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1. 发明申请

WO2006004888B1 MULTI-FLUID EJECTION DEVICE 审中-公开
标题翻译：多流体喷射装置
公开(公告)号：WO2006004888B1
公开(公告)日：2007-03-29
申请号：PCT/US2005023207
申请日：2005-06-29
申请人： LEXMARK INT INC
发明人： ANDERSON FRANK EDWARD , BUCHANAN JEFFREY JAMES , DROEGE CURTIS RAY , GREER DAVID EMERSON , KWAN KIN MING , LONG GREGORY ALAN , PHATAK GANESH VINAYAK , SPIVEY PAUL TIMOTHY , SULLIVAN CARL EDMOND , UBELLACKER KENT LEE , WALDECK MELISSA MARIE
IPC分类号： B41J2/05
CPC分类号： B41J2/17513
摘要： A multi-fluid body (10) and an ejection head substrate (28) connected in fluid flow communication with the multi-fluid body (10) for ejecting multiple fluids therefrom. The multi-fluid body (10) includes at least two segregated fluid chambers (32, 34). Independent fluid supply paths lead from each of the fluid chambers (32, 34) providing fluid to multiple fluid flow paths in the ejection head substrate (28). The ejection head substrate (28) is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate (28) have a flow path density of greater than about one flow paths per millimeter.
摘要翻译：多流体（10）和与多流体（10）流体连通地连接以从其喷射多个流体的喷射头基板（28）。多流体（10）包括至少两个分离的流体室（32,34）。独立的流体供应路径从每个流体室（32,34）引出，从而将流体提供给喷射头基板（28）中的多个流体流动路径。喷射头基板（28）被安装在身体的喷射头部区域附近。喷射头基板（28）中的流体流动路径具有大于每毫米约一个流动路径的流路密度。

2. 发明申请

WO9965686A9 A HEATER CHIP MODULE AND PROCESS FOR MAKING SAME 审中-公开
标题翻译：加热器芯片模块及其制造方法
公开(公告)号：WO9965686A9
公开(公告)日：2000-08-10
申请号：PCT/US9913599
申请日：1999-06-16
申请人： LEXMARK INT INC
发明人： SULLIVAN CARL EDMOND , ZBROZEK JOHN DENNIS
IPC分类号： B41J2/14 , B41J2/16 , B41J2/05
CPC分类号： B41J2/1645 , B41J2/14145 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642 , B41J2/1646
摘要： A heater chip module (50) is provided comprising a carrier (52) adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate (70) coupled to the heater chip (60). The carrier includes a support section provided with two or more channels (54g) which define paths for ink to travel from the container to the heater chip. The heater chip is secured at its base to the support section. Carrier material located between the channels define ribs which provide a path for energy in the form of heat to travel from the heater chip to the carrier. A flexible circuit (90) is coupled to the heater chip module such as by TAB bonding or wire bonding.
摘要翻译：一种加热器芯片模块（50），其包括适于固定到填充墨水的容器的载体（52），至少一个具有联接到所述载体的基座的加热器芯片，以及至少一个喷嘴板（70）加热器芯片（60）。载体包括设置有两个或更多个通道（54g）的支撑部分，其限定油墨从容器行进到加热器芯片的路径。加热器芯片在其基部固定到支撑部分。位于通道之间的载体材料限定了肋，肋条以热的形式提供能量从加热器芯片行进到载体的路径。柔性电路（90）例如通过TAB接合或引线接合耦合到加热器芯片模块。

3. 发明申请

WO2006004888A3 MULTI-FLUID EJECTION DEVICE 审中-公开
标题翻译：多流体喷射装置
公开(公告)号：WO2006004888A3
公开(公告)日：2007-02-08
申请号：PCT/US2005023207
申请日：2005-06-29
申请人： LEXMARK INT INC
发明人： ANDERSON FRANK EDWARD , BUCHANAN JEFFREY JAMES , DROEGE CURTIS RAY , GREER DAVID EMERSON , KWAN KIN MING , LONG GREGORY ALAN , PHATAK GANESH VINAYAK , SPIVEY PAUL TIMOTHY , SULLIVAN CARL EDMOND , UBELLACKER KENT LEE , WALDECK MELISSA MARIE
IPC分类号： B41J2/05
CPC分类号： B41J2/17513
摘要： A multi-fluid body (10) and an ejection head substrate (28) connected in fluid flow communication with the multi-fluid body (10) for ejecting multiple fluids therefrom. The multi-fluid body (10) includes at least two segregated fluid chambers (32, 34). Independent fluid supply paths lead from each of the fluid chambers (32, 34) providing fluid to multiple fluid flow paths in the ejection head substrate (28). The ejection head substrate (28) is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate (28) have a flow path density of greater than about one flow paths per millimeter.
摘要翻译：一个多流体体（10）和一个喷头基体（28），该多体流体体（10）与多流体体（10）流体流动连通地连接，用于从其中喷射多种流体。多流体（10）包括至少两个分离的流体室（32,34）。独立的流体供应路径从将流体提供到喷射头基底（28）中的多个流体流动路径的每个流体室（32,34）引出。喷头基体（28）附着在本体的喷头区域附近。喷头基体（28）中的流体流动路径具有大于每毫米约一个流动路径的流动路径密度。

