专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08039972B2 Printed circuit board and method thereof and a solder ball land and method thereof 有权
标题翻译：印刷电路板及其方法和焊球地及其方法
公开(公告)号：US08039972B2
公开(公告)日：2011-10-18
申请号：US12458429
申请日：2009-07-13
申请人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
发明人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/282 , H01L21/4853 , H01L23/49816 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05567 , H01L2224/16503 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H05K3/243 , H05K3/3457 , H05K2201/0391 , H05K2201/0989 , H01L2924/00014 , H01L2924/00012
摘要： A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.
摘要翻译：一种印刷电路板及其方法和焊球地及其方法。示例性印刷电路板（PCB）可以包括具有构造成用于第一类型电阻的第一表面处理部分的第一焊球焊盘和具有被配置为用于第二类型电阻的第二表面处理部分的第二焊球焊盘。示例性焊球焊盘可以包括被配置为用于第一类型电阻的第一表面处理部分和被配置用于第二类型电阻的第二表面处理部分。第一示例性方法可以包括首先处理第一焊球焊盘的第一表面以增加第一类型的电阻，并且第二处理第二焊球焊盘的第二表面以增加除第一类型电阻之外的第二类型的电阻。第二示例性方法可以包括首先处理焊球焊盘以增加第一类型的电阻，并且第二次处理焊球焊盘以增加除第一类型电阻之外的第二类型的电阻。

2. 发明申请

US20090278249A1 Printed circuit board and method thereof and a solder ball land and method thereof 有权
标题翻译：印刷电路板及其方法和焊球地及其方法
公开(公告)号：US20090278249A1
公开(公告)日：2009-11-12
申请号：US12458429
申请日：2009-07-13
申请人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
发明人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
IPC分类号： H01L23/498 , H05K1/11 , H01B5/00
CPC分类号： H05K3/282 , H01L21/4853 , H01L23/49816 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05567 , H01L2224/16503 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H05K3/243 , H05K3/3457 , H05K2201/0391 , H05K2201/0989 , H01L2924/00014 , H01L2924/00012
摘要： A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.
摘要翻译：一种印刷电路板及其方法和焊球地及其方法。示例性印刷电路板（PCB）可以包括具有构造成用于第一类型电阻的第一表面处理部分的第一焊球焊盘和具有被配置为用于第二类型电阻的第二表面处理部分的第二焊球焊盘。示例性焊球焊盘可以包括被配置为用于第一类型电阻的第一表面处理部分和被配置用于第二类型电阻的第二表面处理部分。第一示例性方法可以包括首先处理第一焊球焊盘的第一表面以增加第一类型的电阻，并且第二处理第二焊球焊盘的第二表面以增加除第一类型电阻之外的第二类型的电阻。第二示例性方法可以包括首先处理焊球焊盘以增加第一类型的电阻，并且第二次处理焊球焊盘以增加除第一类型电阻之外的第二类型的电阻。

3. 发明授权

US07576438B2 Printed circuit board and method thereof and a solder ball land and method thereof 有权
公开(公告)号：US07576438B2
公开(公告)日：2009-08-18
申请号：US11486064
申请日：2006-07-14
申请人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
发明人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/282 , H01L21/4853 , H01L23/49816 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05567 , H01L2224/16503 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H05K3/243 , H05K3/3457 , H05K2201/0391 , H05K2201/0989 , H01L2924/00014 , H01L2924/00012
摘要： A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.

4. 发明申请

US20070040282A1 Printed circuit board and method thereof and a solder ball land and method thereof 有权
标题翻译：印刷电路板及其方法和焊球地及其方法
公开(公告)号：US20070040282A1
公开(公告)日：2007-02-22
申请号：US11486064
申请日：2006-07-14
申请人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wa-su Sin , Ho-geon Song , Jun-young Ko
发明人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wa-su Sin , Ho-geon Song , Jun-young Ko
IPC分类号： H01L23/48
CPC分类号： H05K3/282 , H01L21/4853 , H01L23/49816 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05567 , H01L2224/16503 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H05K3/243 , H05K3/3457 , H05K2201/0391 , H05K2201/0989 , H01L2924/00014 , H01L2924/00012
摘要： A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.
摘要翻译：一种印刷电路板及其方法和焊球地及其方法。示例性印刷电路板（PCB）可以包括具有构造成用于第一类型电阻的第一表面处理部分的第一焊球焊盘和具有被配置为用于第二类型电阻的第二表面处理部分的第二焊球焊盘。示例性焊球焊盘可以包括被配置为用于第一类型电阻的第一表面处理部分和被配置用于第二类型电阻的第二表面处理部分。第一示例性方法可以包括首先处理第一焊球焊盘的第一表面以增加第一类型的电阻，并且第二处理第二焊球焊盘的第二表面以增加除第一类型电阻之外的第二类型的电阻。第二示例性方法可以包括首先处理焊球焊盘以增加第一类型的电阻，并且第二次处理焊球焊盘以增加除第一类型电阻之外的第二类型的电阻。

