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1. 发明申请

WO2004030084A2 METHOD FOR QUANTIFYING UNIFORMITY PATTERNS AND INCLUSION OF EXPERT KNOWLEDGE FOR TOOL DEVELOPMENT AND CONTROL 审中-公开
标题翻译：定量统一模式的方法和专家知识包含工具开发与控制
公开(公告)号：WO2004030084A2
公开(公告)日：2004-04-08
申请号：PCT/US2003/030610
申请日：2003-09-24
申请人： LAM RESEARCH CORPORATION , BAILEY, Andrew, D. , III , YADAV, Puneet , MISRA, Pratik
发明人： BAILEY, Andrew, D. , III , YADAV, Puneet , MISRA, Pratik
IPC分类号： H01L21/66
CPC分类号： H01L22/20
摘要： A system and method of for determining multiple uniformity metrics of a semiconductor wafer manufacturing process includes collecting a quantity across each one of a group of semiconductor wafers. The collected quantity data is scaled and a principal component analysis (PCA) is performed on the collected, scaled quantity data to produce a first set of metrics for the first group of semiconductor wafers. The first set of metrics including a first loads matrix and a first scores matrix.
摘要翻译：一种用于确定半导体晶片制造工艺的多个均匀性度量的系统和方法包括收集跨越一组半导体晶片中的每一个的量。收集的数量数据被缩放，并且对所收集的缩放量数据执行主分量分析（PCA），以产生第一组半导体晶片的第一组度量。第一组度量包括第一加载矩阵和第一分数矩阵。

2. 发明申请

WO2004030082A1 EXPERT KNOWLEDGE METHODS AND SYSTEMS FOR DATA ANALYSIS 审中-公开
标题翻译：专家知识数据分析方法与系统
公开(公告)号：WO2004030082A1
公开(公告)日：2004-04-08
申请号：PCT/US2003/030391
申请日：2003-09-26
申请人： LAM RESEARCH CORPORATION , YADAV, Puneet , BAILEY, Andrew, D., III
发明人： YADAV, Puneet , BAILEY, Andrew, D., III
IPC分类号： H01L21/66
CPC分类号： H01L22/20
摘要： A method for adjusting a data set defining a set of process runs, each process run having a set of data corresponding to a set of variables for a wafer processing operation is provided. A model derived from a data set is received (116). A new data set corresponding to one process run is received (118). The new data set is projected to the model (120). An outlier data point produced as a result of the projecting is identified (122). A variable corresponding to the one outlier data point is identified, the identified variable exhibiting a high contribution (126). A value for the variable from the new data set is identified. Whether the value for the variable is unimportant is determined (128). A normalized matrix of data is created, using random data and the variable that was determined to be unimportant from each of the new data set and the data set (132). The data set is updated with the normalized matrix of data.
摘要翻译：提供一种用于调整定义一组处理运行的数据集的方法，每个处理运行具有与用于晶片处理操作的一组变量相对应的一组数据。接收从数据集导出的模型（116）。接收对应于一个进程运行的新数据集（118）。新数据集投影到模型（120）。识别作为投影的结果产生的异常值数据点（122）。识别对应于一个异常数据点的变量，所识别的变量表现出高贡献（126）。识别来自新数据集的变量的值。确定变量的值是否不重要（128）。使用随机数据和被确定为与每个新数据集和数据集不重要的变量（132）来创建数据的归一化矩阵。数据集用数据的归一化矩阵更新。

3. 发明申请

WO2006036893A1 COMPUTER-IMPLEMENTED DATA PRESENTATION TECHNIQUES FOR A PLASMA PROCESSING SYSTEM 审中-公开
标题翻译：用于等离子体处理系统的计算机实现的数据呈现技术
公开(公告)号：WO2006036893A1
公开(公告)日：2006-04-06
申请号：PCT/US2005/034427
申请日：2005-09-23
申请人： LAM RESEARCH CORPORATION , BAILEY, Andrew D, III , YADAV, Puneet
发明人： BAILEY, Andrew D, III , YADAV, Puneet
IPC分类号： G06F11/30 , G06F15/00 , G21C17/00
CPC分类号： H01J37/32935
摘要： A computer-implemented data presentation technique for presenting a set of expected failure states of system-related constructs pertaining to a plasma processing system is disclosed. The technique includes receiving a set of indicia pertaining to a first system-related construct of said system-related constructs. The technique also includes computing, in accordance with a first sub-method and responsive to said receiving said first set of indicia, a first expected failure state value. The technique further includes computing a first normalized expected failure state value in accordance with a first weight; correlating said first normalized expected failure state value to a first color; and displaying said first color in a cell of an n-dimensional matrix, wherein n is a number greater than 2.
摘要翻译：公开了一种用于呈现与等离子体处理系统相关的系统相关结构的一组预期故障状态的计算机实现的数据呈现技术。该技术包括接收与所述系统相关结构的第一系统相关结构有关的一组标记。该技术还包括根据第一子方法并响应于所述接收所述第一组标记来计算第一预期故障状态值。该技术还包括根据第一权重来计算第一归一化预期故障状态值; 将所述第一归一化预期故障状态值与第一颜色相关; 以及在n维矩阵的单元格中显示所述第一颜色，其中n是大于2的数字。

