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1. 发明授权

US08387679B2 Vacuum die-casting machine 有权
标题翻译：真空压铸机
公开(公告)号：US08387679B2
公开(公告)日：2013-03-05
申请号：US13177171
申请日：2011-07-06
申请人： Kyohei Inaba , Kenji Yamazaki , Minoru Yamamoto , Akihito Mizuno
发明人： Kyohei Inaba , Kenji Yamazaki , Minoru Yamamoto , Akihito Mizuno
IPC分类号： B22D27/00
CPC分类号： B22D17/14 , B22D17/2007
摘要： A reduced size vacuum die-casting machine wherein an amount of powder release agent which is fed to a mold cavity each time is stable and loss of velocity of the air flow for sucking out the powder release agent is difficult, the apparatus provided with a powder control valve which has a powder release agent passage through which a powder release agent passes and which moves back and forth inside of a sleeve to switch between a state communicating a discharge hole with a molten metal holding chamber and a state communicating a discharge hole with a powder release agent passage, the powder release agent passage of the powder control valve formed inside of the powder control valve, the inlet and outlet of the powder release agent passage being formed at the outer surface of the powder control valve.
摘要翻译：一种减小尺寸的真空压铸机，其中每次进料到模腔中的粉末脱模剂的量是稳定的，并且用于吸出粉末脱模剂的空气流速的损失是困难的，该设备设置有粉末控制阀，其具有粉末脱模剂通道，粉剂脱模剂通过该通道，并且在套筒内前后移动以在连通排出孔与熔融金属容纳室的状态之间切换，以及将排出孔与粉末脱模剂通道，在粉末控制阀内部形成粉末控制阀的粉末脱模剂通道，粉末释放剂通道的入口和出口形成在粉末控制阀的外表面。

2. 发明申请

US20110177292A1 CERAMIC ASSEMBLED BOARD, METHOD OF MANUFACTURING THE SAME, CERAMIC SUBSTRATE AND CERAMIC CIRCUIT SUBSTRATE 审中-公开
标题翻译：陶瓷组装板，其制造方法，陶瓷基板和陶瓷电路基板
公开(公告)号：US20110177292A1
公开(公告)日：2011-07-21
申请号：US13000248
申请日：2009-06-22
申请人： Hiroyuki Teshima , Junichi Watanabe , Shinichi Kazui , Makoto Sasaki , Akihito Mizuno
发明人： Hiroyuki Teshima , Junichi Watanabe , Shinichi Kazui , Makoto Sasaki , Akihito Mizuno
IPC分类号： B32B3/00
CPC分类号： H05K1/0306 , B23K26/40 , B23K2103/52 , H01L21/481 , H01L23/3735 , H01L2924/0002 , H05K3/0029 , H05K3/0052 , H05K2201/09036 , H05K2201/0909 , Y10T428/24479 , H01L2924/00
摘要： A ceramic assembled board shows an advantageous dividablility of allowing the board to be divided when intended and not allowing it to be divided with ease when unintended. A ceramic substrate shows an excellent degree of dimensional precision and bending strength. A ceramic circuit substrate shows a high dielectric strength. A ceramic assembled board is formed by cutting continuous dividing grooves on one or both of the surfaces of a sintered ceramic board by way of laser machining to produce a large number of circuit substrates and at least one of the continuous grooves has a largest depth section and a smallest depth section with a depth difference Δd of 10 μm ≦Δd≦50 μm. A ceramic substrate is produced by dividing the ceramic assembled board and at least one of its lateral surfaces is a surface formed by dividing the ceramic assembled board along the continuous grooves, the arithmetic mean roughness Ra2 of the machined surfaces of the continuous grooves being smaller than the arithmetic mean roughness Ra1 of the surfaces of broken sections with regard to the arithmetic mean roughness Ra of the lateral surfaces.
摘要翻译：陶瓷组装板显示出有利的可分割性，允许板在预期时分开，并且不允许在不期望的情况下分开板。陶瓷基板显示出极好的尺寸精度和弯曲强度。陶瓷电路基板显示出高介电强度。通过激光加工在烧结陶瓷板的一个或两个表面上切割连续的分隔槽来形成陶瓷组装板，以产生大量的电路基板，并且至少一个连续的凹槽具有最大的深度部分和具有深度差Dgr的最小深度部分，d为10μm和nlE; Dgr; d＆nlE;50μm。通过分割陶瓷组装板来制造陶瓷基板，并且其侧面中的至少一个是沿着连续槽分割陶瓷组装板而形成的表面，连续槽的加工表面的算术平均粗糙度Ra2小于断面的表面的算术平均粗糙度Ra1相对于侧面的算术平均粗糙度Ra。

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