5. 发明申请

US20070057410A1 Method of fabricating wafer chips 审中-公开
标题翻译：制造晶圆片的方法
公开(公告)号：US20070057410A1
公开(公告)日：2007-03-15
申请号：US11500345
申请日：2006-08-08
申请人： Dae-sang Chan , Jun-young Ko , Sang-jun Kim , Wha-su Sin
发明人： Dae-sang Chan , Jun-young Ko , Sang-jun Kim , Wha-su Sin
IPC分类号： H05B6/00
CPC分类号： H01L21/67132
摘要： Example embodiments of the present invention relate to a method of packaging a semiconductor device. Other example embodiments of the present invention relate to a method of fabricating wafer chips for packaging a semiconductor device. Provided is a method of fabricating a wafer chips, which can perform a reliable pick-up process by removing the adhesive component adhering onto the cutting surfaces of the wafer chips, the diced DAF and the first base film. The method includes preparing at least one wafer, attaching at least one film onto a back surface of the wafer to support the wafer, forming wafer chips by dicing the wafer, detaching the at least one film from the wafer chips and attaching at least one base film onto the wafer chips to support the wafer chips.
摘要翻译：本发明的示例性实施例涉及一种封装半导体器件的方法。本发明的其它示例性实施例涉及制造用于封装半导体器件的晶片芯片的方法。提供一种制造晶片芯片的方法，其可以通过去除附着在晶片芯片，切割的DAF和第一基底膜的切割表面上的粘合剂成分来执行可靠的拾取过程。该方法包括制备至少一个晶片，将至少一个膜附着到晶片的背面上以支撑晶片，通过切割晶片形成晶片芯片，将晶片芯片中的至少一个薄膜分开并将至少一个基底胶片到晶片芯片上以支撑晶片芯片。

6. 发明申请

US20070193920A1 Apparatus and method for separating a semiconductor chip 审中-公开
标题翻译：用于分离半导体芯片的装置和方法
公开(公告)号：US20070193920A1
公开(公告)日：2007-08-23
申请号：US11709853
申请日：2007-02-23
申请人： Jun-young Ko , Dae-sang Chan , Sang-jun Kim
发明人： Jun-young Ko , Dae-sang Chan , Sang-jun Kim
IPC分类号： B65D85/00
CPC分类号： H01L21/67132 , H01L21/67092
摘要： Example embodiments may provide an apparatus for and method of separating a semiconductor chip. In the example embodiments, a separating plate having an end insertable between a base tape and an adhesive film may move back and forth in a direction perpendicular to an edge of the semiconductor chip so as to separate the semiconductor chip. Example embodiments may allow fragile, thin semiconductor chips to be safely packaged without damage and thus may increase semiconductor chip yield.
摘要翻译：示例性实施例可以提供用于分离半导体芯片的装置和方法。在示例实施例中，具有可插入基带和粘合剂膜之间的端部的分离板可以在垂直于半导体芯片的边缘的方向上来回移动，以便分离半导体芯片。示例性实施例可以允许脆弱的薄半导体芯片安全地封装而不损坏，因此可以提高半导体芯片的产量。

7. 发明申请

US20140208850A1 APPARATUS AND METHOD OF DETECTING A DEFECT OF A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：检测半导体器件缺陷的装置和方法
公开(公告)号：US20140208850A1
公开(公告)日：2014-07-31
申请号：US13753111
申请日：2013-01-29
申请人： Geun-woo Kim , Hyun Kim , Yun-sik Yoo , Sang-jun Kim , Jae-yong Park , Tae-gyeong Chung
发明人： Geun-woo Kim , Hyun Kim , Yun-sik Yoo , Sang-jun Kim , Jae-yong Park , Tae-gyeong Chung
IPC分类号： G01N29/14
CPC分类号： G01N29/14 , G01N29/4454 , G01N2291/0289 , H01L21/67288
摘要： A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.
摘要翻译：一种半导体器件缺陷检测装置，包括：设置在半导体处理设备上的传感器，所述传感器被配置为检测与半导体处理设备接触的半导体器件发射的信号; 以及信号分析器，被配置为基于在预定频率范围内的检测信号来确定半导体器件是否有缺陷。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式