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1. 发明申请

WO2013078420A3 SYMMETRIC RF RETURN PATH LINER 审中-公开
标题翻译： SYMMETRIC RF返回路线
公开(公告)号：WO2013078420A3
公开(公告)日：2015-06-11
申请号：PCT/US2012066404
申请日：2012-11-21
申请人： LAM RES CORP
发明人： CARMAN DAVID , TAYLOR TRAVIS , RAMDUTT DEVIN
IPC分类号： H01L21/302
CPC分类号： H01L21/02 , H01J37/32091 , H01J37/32477 , H01L21/6831
摘要： An apparatus and system for plasma processing a substrate using RF power includes a chamber (100) having walls for housing an electrostatic chuck (ESC) (227) and a top electrode (210). The top electrode is oriented opposite the ESC to define a processing region. An inner liner (200) with a tubular shaped wall (200a) is defined within and is spaced apart from the walls of the chamber and is oriented to surround the processing region. The tubular shaped wall extends a height between a top and a bottom. The tubular shaped wall has functional openings for substrate access and facilities access and dummy openings oriented to define symmetry for selected ones of the functional openings. A plurality of straps (216) are connected to the bottom of the tubular shaped wall of the inner liner and are electrically coupled to a ground ring (232) within the chamber to provide an RF power return path during plasma processing.
摘要翻译：用于使用RF功率等离子体处理衬底的装置和系统包括具有用于容纳静电吸盘（ESC）（227）和顶部电极（210）的壁的腔室（100）。顶部电极与ESC相对定向以限定处理区域。具有管状壁（200a）的内衬（200）被限定在室的壁内并与室的壁间隔开并被定向成包围处理区域。管状壁在顶部和底部之间延伸高度。管形壁具有用于基板接近和设施接近的功能开口和被定向成为所选择的功能开口限定对称性的虚拟开口。多个带（216）连接到内衬管的管状壁的底部，并且电耦合到室内的接地环（232），以在等离子体处理期间提供RF功率返回路径。

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