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    • 3. 发明授权
    • Three-level power conversion apparatus
    • 三电平转换装置
    • US09143049B2
    • 2015-09-22
    • US13503045
    • 2009-11-17
    • Kimiyuki KoyanagiMasahiro Kinoshita
    • Kimiyuki KoyanagiMasahiro Kinoshita
    • H02M7/483H02M7/00
    • H02M7/003H02M7/483H02M7/487Y10T307/685
    • Wiring between semiconductor modules and a direct current power supply circuit, which construct a three-level power conversion apparatus, is made to be low inductance, so reduction in size and cost can be attained easily. In cases where a connection is made between direct current power supplies (electrolytic capacitors) and IGBT modules of a three-level inverter, a wiring conductor for a bi-directional switch part is divided into three conductors or two conductors on a same surface, and these conductors are sandwiched by a P conductor and an N conductor, which are arranged at outer sides thereof, respectively, through insulating materials, so a three-layer wiring structure of a sealed structure is formed. As a result, wiring inductance can be made small even with a small number of laminated layers, so that the reduction in size and cost of the apparatus as a whole is achieved.
    • 将构成三电平电力转换装置的半导体模块与直流电源电路之间的配线变成低电感,能够容易地实现尺寸和成本的降低。 在直流电源(电解电容器)和三电平逆变器的IGBT模块之间进行连接的情况下,用于双向开关部件的布线导体在相同的表面上分为三个导体或两个导体,并且 这些导体被分别通过绝缘材料布置在其外侧的P导体和N导体夹持,因此形成密封结构的三层布线结构。 结果,即使使用少量的层叠层也能够使布线电感变小,从而实现整体的装置的尺寸和成本的降低。
    • 4. 发明申请
    • THREE-LEVEL POWER CONVERSION APPARATUS
    • 三电平转换装置
    • US20120205983A1
    • 2012-08-16
    • US13503045
    • 2009-11-17
    • Kimiyuki KoyanagiMasahiro Kinoshita
    • Kimiyuki KoyanagiMasahiro Kinoshita
    • H02J1/00
    • H02M7/003H02M7/483H02M7/487Y10T307/685
    • Wiring between semiconductor modules and a direct current power supply circuit, which construct a three-level power conversion apparatus, is made to be low inductance, so that reduction in size and cost can be attained easily.In cases where a connection is made between direct current power supplies (electrolytic capacitors) 25, 26 and IGBT modules 16 through 18 of a three-level inverter, a wiring conductor for a bi-directional switch part is divided into three conductors 35, 42, 43 or two conductors 35, 42 on a same surface, and these conductors are sandwiched by a P conductor 33 and an N conductor 37, which are arranged at outer sides thereof, respectively, through insulating materials, so that a three-layer wiring structure of a sealed structure is formed. As a result of this, wiring inductance can be made small even with a small number of laminated layers, so that the reduction in size and cost of the apparatus as a whole is achieved.
    • 将构成三电平电力转换装置的半导体模块与直流电源电路之间的配线变成低电感,能够容易地实现尺寸和成本的降低。 在三电平逆变器的直流电源(电解电容器)25,26与IGBT模块16〜18之间进行连接的情况下,将双向开关部的布线导体分割成三个导体35,42 ,43或同一表面上的两个导体35,42,并且这些导体分别通过绝缘材料被分别布置在其外侧的P导体33和N导体37夹持,使得三层布线 形成密封结构的结构。 其结果是,即使采用少量层叠层也能够使布线电感变小,从而能够实现装置的整体尺寸和成本的降低。