均匀性优异的Cu 2 O组装粒子组成，因此在布线固化处理中实现良好的电性能。因此，球形Cu 2 O组合粒子组合物可以有用地用作太阳能转换，磁存储介质，催化剂，气体传感器和铜线形成的前体。

3. 发明申请

WO2009014392A2 PREPARATION METHOD OF COPPER PARTICLE COMPOSITION 审中-公开
标题翻译：铜颗粒组合物的制备方法
公开(公告)号：WO2009014392A2
公开(公告)日：2009-01-29
申请号：PCT/KR2008/004342
申请日：2008-07-24
申请人： LG CHEM, LTD. , LEE, Woo-Ram , KIM, Sang-Ho , YOON, Sung-Ho
发明人： LEE, Woo-Ram , KIM, Sang-Ho , YOON, Sung-Ho
IPC分类号： B22F9/24 , B22F9/18
CPC分类号： C01G3/02 , B22F9/24 , B22F2998/00 , B82Y30/00 , C01P2002/72 , C01P2004/03 , C01P2004/04 , C01P2004/32 , C01P2004/51 , C01P2004/54 , C01P2004/61 , C01P2004/62 , C01P2004/64 , B22F1/0018
摘要： A preparation method of a copper particle composition includes dissolving a copper carboxyl compound, or a carboxyl group-containing compound and a copper salt, in a solvent to prepare a copper(II) precursor solution; putting a weak reducing agent with a standard reduction potential of -0.2 to -0.05V to the prepared copper(II) precursor solution to assemble a plurality of Cu 2 O fine particles having an average diameter of 1 to 100 nm with a standard deviation of 0 to 10 %, thereby forming spherical Cu 2 O assembly particles having an average diameter of 0.1 to 10 μm with a standard deviation of 0 to 40 %; reducing the spherical Cu 2 O assembly particles into copper particles by using a reducing agent; and separating the copper particles from the result product. Thus, copper particles can be produced fast, economically, and the obtained copper particles have good crystallinity and good resistance against oxidation.
摘要翻译：铜粒子组合物的制备方法包括将铜羧基化合物或含羧基化合物和铜盐溶解在溶剂中以制备铜（II）前体溶液; 将具有-0.2至-0.05V的标准还原电位的弱还原剂加入到所制备的铜（II）前体溶液中以组装多个平均直径为1至2μm的Cu 2 O微粒 100nm，标准偏差为0〜10％，由此形成平均直径为0.1〜10μm且标准偏差为0〜40％的球形Cu 2 O组装体粒子。通过使用还原剂将球形Cu 2 O组装体颗粒还原成铜颗粒; 并从结果产物中分离铜颗粒。因此，可以快速且经济地生产铜颗粒，并且所获得的铜颗粒具有良好的结晶性和良好的抗氧化性。

4. 发明申请

WO2009014391A3 PREPARATION METHOD OF ELECTROCONDUCTIVE COPPER PATTERNING LAYER BY LASER IRRADIATION 审中-公开
公开(公告)号：WO2009014391A3
公开(公告)日：2009-01-29
申请号：PCT/KR2008/004340
申请日：2008-07-24
申请人： LG CHEM, LTD. , LEE, Woo-Ram , KIM, Sang-Ho , KIM, Tae-Su , KIM, So-Won
发明人： LEE, Woo-Ram , KIM, Sang-Ho , KIM, Tae-Su , KIM, So-Won
IPC分类号： H01L21/28
摘要： A preparation method of an electroconductive copper patterning layer includes (Step 1) preparing a dispersion solution of copper-based particles selected from the group consisting of copper particles, copper oxide particles, and their mixtures; (Step 2) forming a copper-based particle patterning layer by printing or filling the dispersion solution of copper-based particles to a substrate into a predetermined shape; and (Step 3) irradiating laser to the copper-based particle patterning layer to burn and interconnect the copper-based particles contained in the copper- based particle patterning layer. This preparation method burns a copper-based particle patterning layer with a strong energy within a short time by using laser. Thus, it is possible to obtain a copper patterning layer that is hardly oxidized even in the atmosphere, so a copper patterning layer with excellent electric conductivity is formed.

5. 发明授权

EP2394973B1 METHOD FOR PREPARING GRAPHITE PARTICLE/COPPER COMPOSITE MATERIAL 有权转让
标题翻译：制备石墨颗粒/铜复合材料的方法
公开(公告)号：EP2394973B1
公开(公告)日：2017-11-15
申请号：EP10738764.9
申请日：2010-02-05
申请人： LG Chem, Ltd.
发明人： LEE, Woo-Ram , KIM, Sang-Ho , PARK, Jong-Wuk
IPC分类号： C04B35/52 , C04B35/532 , C04B35/528 , C04B35/571 , C01B32/05 , C01B32/20 , C01B32/25 , C01G3/02 , C04B35/628 , C22C32/00
CPC分类号： C04B35/62892 , B22F2998/00 , B22F2998/10 , C01B32/05 , C01B32/168 , C01B32/194 , C01B32/20 , C01B32/28 , C01G3/02 , C04B35/62805 , C04B35/62889 , C04B2235/425 , C22C32/0094 , B22F9/24 , B22F3/1039 , B22F2303/01 , B22F2301/10
摘要： The present invention relates to a method for preparing a carbon-based particle/copper composite material in which carbon-based particles such as graphite and copper are mixed, the method including mixing a solution of a polymer organic compound having a main chain of carbon and a copper precursor in a solvent, with a dispersion solution of carbon-based particles in a first dispersion medium to produce a mixture, adding a first reducing agent to the mixture to form composite particles in which copper (I) oxide particles are attached to the surface of the carbon-based particles, and sintering the composite particles under a non-oxidizing atmosphere. According to the preparing method, a composition material is obtained, in which carbon-based particles and copper are well mixed.

