专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07830528B2 3D image measuring apparatus and method thereof 有权
标题翻译： 3D图像测量装置及其方法
公开(公告)号：US07830528B2
公开(公告)日：2010-11-09
申请号：US11637040
申请日：2006-12-12
申请人： Kwangill Koh , Eun Hyoung Seong , Moon Young Jeon , Min Young Kim , Seung Jun Lee
发明人： Kwangill Koh , Eun Hyoung Seong , Moon Young Jeon , Min Young Kim , Seung Jun Lee
IPC分类号： G01B11/24
CPC分类号： G01B11/25 , G01S17/89
摘要： A three dimensional (3D) measuring apparatus and method are provided. The 3D image measuring apparatus includes a stage, a projection portion, and an imaging portion. The projection portion includes first and second lights, first and second lattices, and first and second projection lenses. The imaging portion includes an imaging lens and a camera. The projection portion further includes a movement instrument which controls the first and the second lattices through a predetermined number of movement actions during operation of the measuring apparatus.
摘要翻译：提供三维（3D）测量装置和方法。 3D图像测量装置包括台，投影部和成像部。突起部分包括第一和第二光，第一和第二晶格，以及第一和第二投影透镜。成像部分包括成像透镜和照相机。突起部还包括运动器械，其在测量装置的操作期间通过预定数量的移动动作来控制第一和第二格子。

2. 发明授权

US06607071B1 Sealed test chamber for module IC handler 失效
标题翻译：模块IC处理器的密封测试室
公开(公告)号：US06607071B1
公开(公告)日：2003-08-19
申请号：US09417841
申请日：1999-10-14
申请人： Tae Sung An , Chan Ho Park , Yong Soo Moon , Eun Hyoung Seong , Ku Kyong Kim
发明人： Tae Sung An , Chan Ho Park , Yong Soo Moon , Eun Hyoung Seong , Ku Kyong Kim
IPC分类号： B65G2500
CPC分类号： G01R31/2862
摘要： The present invention relates to an improved chamber for a module IC handler including a pre-heater for heating module ICs to a set temperature. A receiving piece is installed in a heating chamber and is formed with a plurality of receiving grooves for receiving a carrier holding module ICs. An operating piece is disposed the chamber adjacent the receiving piece. An upper surface the operating piece includes a plurality of receiving grooves of the same interval as the receiving grooves of the receiving piece. In operation, the operating piece raises a module IC carrier from a first groove on the receiving piece and translates the module IC carrier by a distance roughly equivalent to the thickness of the module IC carrier. After translating the module IC carrier, the operating piece lowers the module IC carrier into an adjacent second groove on the receiving piece. By repeating this cycle, the operating piece moves a module IC carrier down the receiving piece, a groove at a time, while the module ICs are being heated, to a feeding means. The feeding means moves the module IC carrier to a test site. Shutters prevent heat from escaping the chamber while the module IC carriers move through the chamber.
摘要翻译：本发明涉及用于模块IC处理器的改进室，其包括用于将模块IC加热到设定温度的预热器。接收片安装在加热室中，并且形成有用于接收载体保持模块IC的多个接收槽。操作件将腔室设置在接收件附近。操作件的上表面包括与接收片的接收槽相同间隔的多个接收槽。在操作中，操作件从接收片上的第一凹槽升起模块IC载体，并将模块IC载体翻转大致等于模块IC载体的厚度。在模块IC载体翻译之后，操作件将模块IC载体降低到接收件上相邻的第二凹槽中。通过重复该循环，操作件在模块IC被加热的同时将模块IC载体沿着接收件移动，同时将凹槽移动到馈送装置。进给装置将模块IC载体移动到测试位置。当模块IC载体移动通过室时，百叶窗防止热量逸出室。

3. 发明授权

US06525527B1 Cooling system for a module IC handler 失效
标题翻译：模块IC处理器的冷却系统
公开(公告)号：US06525527B1
公开(公告)日：2003-02-25
申请号：US09713028
申请日：2000-11-16
申请人： Eun Hyoung Seong , Tae Sung An , Chan Ho Park
发明人： Eun Hyoung Seong , Tae Sung An , Chan Ho Park
IPC分类号： G01R104
CPC分类号： G01R1/44 , G01R1/0458
摘要： A cooling system for a module IC handler is provided. The cooling system includes an air jet for cooling heat generated from the module IC where the IC is tested. The cooling system includes a base plate, an air jet body mounted on the base plate and having one or more coupling portions, a plurality of plates provided at one side of the air jet body, and a cover provided at the other side of the air jet body. Since the cooling system rapidly cools the heated module IC, the number of module ICs that fail can be reduced, thus resulting in an improvement in the reliability of the products.
摘要翻译：提供了一种用于模块IC处理器的冷却系统。冷却系统包括用于冷却由IC测试的模块IC产生的热量的空气喷射。冷却系统包括基板，安装在基板上并具有一个或多个联接部分的空气喷射体，设置在空气喷射体一侧的多个板，以及设置在空气另一侧的盖喷射体。由于冷却系统对加热的模块IC进行快速冷却，所以可以减少故障的模块IC的数量，从而提高产品的可靠性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式