4. 发明申请

WO2005103332A2 IMPROVED MICRO-FLUID EJECTION ASSEMBLIES 审中-公开
标题翻译：改进的微流体喷射装置
公开(公告)号：WO2005103332A2
公开(公告)日：2005-11-03
申请号：PCT/US2005012800
申请日：2005-04-14
申请人： LEXMARK INT INC
发明人： KRAWCZYK JOHN WILLIAM , MCNEES ANDREW N , MRVOS JAMES MICHAEL , SULLIVAN CARL EDMOND
IPC分类号： B41J2/16 , C23F1/00
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628
摘要： A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.
摘要翻译：一种微流体喷射组件，包括其中具有精确形成的流体路径的硅衬底。流体路径是通过在具有不超过约5000埃的电介质层厚度的蚀刻之前具有蚀刻表面特性的衬底上进行的深反应离子蚀刻工艺形成的，以及基本上不含电介质材料的凹坑表面，其中a 表面点蚀的均方根深度小于约500埃，最大表面点蚀深度不超过约2500埃。这种衬底中的流体路径具有改进的流动特性以便更可靠的流体喷射操作。

5. 发明公开

EP1747303A4 IMPROVED MICRO-FLUID EJECTION ASSEMBLIES 有权转让
标题翻译：改进的微流体喷射安排
公开(公告)号：EP1747303A4
公开(公告)日：2008-11-19
申请号：EP05736829
申请日：2005-04-14
申请人： LEXMARK INT INC
发明人： KRAWCZYK JOHN WILLIAM , MCNEES ANDREW N , MRVOS JAMES MICHAEL , SULLIVAN CARL EDMOND
IPC分类号： B41J2/16 , B41J2/14 , C23F1/00
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628
摘要： A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.

6. 发明公开

EP1208011A4 FILTER TOWER STRUCTURE 审中-公开
标题翻译： FILTERTURMSTRUKTUR
公开(公告)号：EP1208011A4
公开(公告)日：2002-10-16
申请号：EP00943026
申请日：2000-06-21
申请人： LEXMARK INT INC
发明人： LATTUCA MICHAEL DAVID , WARD DAVID AMOS , CORLEY RICHARD EARL JR , SULLIVAN CARL EDMOND , SPIVEY PAUL TIMOTHY
IPC分类号： B41J2/16 , B41J2/175 , B41J2/19
CPC分类号： B41J2/17563 , B41J2/17503 , B41J2/1752 , B41J2/17523
摘要： The invention relates to a filter tower structure and attachment of the structure to a cartridge body (12). The cartridge body contains one or more printheads (14) on a first surface thereof, one or more connection apertures in flow communication with the one or more printheads, each aperture having an opening on a second surface opposite the first surface and one or more ink filtration devices (28) having an outlet port connected to the second surface of the cartridge body through the opening so that each ink outlet port is in flow communication with at least one connection aperture. The device enables production of a cartridge body made of a material which is effective for removing heat from the printheads.
摘要翻译：盒体在其第一表面上包含一个或多个打印头，以及与该一个或多个打印头流动连通的一个或多个连接孔，每个孔在与第一表面相对的第二表面上具有开口，以及一个或多个单独的墨过滤每个装置具有通过开口连接到盒主体的第二表面的墨水出口，使得每个墨水出口与至少一个连接孔流动连通。单独的装置使得能够生产由能够从打印头移除热量的材料制成的盒体。

7. 发明公开

EP1339549A4 IMPROVED INK JET PRINTHEADS AND METHODS THEREFOR 审中-公开
标题翻译：改进的喷墨头及其方法
公开(公告)号：EP1339549A4
公开(公告)日：2004-12-08
申请号：EP01994187
申请日：2001-10-22
申请人： LEXMARK INT INC
发明人： POWERS JAMES HAROLD , SULLIVAN CARL EDMOND
IPC分类号： B41J2/05 , B41J2/16 , B41J2/04
CPC分类号： B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1645 , B41J2/1646
摘要： The invention provides a method for making ink feed vias (14) in semiconductor silicon substrate chips (10) for an ink jet printhead (26) and ink jet printheads containing silicon chips made by the method. The method includes applying an etch stop layer to a first surface of the silicon chip having a thickness ranging from about 300 to 800 microns, dry etching individual ink vias through the thickness of the silicon chip up to the etch stop layer from a surface opposite the first surface and forming holes in the etch stop layer to individually fluidly connect with the ink vias using a mechanical technique. Substantially vertical wall vias are etched through the thickness of the silicon chip using the method. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.