4. 发明申请

WO2005076347A1 STRESS FREE ETCH PROCESSING IN COMBINATION WITH A DYNAMIC LIQUID MENISCUS 审中-公开
标题翻译：与动态液体肉汤组合的无应力加工
公开(公告)号：WO2005076347A1
公开(公告)日：2005-08-18
申请号：PCT/US2004/043909
申请日：2004-12-30
申请人： LAM RESEARCH CORPORATION , BAILEY, Andrew, D. , RAVKIN, Michael , KOROLIK, Mikhail , YADAV, Puneet
发明人： BAILEY, Andrew, D. , RAVKIN, Michael , KOROLIK, Mikhail , YADAV, Puneet
IPC分类号： H01L21/768
CPC分类号： H01L21/7684 , H01J37/32522 , H01J2237/022 , H01L21/32115 , H01L21/32136 , H01L21/67034 , H01L21/67051 , H01L21/6708 , H01L21/67253
摘要： A system and method for planarizing and controlling non-uniformity on a patterned semiconductor substrate includes receiving a patterned semiconductor substrate. The patterned semiconductor substrate having a conductive interconnect material filling multiple features in the pattern. The conductive interconnect material having an overburden portion. A bulk of the overburden portion is removed and a remaining portion of the overburden portion has a non-uniformity. The non-uniformity is mapped, optimal solution determined and a dynamic liquid meniscus etch process recipe is developed to correct the non-uniformity. A dynamic liquid meniscus etch process, using the dynamic liquid meniscus etch process recipe, is applied to correct the non-uniformity to substantially planarize the remaining portion of the overburden portion.
摘要翻译：用于平坦化和控制图案化半导体衬底上的不均匀性的系统和方法包括接收图案化的半导体衬底。图案化的半导体衬底具有填充图案中的多个特征的导电互连材料。导电互连材料具有覆盖层部分。去除大部分上覆层部分，并且覆盖层部分的剩余部分具有不均匀性。绘制不均匀性，确定最佳溶液，并开发动态液体弯月面蚀刻工艺配方以校正不均匀性。使用动态液体弯月面蚀刻工艺配方的动态液体弯月面蚀刻工艺来校正不均匀性，以使覆盖层部分的剩余部分基本平坦化。

5. 发明公开

EP1709678A1 STRESS FREE ETCH PROCESSING IN COMBINATION WITH A DYNAMIC LIQUID MENISCUS 审中-公开
标题翻译：无应力腐蚀处理与动态LIQUID半月板联合
公开(公告)号：EP1709678A1
公开(公告)日：2006-10-11
申请号：EP04815899.2
申请日：2004-12-30
申请人： LAM RESEARCH CORPORATION
发明人： BAILEY, Andrew, D. , RAVKIN, Michael , KOROLIK, Mikhail , YADAV, Puneet
IPC分类号： H01L21/768
CPC分类号： H01L21/7684 , H01J37/32522 , H01J2237/022 , H01L21/32115 , H01L21/32136 , H01L21/67034 , H01L21/67051 , H01L21/6708 , H01L21/67253
摘要： A system and method for planarizing and controlling non-uniformity on a patterned semiconductor substrate includes receiving a patterned semiconductor substrate. The patterned semiconductor substrate having a conductive interconnect material filling multiple features in the pattern. The conductive interconnect material having an overburden portion. A bulk of the overburden portion is removed and a remaining portion of the overburden portion has a non-uniformity. The non-uniformity is mapped, optimal solution determined and a dynamic liquid meniscus etch process recipe is developed to correct the non-uniformity. A dynamic liquid meniscus etch process, using the dynamic liquid meniscus etch process recipe, is applied to correct the non-uniformity to substantially planarize the remaining portion of the overburden portion.

6. 发明公开

EP1543551A2 METHOD FOR QUANTIFYING UNIFORMITY PATTERNS AND INCLUSION OF EXPERT KNOWLEDGE FOR TOOL DEVELOPMENT AND CONTROL 审中-公开
标题翻译：一种用于GLEICHFÖRMIGKEITSMUSTERN的定量和专长包容开发工具及控制方法
公开(公告)号：EP1543551A2
公开(公告)日：2005-06-22
申请号：EP03798775.7
申请日：2003-09-24
申请人： LAM RESEARCH CORPORATION
发明人： BAILEY, Andrew, D. , III , YADAV, Puneet , MISRA, Pratik
IPC分类号： H01L21/66
CPC分类号： H01L22/20
摘要： A system and method of for determining multiple uniformity metrics of a semiconductor wafer manufacturing process includes collecting a quantity across each one of a group of semiconductor wafers. The collected quantity data is scaled and a principal component analysis (PCA) is performed on the collected, scaled quantity data to produce a first set of metrics for the first group of semiconductor wafers. The first set of metrics including a first loads matrix and a first scores matrix.

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