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    • 3. 发明专利
    • Ceramic structure
    • 陶瓷结构
    • JP2005239453A
    • 2005-09-08
    • JP2004048440
    • 2004-02-24
    • Kyocera Corp京セラ株式会社
    • TANIGAWA KAZUHISAIHARA TOSHIYUKI
    • C04B37/00
    • PROBLEM TO BE SOLVED: To provide a ceramic structure having excellent joining strength.
      SOLUTION: The ceramic structure 1 is formed by joining ceramic members comprising the same material to each other through a joining material made substantially from a the same material as the ceramic member to make a hollow box type structure. The joining material has 0.05-0.5 mm thickness in the vertical direction to a joining surface and is formed to be projected in a zone ≥70% of the joining surface facing a hollow part in the width direction parallel to the joining surface and to cover a side wall adjacent to the joining surface. The ratio (w/t) of the projected distance (w) of the joining material from the joining surface to the thickness (t) is 2-10 and the ratio (δ/t) of the coating distance (δ) of the joining material from the joining surface to the the thickness (t) is 0.5-5.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供具有优异接合强度的陶瓷结构。 解决方案:陶瓷结构体1通过将基本上由与陶瓷构件相同的材料制成的接合材料彼此接合而构成相同材料的陶瓷构件而形成,以形成中空盒型结构。 接合材料在与接合面的垂直方向上具有0.05-0.5mm的厚度,并且形成为在与接合表面平行的宽度方向上面向中空部的接合面的≥70%的区域中突出,并且覆盖 侧壁与接合面相邻。 接合材料从接合面的投影距离(w)与厚度(t)的比(w / t)为2-10,接合面的涂布距离(δ)的比(δ/ t) 从接合面到厚度(t)的材料为0.5-5。 版权所有(C)2005,JPO&NCIPI
    • 5. 发明专利
    • Method for manufacturing ceramic body, ceramic component for semiconductor manufacturing apparatus, and ceramic component for liquid crystal manufacturing apparatus
    • 用于制造陶瓷体的方法,用于半导体制造装置的陶瓷部件和用于液晶制造装置的陶瓷部件
    • JP2007261929A
    • 2007-10-11
    • JP2006093203
    • 2006-03-30
    • Kyocera Corp京セラ株式会社
    • TANIGAWA KAZUHISATAKESHITA YOSHIHIROSUGANO SHINTANABE YOSHIHIROHONDA KENJI
    • C04B35/638
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic body in which de-binder treatment is performed by calculating a production amount and pressure of a pyrolysis gas produced during removing a binder and preliminarily predicting the temperature rising rate at which cracking does not occur. SOLUTION: The method for manufacturing the ceramic body comprises adding a binder to ceramic raw materials, kneading the mixture, molding the resultant pre-molding raw materials to obtain a molded product, and subjecting the molded product to de-binder treatment to remove the binder from the molded product, then firing the same, in which the de-binder treatment is performed at a temperature rising rate at which the maximum gaseous pressure Pmax within the molded product and a reference gas value Pref satisfy the relation Pmax≤Pref. (1) The maximum gaseous pressure Pmax within the molded product: the maximum gaseous pressure value obtained by the thermal fluid analysis from the production amount of the gas during removing the binder, the de-binder atmosphere, the permeation resistance of the molded product, and the shape of the molded product. (2) The reference gaseous pressure value Pref: the maximum pressure value which is measured in the same manner as with the maximum gaseous pressure Pmax by using the molded product previously molded to a prescribed size and at which the cracking does not occur. COPYRIGHT: (C)2008,JPO&INPIT
    • 解决问题的方法:提供一种陶瓷体的制造方法,其中通过计算在除去粘合剂期间产生的热分解气体的产量和压力进行去粘合剂处理,并且预先预测其中升温速率 不会发生开裂。 < P>解决方案:陶瓷体的制造方法包括在陶瓷原料中添加粘合剂,捏合混合物,成型所得的预成型原料以得到成型体,将成型体进行脱粘合剂处理 从模塑产品中除去粘合剂,然后对其进行烧制,其中以粘合剂处理以成型产品内的最大气体压力Pmax和参考气体值Pref满足关系Pmax≤Pref的升温速率进行 。 (1)成型体内的最大气体压力Pmax:通过热流体分析获得的最大气体压力值,从除去粘合剂前的气体的产生量,脱粘合剂气氛,成型品的耐渗透性, 和成型品的形状。 (2)参考气体压力值Pref:通过使用预先模制成规定尺寸并且不发生裂纹的模制产品,以与最大气体压力Pmax相同的方式测量的最大压力值。 版权所有(C)2008,JPO&INPIT
    • 6. 发明专利
    • Electric element module
    • 电气元件模块
    • JP2005072456A
    • 2005-03-17
    • JP2003302928
    • 2003-08-27
    • Kyocera Corp京セラ株式会社
    • ONITANI MASAMITSUTERASONO HIROBUMITANIGAWA KAZUHISA
    • H01L23/12H01L23/13
    • H01L2224/83385
    • PROBLEM TO BE SOLVED: To provide an electric element module capable of enhancing connection reliability between a ceramic circuit board and an electric element by suppressing position deviation of the electric element in the electric element module with the electric element packaged on the metal circuit board of the ceramic circuit board composed of a ceramic substrate and the metal circuit board.
      SOLUTION: In the ceramic circuit board composed of a ceramic substrate 1 and a metal circuit board 3, the metal circuit board 3 is formed on at least one principal surface of the ceramic substrate 1, and a recess 3a wherein an electric element 5 is packaged is formed on the principal surface of the metal circuit board 3 opposed to a side that is abutted with the ceramic substrate 1.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种电元件模块,其能够通过抑制电元件模块中的电气元件与金属电路上封装的电气元件的位置偏差来提高陶瓷电路板和电气元件之间的连接可靠性。 陶瓷电路板由陶瓷基板和金属电路板组成。 解决方案:在由陶瓷基板1和金属电路板3构成的陶瓷电路板中,金属电路板3形成在陶瓷基板1的至少一个主表面上,而凹部3a形成在电气元件 5被封装形成在金属电路板3的与陶瓷基板1相接的一侧相对的主表面上。版权所有(C)2005,JPO&NCIPI