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1. 发明授权

US07601555B2 Wafer inspection system and method thereof 有权
标题翻译：晶圆检查系统及其方法
公开(公告)号：US07601555B2
公开(公告)日：2009-10-13
申请号：US11132352
申请日：2005-05-19
申请人： Kwang-soo Kim , Koung-su Shin , Seung-min Choi , Yu-han Jeong
发明人： Kwang-soo Kim , Koung-su Shin , Seung-min Choi , Yu-han Jeong
IPC分类号： H01L21/00
CPC分类号： G06T7/0004 , G01R31/2831 , G06T2207/30148
摘要： A wafer inspection system includes an electrical testing part to control a probe to be in contact with a pad of a wafer to perform a predetermined electrical test, a defect detecting part to detect a defect in the wafer passing through the electrical test, a defect sorting part to sort the defect detected in the defect detecting part by an in-line method, and a defective determining part to determine whether the wafer is a defective according to a sorting result of the defect sorting part. The wafer inspection system and a method thereof can determine the kinds of the defect in the wafer during a fabricating procedure, so that it is possible to instantly and correctly determine whether the die on the wafer is a defective.
摘要翻译：晶片检查系统包括电测试部分，用于控制探针与晶片的焊盘接触以执行预定的电测试;缺陷检测部分，用于检测通过电测试的晶片中的缺陷，缺陷分类通过在线方式对在缺陷检测部分中检测到的缺陷进行分类的部分，以及根据缺陷分类部分的分类结果确定晶片是否有缺陷的缺陷确定部分。晶片检查系统及其方法可以在制造过程中确定晶片中的缺陷的种类，使得可以立即且正确地确定晶片上的裸片是否有缺陷。

2. 发明申请

US20050282299A1 Wafer inspection system and method thereof 有权
标题翻译：晶圆检查系统及其方法
公开(公告)号：US20050282299A1
公开(公告)日：2005-12-22
申请号：US11132352
申请日：2005-05-19
申请人： Kwang-soo Kim , Koung-su Shin , Seung-min Choi , Yu-han Jeong
发明人： Kwang-soo Kim , Koung-su Shin , Seung-min Choi , Yu-han Jeong
IPC分类号： H01L21/66 , G01R31/26 , G01R31/28 , G06F19/00 , G06T7/00
CPC分类号： G06T7/0004 , G01R31/2831 , G06T2207/30148
摘要： A wafer inspection system includes an electrical testing part to control a probe to be in contact with a pad of a wafer to perform a predetermined electrical test, a defect detecting part to detect a defect in the wafer passing through the electrical test, a defect sorting part to sort the defect detected in the defect detecting part by an in-line method, and a defective determining part to determine whether the wafer is a defective according to a sorting result of the defect sorting part. The wafer inspection system and a method thereof can determine the kinds of the defect in the wafer during a fabricating procedure, so that it is possible to instantly and correctly determine whether the die on the wafer is a defective.
摘要翻译：晶片检查系统包括电测试部分，用于控制探针与晶片的焊盘接触以执行预定的电测试;缺陷检测部分，用于检测通过电测试的晶片中的缺陷，缺陷分类通过在线方式对在缺陷检测部分中检测到的缺陷进行分类的部分，以及根据缺陷分类部分的分类结果确定晶片是否有缺陷的缺陷确定部分。晶片检查系统及其方法可以在制造过程中确定晶片中的缺陷的种类，使得可以立即且正确地确定晶片上的裸片是否有缺陷。

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