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JP2011001687A Assembling method of sectional board 有权
标题翻译：组装板的组装方法
公开(公告)号：JP2011001687A
公开(公告)日：2011-01-06
申请号：JP2009142937
申请日：2009-06-16
申请人： Kuo-Ying Kan , カンクオイン
发明人： KAN KUO-YING
IPC分类号： E04C2/30 , E04F13/21
摘要： PROBLEM TO BE SOLVED: To provide an assembling method of sectional boards for allowing quick assembling and application to various buildings, wall plates, floor plates, roofs, containers and the like, and achieving sound, temperature, electricity, moisture, and water isolation effects in the buildings.SOLUTION: In the assembling method of sectional boards, a plurality of C-shaped boards are placed on a construction surface or a frame body surface. The C-shaped plate having a front surface has at least one C-shaped pocket portion and a J-shaped engagement portion. A recessed space is formed between the C-shaped pocket portion and the J-shaped engagement portion. When a height difference is formed between the C-shaped plate and the construction surface or the frame body surface by the C-shaped pocket portion and the J-shaped engagement portion, an airtight room is formed between the recessed space and the construction surface or the frame body surface, so that sound, temperature, electricity, moisture, and water isolation effects can be achieved.
摘要翻译：要解决的问题：提供一种用于允许快速组装和应用于各种建筑物，墙板，地板，屋顶，容器等的分段板的组装方法，并且实现声音，温度，电力，水分和水分隔离效果在建筑物中。解决方案：在分区板的组装方法中，多个C形板放置在结构表面或框架体表面上。具有前表面的C形板具有至少一个C形袋部和J形接合部。在C形袋部和J形接合部之间形成凹陷空间。当通过C形袋部分和J形接合部分在C形板和构造表面或框体表面之间形成高度差时，在凹陷空间和结构表面之间形成气密室，或者框架体表面，从而可以实现声音，温度，电力，水分和水隔离效果。

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