8. 发明申请

WO02057084A2 IMPROVED INK JET PRINTHEADS AND METHODS THEREFOR 审中-公开
标题翻译：改进的喷墨打印头及其方法
公开(公告)号：WO02057084A2
公开(公告)日：2002-07-25
申请号：PCT/US0147666
申请日：2001-10-22
申请人： LEXMARK INT INC
发明人： POWERS JAMES HAROLD , SULLIVAN CARL EDMOND
IPC分类号： B41J2/05 , B41J2/16 , B41J2/04
CPC分类号： B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1645 , B41J2/1646
摘要： The invention provides a method for making ink feed vias (14) in semiconductor silicon substrate chips (10) for an ink jet printhead (26) and ink jet printheads containing silicon chips made by the method. The method includes applying an etch stop layer to a first surface of the silicon chip having a thickness ranging from about 300 to 800 microns, dry etching individual ink vias through the thickness of the silicon chip up to the etch stop layer from a surface opposite the first surface and forming holes in the etch stop layer to individually fluidly connect with the ink vias using a mechanical technique. Substantially vertical wall vias are etched through the thickness of the silicon chip using the method. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.
摘要翻译：本发明提供一种用于在用于喷墨打印头（26）的半导体硅衬底芯片（10）中制造墨水供给通路（14）的方法以及通过该方法制造的含有硅芯片的喷墨打印头。该方法包括将蚀刻停止层施加到厚度范围为约300至800微米的硅芯片的第一表面，从与所述硅芯片相对的表面直到蚀刻停止层的干蚀刻单独的墨通孔第一表面和在蚀刻停止层中形成孔以使用机械技术单独地与油墨通孔流体连接。使用该方法通过硅芯片的厚度蚀刻基本上垂直的壁通孔。与传统的油墨通孔形成技术相反，该方法显着提高了硅芯片的生产量，并减少了由于断屑和破裂造成的损耗。所得到的芯片对于长期打印头使用更可靠。

9. 发明申请

WO9966765A9 A PROCESS FOR MAKING A HEATER CHIP MODULE 审中-公开
标题翻译：制造加热片芯片的方法
公开(公告)号：WO9966765A9
公开(公告)日：2000-05-25
申请号：PCT/US9913573
申请日：1999-06-16
申请人： LEXMARK INT INC
发明人： KOMPLIN STEVEN ROBERT , MURTHY ASHOK , SULLIVAN CARL EDMOND
IPC分类号： B41J2/14 , B41J2/16 , H05B3/00
CPC分类号： B41J2/14072 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642 , B41J2/1645 , B41J2/1646 , H01L2224/49171 , H01L2224/8592 , H01L2924/01019 , H01L2924/01021 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , Y10T29/49083 , Y10T29/4913 , Y10T29/49323 , Y10T29/49401 , H01L2924/00
摘要： A process is provided for forming a heater chip (160) module comprising a carrier (52) adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate (70) coupled to the heater chip. The carrier includes a support substrate (54) having at least one passage which defines a path for ink to travel from the container (22) to heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from the material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
摘要翻译：提供了一种用于形成加热器芯片（160）模块的方法，该加热器芯片包括适于固定到填充墨水的容器的载体（52），至少一个具有联接到载体的基座的加热器芯片和至少一个喷嘴板 70）耦合到加热器芯片。载体包括具有至少一个通道的支撑基底（54），该通道限定油墨从容器（22）行进到加热器芯片的路径。加热器芯片在其底部固定到支撑基板的一部分。支撑基板的至少部分由具有与加热器芯片基座基本上相同的热膨胀系数的材料形成。柔性电路例如通过TAB键合或引线键合耦合到加热器芯片模块。

10. 发明申请

WO9965690A9 AN INK JET HEATER CHIP MODULE 审中-公开
标题翻译：喷墨打印机芯片模块
公开(公告)号：WO9965690A9
公开(公告)日：2000-05-04
申请号：PCT/US9913498
申请日：1999-06-16
申请人： LEXMARK INT INC
发明人： KOMPLIN STEVEN ROBERT , MURTHY ASHOK , SULLIVAN CARL EDMOND
IPC分类号： B41J2/14 , B41J2/05
CPC分类号： B41J2/14072 , B41J2/14024 , B41J2/1404 , B41J2002/14387
摘要： A heater chip module (50) comprising a carrier (52) adapted to be secured to an ink-filled container (22), a heater chip (60) having a base coupled to the carrier including a support substrate (54) with at least one passage for ink, a nozzle plate (70), and a flexible circuit (90) coupled to the heater chip. At least a portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. The flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
摘要翻译：一种加热器芯片模块（50），包括适于固定到填充墨水的容器（22）的载体（52），加热器芯片（60），其具有耦合到所述载体的基底，所述基底至少包括支撑基底（54）一个油墨通道，一个喷嘴板（70）和一个耦合到加热器芯片的柔性回路（90）。支撑衬底的至少一部分由具有与加热器芯片基座基本上相同的热膨胀系数的材料形成。柔性电路例如通过TAB接合或引线接合耦合到加热器芯片模块。

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