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1. 发明申请

US20120013360A1 Method of repairing probe card and probe board using the same 有权
标题翻译：使用相同的方法修复探针卡和探针板
公开(公告)号：US20120013360A1
公开(公告)日：2012-01-19
申请号：US12926802
申请日：2010-12-09
申请人： Kwang Jae Oh , Joo Yong Kim , Yoon Hyuck Choi , Bong Gyun Kim
发明人： Kwang Jae Oh , Joo Yong Kim , Yoon Hyuck Choi , Bong Gyun Kim
IPC分类号： G01R31/28 , H05K3/00
CPC分类号： G01R3/00 , G01R1/07378 , H05K1/0292 , H05K3/002 , H05K3/0029 , H05K3/107 , H05K3/225 , H05K3/4629 , H05K2201/0979 , H05K2201/10378 , H05K2203/173
摘要： There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.
摘要翻译：提供了一种修复探针卡和修理的探针板的方法。修补探针卡的方法包括：在由具有设置在彼此相对的位置的第一和第二柱面的烧结陶瓷构成的板主体中，准备板主体，其包括多个主通道，用于电连接形成的第一焊盘在第一柱面上，形成在第二柱面上的第二焊盘，以及设置成邻近主通道的保留通道，以修复损坏的主通道; 当主渠道受损时; 去除在主通道和预留通道中形成的第一和第二焊盘; 通过在损坏的主通道和与主通道相邻的预留通道之间部分地去除板来形成空腔; 以及在空腔中形成修复连接部分，以便将损坏的主通道电连接到与其相邻的预留通道。

2. 发明授权

US08692136B2 Method of repairing probe card and probe board using the same 有权
标题翻译：使用相同的方法修复探针卡和探针板
公开(公告)号：US08692136B2
公开(公告)日：2014-04-08
申请号：US12926802
申请日：2010-12-09
申请人： Kwang Jae Oh , Joo Yong Kim , Yoon Hyuck Choi , Bong Gyun Kim
发明人： Kwang Jae Oh , Joo Yong Kim , Yoon Hyuck Choi , Bong Gyun Kim
IPC分类号： H05K1/11
CPC分类号： G01R3/00 , G01R1/07378 , H05K1/0292 , H05K3/002 , H05K3/0029 , H05K3/107 , H05K3/225 , H05K3/4629 , H05K2201/0979 , H05K2201/10378 , H05K2203/173
摘要： There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.
摘要翻译：提供了一种修复探针卡和修理的探针板的方法。修补探针卡的方法包括：在由具有设置在彼此相对的位置的第一和第二柱面的烧结陶瓷构成的板主体中，准备板主体，其包括多个主通道，用于电连接形成的第一焊盘在第一柱面上，形成在第二柱面上的第二焊盘，以及设置成邻近主通道的保留通道，以修复损坏的主通道; 当主渠道受损时; 去除在主通道和预留通道中形成的第一和第二焊盘; 通过在损坏的主通道和与主通道相邻的预留通道之间部分地去除板来形成空腔; 以及在空腔中形成修复连接部分，以便将损坏的主通道电连接到与其相邻的预留通道。

3. 发明申请

US20110011636A1 Multilayer wiring board and method of manufacturing the same 审中-公开
标题翻译：多层布线板及其制造方法
公开(公告)号：US20110011636A1
公开(公告)日：2011-01-20
申请号：US12654491
申请日：2009-12-22
申请人： Kwang Jae Oh , Joo Yong Kim , Yoon Hyuck Choi
发明人： Kwang Jae Oh , Joo Yong Kim , Yoon Hyuck Choi
IPC分类号： H05K1/16 , H05K3/30
CPC分类号： H05K1/167 , H05K3/4644 , H05K2201/09627 , H05K2201/09672 , H05K2203/171 , Y10T29/49082 , Y10T29/4913 , Y10T29/49162
摘要： There are provided a multilayer wiring board and a method of manufacturing the same. The multilayer wiring board according to an aspect of the invention may include: a main body having a plurality of insulting layers stacked upon each other, including a first layer provided as an inner layer and a second layer provided as an outer layer; a first resistor provided on the first layer; and a second resistor provided on the second layer, connected in parallel with the first resistor, and having a smaller area than the first resistor. The multilayer wiring board obtains a target resistance value using the first and second resistors formed on the first and second layers. The second resistor, formed on the outer layer, can have a smaller area than the first resistor. Accordingly, the usable area of the outer layer is increased to thereby reduce the size of the multilayer wiring board.
摘要翻译：提供了一种多层布线板及其制造方法。根据本发明的一个方面的多层布线板可以包括：主体，其具有堆叠在一起的多个绝缘层，包括设置为内层的第一层和设置为外层的第二层; 设置在第一层上的第一电阻器; 以及设置在所述第二层上的与所述第一电阻并联连接并且具有比所述第一电阻器小的面积的第二电阻器。多层布线基板使用形成在第一层和第二层上的第一和第二电阻来获得目标电阻值。形成在外层上的第二电阻器可以具有比第一电阻器更小的面积。因此，增加了外层的可用面积，从而减小了多层布线板的尺寸。

