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    • 1. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08344454B2
    • 2013-01-01
    • US13048926
    • 2011-03-16
    • Kyoya NittaYutaka Hoshino
    • Kyoya NittaYutaka Hoshino
    • H01L27/12
    • H01L29/42384H01L21/84H01L27/1203H01L29/0653H01L29/4908H01L29/78612H01L29/78654H01L2924/0002H01L2924/00
    • An object of the invention is to provide a semiconductor device having improved performance, high reliability, and a reduced chip size, in particular, to provide a semiconductor device having an MOSFET over an SOI substrate capable of maintaining its reliability while controlling the potential of a well below a gate electrode and preventing generation of parasitic capacitance. Generation of parasitic capacitance is prevented by controlling the potential of a well below a gate electrode by using a well contact plug passing through a hole portion formed in a gate electrode wiring. Generation of defects in a gate insulating film is prevented by making use of a gettering effect produced by causing an element isolation region to extend along the gate electrode.
    • 本发明的目的是提供一种具有改进的性能,高可靠性和减小的芯片尺寸的半导体器件,特别是提供一种在SOI衬底上具有MOSFET的半导体器件,其能够保持其可靠性,同时控制一个 远低于栅电极并防止寄生电容的产生。 通过使用穿过形成在栅电极布线中的孔部的阱接触塞来控制阱下方的阱的电位来防止寄生电容的产生。 通过利用通过使元件隔离区域沿着栅电极延伸而产生的吸杂效应来防止栅绝缘膜中的缺陷的产生。