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1. 发明授权

US06393696B1 Method for manufacturing printed circuit board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US06393696B1
公开(公告)日：2002-05-28
申请号：US09469795
申请日：1999-12-21
申请人： Kyung-Ro Yoon , Keon-Yang Park , Byung-Kook Sun
发明人： Kyung-Ro Yoon , Keon-Yang Park , Byung-Kook Sun
IPC分类号： H05K336
CPC分类号： H01L23/49833 , H01L21/481 , H01L21/4857 , H01L2224/48091 , H01L2224/48227 , H01L2924/15153 , H01L2924/1517 , H05K1/183 , H05K3/4611 , H05K3/4697 , H05K2201/09127 , H05K2201/09845 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165 , Y10T428/24322 , H01L2924/00014
摘要： A method for manufacturing a printed circuit board is disclosed. When a metal is plated on an upper board to form a circuit, bonding fingers for being bonded with a semiconductor chip are prevented from being electroplated with a metal. That is, a slot with an ink layer formed therein is formed in each of a plurality of boards. Then window regions of different sizes are defined, and a working is carried out on the portion where the slots are not formed. That is, the copper clad laminates are subjected to a working to form slots, and an ink layer is formed within each of the slots. In this manner, during the plating of the upper face of the printed circuit board, the metal is prevented from intruding into the window region, thereby preventing the formation of a short circuit.
摘要翻译：公开了一种印刷电路板的制造方法。当金属镀在上板上以形成电路时，防止与半导体芯片接合的接合指状物被金属电镀。也就是说，在多个板中的每一个中形成有形成有油墨层的槽。然后定义不同尺寸的窗口区域，并且在未形成槽的部分进行加工。也就是说，覆铜层压板经受加工以形成槽，并且在每个槽内形成油墨层。以这种方式，在印刷电路板的上表面的电镀期间，防止金属进入窗口区域，从而防止形成短路。

2. 发明授权

US06759845B2 Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same 失效
标题翻译：使用印刷电路板制造技术的弱磁场传感器及其制造方法
公开(公告)号：US06759845B2
公开(公告)日：2004-07-06
申请号：US10140266
申请日：2002-05-08
申请人： Myung-Sam Kang , Kyoung-Won Na , Sang-On Choi , Won-Youl Choi , Jeong-Hwan Lee , Keon-Yang Park
发明人： Myung-Sam Kang , Kyoung-Won Na , Sang-On Choi , Won-Youl Choi , Jeong-Hwan Lee , Keon-Yang Park
IPC分类号： G01R3304
CPC分类号： G01R33/05 , G01C17/30 , H05K1/165 , H05K3/4602 , H05K3/4652 , H05K2201/086 , H05K2201/09536 , H05K2201/10416
摘要： A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects the Earth's magnetic field to obtain positional information is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns such that the upper and lower first driving patterns are electrically connected to each other, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers to be parallel to each other and patterned in a certain shape, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns electrically connected to the first driving patterns of the first base board to surround magnetic layers and formed with pickup patterns to surround the first and second driving patterns.
摘要翻译：公开了使用印刷电路板制造技术的弱磁场传感器及其制造方法，其检测地球磁场以获得位置信息。传感器包括第一基板，其在其上表面和下表面处形成有第一驱动图案，使得上和下第一驱动图案彼此电连接;一对第一堆叠板，其堆叠在上表面和下表面上并且形成有彼此平行并且形成一定形状的磁性层的一对第二堆叠板，并且堆叠在一对第一堆叠板的外表面上并且形成有第二驱动图案，电连接到第一基板的第一驱动图案以包围磁性层并形成有拾取图案以包围第一和第二驱动图案。

3. 发明授权

US06753682B2 Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same 失效
标题翻译：使用印刷电路板制造技术的弱磁场传感器及其制造方法
公开(公告)号：US06753682B2
公开(公告)日：2004-06-22
申请号：US10139356
申请日：2002-05-07
申请人： Myung-Sam Kang , Kyoung-Won Na , Sang-On Choi , Won-Youl Choi , Jeong-Hwan Lee , Keon-Yang Park
发明人： Myung-Sam Kang , Kyoung-Won Na , Sang-On Choi , Won-Youl Choi , Jeong-Hwan Lee , Keon-Yang Park
IPC分类号： G01R3304
CPC分类号： G01C17/30 , G01R33/05 , H05K1/165
摘要： A weak-magnetic field sensor using printed circuit board manufacturing technique which detects the Earth's magnetic field to obtain positional information, and a method of manufacturing the same is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns and first pickup patterns, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers thereon, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns and second pickup patterns electrically connected to the first driving patterns and the first pickup patterns of the first base board to surround magnetic layers. The magnetic layer, the driving patterns and the pickup patterns provided on the first base board are oriented to be perpendicular to those provided under the first base board.
摘要翻译：公开了使用检测地球磁场以获得位置信息的印刷电路板制造技术的弱磁场传感器及其制造方法。传感器包括：第一基板，其在其上表面和下表面上形成有第一驱动图案和第一拾取图案;一对第一堆叠板，其堆叠在第一基板的上表面和下表面上，并且形成有磁性层叠在一起的一对第二堆叠板和堆叠在一对第一堆叠板的外表面上并且形成有第二驱动图案和电连接到第一驱动图案的第二拾取图案和第一驱动图案的第一拾取图案基板以环绕磁层。设置在第一基板上的磁性层，驱动图案和拾取图案被定向为垂直于设置在第一基板下方的磁性层。