6. 发明公开

EP2190613A2 PREPARATION METHOD OF COPPER PARTICLE COMPOSITION 有权
标题翻译：铜颗粒组合物的制备方法
公开(公告)号：EP2190613A2
公开(公告)日：2010-06-02
申请号：EP08792889.1
申请日：2008-07-24
申请人： LG Chem, Ltd.
发明人： LEE, Woo-Ram , KIM, Sang-Ho , YOON, Sung-Ho
IPC分类号： B22F9/24 , B22F9/18
CPC分类号： C01G3/02 , B22F9/24 , B22F2998/00 , B82Y30/00 , C01P2002/72 , C01P2004/03 , C01P2004/04 , C01P2004/32 , C01P2004/51 , C01P2004/54 , C01P2004/61 , C01P2004/62 , C01P2004/64 , B22F1/0018
摘要： A preparation method of a copper particle composition includes dissolving a copper carboxyl compound, or a carboxyl group-containing compound and a copper salt, in a solvent to prepare a copper(II) precursor solution; putting a weak reducing agent with a standard reduction potential of -0.2 to -0.05V to the prepared copper(II) precursor solution to assemble a plurality of Cu2O fine particles having an average diameter of 1 to 100 nm with a standard deviation of 0 to 10 %, thereby forming spherical Cu2O assembly particles having an average diameter of 0.1 to 10 μm with a standard deviation of 0 to 40 %; reducing the spherical Cu2O assembly particles into copper particles by using a reducing agent; and separating the copper particles from the result product. Thus, copper particles can be produced fast, economically, and the obtained copper particles have good crystallinity and good resistance against oxidation.
摘要翻译：铜颗粒组合物的制备方法包括将铜羧基化合物或含羧基化合物和铜盐溶解在溶剂中以制备铜（II）前体溶液; 将标准还原电位为-0.2〜-0.05V的弱还原剂加入到所制备的铜（II）前体溶液中，组装平均直径为1〜100nm的多个Cu 2 O微粒，标准偏差为0〜 10％，形成平均粒径为0.1〜10μm，标准偏差为0〜40％的球状Cu 2 O集合体粒子。通过使用还原剂将球形Cu 2 O组装体颗粒还原成铜颗粒; 并从结果产物中分离铜颗粒。因此，可以快速且经济地生产铜颗粒，并且所获得的铜颗粒具有良好的结晶性和良好的抗氧化性。

7. 发明公开

EP2394973A2 METHOD FOR PREPARING CARBON-BASED PARTICLE/COPPER COMPOSITE MATERIAL 有权转让
标题翻译： VERFAHREN ZUR HERSTELLUNG VON PARTIKEL- / KUPFERVERBUNDMATERIAL AUF KOHLENSTOFFBASIS
公开(公告)号：EP2394973A2
公开(公告)日：2011-12-14
申请号：EP10738764.9
申请日：2010-02-05
申请人： LG Chem, Ltd.
发明人： LEE, Woo-Ram , KIM, Sang-Ho , PARK, Jong-Wuk
IPC分类号： C04B35/52 , C04B35/532 , C04B35/528 , C04B35/571
CPC分类号： C04B35/62892 , B22F2998/00 , B22F2998/10 , C01B32/05 , C01B32/168 , C01B32/194 , C01B32/20 , C01B32/28 , C01G3/02 , C04B35/62805 , C04B35/62889 , C04B2235/425 , C22C32/0094 , B22F9/24 , B22F3/1039 , B22F2303/01 , B22F2301/10
摘要： The present invention relates to a method for preparing a carbon-based particle/copper composite material in which carbon-based particles such as graphite and copper are mixed, the method including mixing a solution of a polymer organic compound having a main chain of carbon and a copper precursor in a solvent, with a dispersion solution of carbon-based particles in a first dispersion medium to produce a mixture, adding a first reducing agent to the mixture to form composite particles in which copper (I) oxide particles are attached to the surface of the carbon-based particles, and sintering the composite particles under a non-oxidizing atmosphere. According to the preparing method, a composition material is obtained, in which carbon-based particles and copper are well mixed.
摘要翻译：本发明涉及一种制备其中混合了诸如石墨和铜的碳基颗粒的碳基颗粒/铜复合材料的方法，所述方法包括将具有主链的聚合物有机化合物的溶液和在溶剂中的铜前体，在第一分散介质中具有碳基颗粒的分散溶液以产生混合物，向混合物中加入第一还原剂以形成复合颗粒，其中氧化铜（I）颗粒附着到碳基颗粒的表面，并且在非氧化气氛下烧结复合颗粒。根据制备方法，得到碳基颗粒和铜充分混合的组合物材料。