4. 发明授权

US08330049B2 Circuit board module and method of manufacturing the same 有权
标题翻译：电路板模块及其制造方法
公开(公告)号：US08330049B2
公开(公告)日：2012-12-11
申请号：US12550812
申请日：2009-08-31
申请人： Yoon Hyuck Choi , Dae Hyeong Lee , Jin Waun Kim , Kwang Jae Oh
发明人： Yoon Hyuck Choi , Dae Hyeong Lee , Jin Waun Kim , Kwang Jae Oh
IPC分类号： H05K1/00
CPC分类号： H05K1/0201 , H01C1/148 , H01C7/003 , H05K1/0306 , H05K1/167 , H05K2201/066 , H05K2201/09909 , Y10T156/10
摘要： There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions.The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased.Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.
摘要翻译：提供了一种电路板模块及其制造方法。电路板模块可以包括：电路板; 布置在电路板上的电阻器; 覆盖电阻器两端的焊盘; 粘合剂部分至少设置在焊盘上并由电绝缘材料形成; 以及散热构件，其设置在所述电阻器上并且使用所述粘合部分结合到所述焊盘。选择性地形成粘合剂部分，从而防止在安装到电路板上的电阻器和散热构件之间发生短路。因此，可以提高部件的可靠性。此外，用于连接板和散热构件的粘合材料由导热材料形成，从而提高散热效率。

5. 发明申请

US20100252305A1 CIRCUIT BOARD MODULE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电路板模块及其制造方法
公开(公告)号：US20100252305A1
公开(公告)日：2010-10-07
申请号：US12550812
申请日：2009-08-31
申请人： Yoon Hyuck CHOI , Dae Hyeong Lee , Jin Waun Kim , Kwang Jae Oh
发明人： Yoon Hyuck CHOI , Dae Hyeong Lee , Jin Waun Kim , Kwang Jae Oh
IPC分类号： H05K1/00 , B32B37/00 , B32B38/00
CPC分类号： H05K1/0201 , H01C1/148 , H01C7/003 , H05K1/0306 , H05K1/167 , H05K2201/066 , H05K2201/09909 , Y10T156/10
摘要： There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions.The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased.Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.
摘要翻译：提供了一种电路板模块及其制造方法。电路板模块可以包括：电路板; 布置在电路板上的电阻器; 覆盖电阻器两端的焊盘; 粘合剂部分至少设置在焊盘上并由电绝缘材料形成; 以及散热构件，其设置在所述电阻器上并且使用所述粘合部分结合到所述焊盘。选择性地形成粘合剂部分，从而防止在安装到电路板上的电阻器和散热构件之间发生短路。因此，可以提高部件的可靠性。此外，用于连接板和散热构件的粘合材料由导热材料形成，从而提高散热效率。

6. 发明申请

US20070246825A1 HIGH FREQUENCY MODULE USING METAL-WALL AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：使用金属壁的高频模块及其制造方法
公开(公告)号：US20070246825A1
公开(公告)日：2007-10-25
申请号：US11736201
申请日：2007-04-17
申请人： Kwang Jae Oh , Je Hong Sung , Yoon Hyuck Choi , Tae Soo Lee
发明人： Kwang Jae Oh , Je Hong Sung , Yoon Hyuck Choi , Tae Soo Lee
IPC分类号： H01L23/34
CPC分类号： H01L23/3121 , H01L23/552 , H01L23/66 , H01L25/165 , H01L2924/0002 , H01L2924/3025 , H05K9/003 , H05K9/0032 , H01L2924/00
摘要： A high frequency module and a manufacturing method thereof In the module, a substrate has a ground. A plurality of surface mounted devices are mounted on the substrate. A metal wall is connected to the ground of the substrate. A resin molding hermetically seals the surface mounted devices and the metal wall, the resin molding formed to expose a top surface of the metal wall. Also, a metal film is formed on the resin molding to contact the top surface of the exposed metal wall.
摘要翻译：高频模块及其制造方法在该模块中，基板具有接地。多个表面安装的装置安装在基板上。金属壁连接到基板的地面。树脂模制气密地密封表面安装的装置和金属壁，形成为暴露金属壁的顶表面的树脂模制件。另外，在树脂成形体上形成金属膜，与露出的金属壁的顶面接触。

7. 发明申请

US20130049880A1 IMPEDANCE MATCHING APPARATUS 审中-公开
标题翻译：阻抗匹配装置
公开(公告)号：US20130049880A1
公开(公告)日：2013-02-28
申请号：US13570195
申请日：2012-08-08
申请人： Kwang Jae Oh , Joo Yong Kim
发明人： Kwang Jae Oh , Joo Yong Kim
IPC分类号： H03H7/38
CPC分类号： H01P5/028 , H03H7/383
摘要： The present invention discloses an impedance matching apparatus. The impedance matching apparatus includes: a multilayer printed circuit board; a signal line including a plurality of signal layers with the same pitch and formed by sequentially arranging the plurality of signal layers on the multilayer printed circuit board; and a ground plane including a plurality of ground layers formed inside the multilayer printed circuit board, wherein the plurality of ground layers are arranged to get closer to a bottom surface of the multilayer printed circuit board from a region corresponding to one side of the signal line to a region corresponding to the other side of the signal line to adjust an impedance value.
摘要翻译：本发明公开了一种阻抗匹配装置。阻抗匹配装置包括：多层印刷电路板; 信号线包括具有相同间距的多个信号层，并且通过在多层印刷电路板上顺序布置多个信号层而形成; 以及包括形成在所述多层印刷电路板内部的多个接地层的接地平面，其中所述多个接地层被布置成从所述多层印刷电路板的与所述信号线的一侧对应的区域越接近所述多层印刷电路板的底面到与信号线的另一侧对应的区域以调整阻抗值。

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