4. 发明授权

US06582616B2 Method for preparing ball grid array board 失效
公开(公告)号：US06582616B2
公开(公告)日：2003-06-24
申请号：US09984284
申请日：2001-10-29
申请人： Myung-Sam Kang , Keon-Yang Park , Won-Hoe Kim
发明人： Myung-Sam Kang , Keon-Yang Park , Won-Hoe Kim
IPC分类号： H01B1300
CPC分类号： H01L21/4803 , H01L21/4857 , H01L23/13 , H01L23/49833 , H01L2924/0002 , H05K3/4611 , Y10T29/49155 , Y10T29/49169 , H01L2924/00
摘要： Disclosed are a method for preparing a high performance BGA board containing a plurality of printed circuit boards in which a conductor circuit, a bonding pad electrically connected to a semiconductor chip, and an inner hole for mounting a semiconductor chip are formed, by primary- and secondary-laminating a plurality of boards. The present invention enjoys advantages in that contamination due to an outer layer surface treatment of the board laminate can be prevented, and a process for preventing a contamination of an inner hole can be omitted, and also a defective proportion can be reduced remarkably in comparison with prior arts by applying a pressure uniformly during a secondary lamination. Furthermore, a BGA board according to the invention has an ideal ball pitch and multi-fins, excellent electrical and thermal properties, also can be applied in the case of high current, and can be easily mounted on a chip.

5. 发明授权

US06755229B2 Method for preparing high performance ball grid array board and jig applicable to said method 失效
标题翻译：制备适用于所述方法的高性能球栅阵列板和夹具的方法
公开(公告)号：US06755229B2
公开(公告)日：2004-06-29
申请号：US09984282
申请日：2001-10-29
申请人： Myung-Sam Kang , Keon-Yang Park , Jang-Kyu Kang
发明人： Myung-Sam Kang , Keon-Yang Park , Jang-Kyu Kang
IPC分类号： B32B3500
CPC分类号： H01L21/50 , H01L23/36 , H01L23/49816 , H01L2924/0002 , Y10T156/1744 , H01L2924/00
摘要： Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.
摘要翻译：公开了一种制备适用于该方法的高性能BGA板和夹具的方法。该方法包括使用夹具将粘合剂预粘合到BGA板层叠结构或散热片上; 并且通过使用夹具将BGA板层压结构或粘合剂预先粘附在预粘合步骤中的散热器分别主要粘合到散热器或BGA板层叠结构。可以通过使用单独的散热器和无带式散热器的带状夹具来制备高性能BGA板，并且可以防止散热器的镀镍侧被污染。

6. 发明授权

US06747450B2 Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same 失效
标题翻译：使用印刷电路板制造技术的弱磁场传感器及其制造方法
公开(公告)号：US06747450B2
公开(公告)日：2004-06-08
申请号：US10140294
申请日：2002-05-08
申请人： Myung-Sam Kang , Kyoung-Won Na , Sang-On Choi , Won-Youl Choi , Jeong-Hwan Lee , Keon-Yang Park
发明人： Myung-Sam Kang , Kyoung-Won Na , Sang-On Choi , Won-Youl Choi , Jeong-Hwan Lee , Keon-Yang Park
IPC分类号： G01R3304
CPC分类号： H05K1/165 , G01R33/05 , H05K3/4602 , H05K3/4652 , H05K2201/086 , H05K2201/09536 , H05K2201/10416
摘要： A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects earth magnetism to obtain positional information is disclosed. The sensor comprises a magnetic layer patterned in a certain shape; a first stacked board stacked on a lower surface of the magnetic layer and formed with a first driving pattern; a second stacked board stacked on an upper surface of the magnetic layer and formed with a second driving pattern, the first and second driving patterns being electrically connected to each other; a third lower stacked board stacked on a lower surface of the first stacked board and formed with a first pickup pattern; and a third upper stacked board stacked on an upper surface of the second stacked board and formed with a second pickup pattern, the third lower and upper stacked boards being electrically connected to each other.
摘要翻译：公开了使用印刷电路板制造技术的弱磁场传感器及其制造方法，其检测地磁以获得位置信息。传感器包括以特定形状图案化的磁性层; 堆叠在所述磁性层的下表面上并形成有第一驱动图案的第一堆叠板; 堆叠在所述磁性层的上表面上并形成有第二驱动图案的第二堆叠板，所述第一和第二驱动图案彼此电连接; 堆叠在第一堆叠板的下表面上并形成有第一拾取图案的第三下堆叠板; 以及堆叠在所述第二堆叠板的上表面上并形成有第二拾取图案的第三上堆叠板，所述第三下堆叠板和上堆叠板彼此电连接。

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