8. 发明授权

EP2183767B1 PREPARATION METHOD OF ELECTROCONDUCTIVE COPPER PATTERNING LAYER BY LASER IRRADIATION 有权
标题翻译：通过激光照射制备导电铜图案层
公开(公告)号：EP2183767B1
公开(公告)日：2011-10-19
申请号：EP08778929.3
申请日：2008-07-24
申请人： LG Chem, Ltd.
发明人： LEE, Woo-Ram , KIM, Sang-Ho , KIM, Tae-Su , KIM, So-Won
IPC分类号： H01L21/28
CPC分类号： H01L21/288 , H01L21/268 , H05K1/092 , H05K1/097 , H05K3/102 , H05K3/105 , H05K3/1283 , H05K2201/0209 , H05K2203/107 , H05K2203/1131
摘要： A preparation method of an electroconductive copper patterning layer includes (Step 1) preparing a dispersion solution of copper-based particles selected from the group consisting of copper particles, copper oxide particles, and their mixtures; (Step 2) forming a copper-based particle patterning layer by printing or filling the dispersion solution of copper-based particles to a substrate into a predetermined shape; and (Step 3) irradiating laser to the copper-based particle patterning layer to burn and interconnect the copper-based particles contained in the copper- based particle patterning layer. This preparation method burns a copper-based particle patterning layer with a strong energy within a short time by using laser. Thus, it is possible to obtain a copper patterning layer that is hardly oxidized even in the atmosphere, so a copper patterning layer with excellent electric conductivity is formed.
摘要翻译：一种导电铜图案化层的制备方法，包括（步骤1）制备选自铜颗粒，氧化铜颗粒及其混合物的铜基颗粒的分散溶液; （步骤2）通过将基于铜的颗粒的分散溶液印刷或填充至基板成预定形状来形成铜基颗粒构图层; 和（步骤3）将激光照射至铜基颗粒图案化层以燃烧并互连铜基颗粒图案化层中包含的铜基颗粒。该制备方法使用激光在短时间内以强能量烧制铜基颗粒构图层。因此，即使在大气中也可以获得几乎不被氧化的铜构图层，因此形成了具有优异导电性的铜构图层。

9. 发明公开

EP2178797A2 SPHERICAL ASSEMBLY PARTICLE COMPOSITION OF CUPROUS OXIDE AND PREPARATION METHOD THEREOF 有权
标题翻译：粒子在氧化亚铜和工艺用于生产球型排列组成
公开(公告)号：EP2178797A2
公开(公告)日：2010-04-28
申请号：EP08766602.0
申请日：2008-06-25
申请人： LG Chem, Ltd.
发明人： LEE, Woo-Ram , KIM, Sang-Ho , YOON, Sung-Ho
IPC分类号： C01G3/02
CPC分类号： C01G3/02 , B01J23/72 , B01J35/0013 , B01J35/08 , B01J37/16 , B82Y30/00 , C01P2002/72 , C01P2004/03 , C01P2004/04 , C01P2004/32 , C01P2004/50 , C01P2004/52 , C01P2004/61 , C01P2004/62 , H01L31/0328 , H01L31/035281 , Y02E10/50 , Y10T428/2991 , Y10T428/2998
摘要： A Cu2O spherical assembly particle composition is composed of Cu2O spherical assembly particles, each of which is formed by agglomerating a plurality of Cu2O ultrafine particles that have an average diameter in the range from 1 to 100 nm and a standard deviation on the diameter in the range from 0 to 10%. The Cu2O spherical assembly particles have an average diameter in the range from 0.1 to 10 μm and a standard deviation on the diameter in the range from 0 to 40%. This Cu2O spherical assembly particle composition is composed of Cu2O assembly particles with excellent uniformity, so it shows excellent properties such as realizing a good electric con¬ ductivity during a curing process for wiring. Accordingly, the spherical Cu2O assembly particle composition may be usefully used as precursors for solar energy conversion, magnetic storage medium, catalyst, gas sensor, and copper wire formation.

10. 发明授权

EP2190613B1 PREPARATION METHOD OF COPPER PARTICLE COMPOSITION 有权
标题翻译：铜颗粒组合物的制备方法
公开(公告)号：EP2190613B1
公开(公告)日：2014-03-12
申请号：EP08792889.1
申请日：2008-07-24
申请人： LG Chem, Ltd.
发明人： LEE, Woo-Ram , KIM, Sang-Ho , YOON, Sung-Ho
IPC分类号： B22F9/24 , B22F9/18 , C01G3/02
CPC分类号： C01G3/02 , B22F9/24 , B22F2998/00 , B82Y30/00 , C01P2002/72 , C01P2004/03 , C01P2004/04 , C01P2004/32 , C01P2004/51 , C01P2004/54 , C01P2004/61 , C01P2004/62 , C01P2004/64 , B22F1/0018

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