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1. 发明申请

US20120160458A1 COOLER HAVING GROUND HEATED PLANE FOR COOLING HEATING ELECTRONIC COMPONENT 审中-公开
标题翻译：具有用于冷却加热电子部件的接地加热平板的冷却器
公开(公告)号：US20120160458A1
公开(公告)日：2012-06-28
申请号：US13409593
申请日：2012-03-01
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： F28D15/04
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
摘要翻译：用于制造冷却器的加热平面以获得更好的平坦度和粗糙度的方法包括具有研磨板和夹具的研磨机。然后，将冷却器布置在固定装置上。接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了冷却器和加热元件之间的导热效率。

2. 发明申请

US20100294462A1 HEAT SINK AND HEAT-DISSIPATING FINS OF THE SAME 审中-公开
标题翻译：散热器和散热片
公开(公告)号：US20100294462A1
公开(公告)日：2010-11-25
申请号：US12468182
申请日：2009-05-19
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： F28F13/00
CPC分类号： H01L23/3672 , F21V29/76 , F21V29/77 , F21V29/773 , F21V29/89 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink and heat-dissipating fins have wave-shaped folds. The heat sink includes a plurality of heat-dissipating fins that are radially connected together to form a ring. The inside of the heat-dissipating fins is formed with an accommodating space for allowing a heat-generating element to be disposed therein. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape. Via the wave-shaped folds, the user can grip the heat-dissipating fins easily. Further, the rigidness and strength of the fold can be increased.
摘要翻译：散热片和散热片有波浪形折叠。散热片包括径向连接在一起以形成环的多个散热片。散热翅片的内部形成有容纳空间，用于使发热元件设置在其中。散热翅片是金属片，其一侧垂直弯曲以形成折痕。折叠连续弯曲以形成波形。通过波形折叠，用户可以容易地抓住散热片。此外，折叠的刚性和强度可以增加。

3. 发明授权

US08328601B2 Apparatus for grinding heated plane of cooler 失效
标题翻译：用于研磨冷却器加热平面的装置
公开(公告)号：US08328601B2
公开(公告)日：2012-12-11
申请号：US13409575
申请日：2012-03-01
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： B24B1/00
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
摘要翻译：用于制造冷却器的加热平面以获得更好的平坦度和粗糙度的方法包括具有研磨板和夹具的研磨机。然后，将冷却器布置在固定装置上。接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了冷却器和加热元件之间的导热效率。

4. 发明申请

US20120276822A1 APPARATUS FOR GRINDING HEATED PLANE OF COOLER 失效
标题翻译：用于研磨加热的冷却机平面的装置
公开(公告)号：US20120276822A1
公开(公告)日：2012-11-01
申请号：US13409575
申请日：2012-03-01
申请人： Kuo-Len LIN , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len LIN , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： B24B19/00
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
摘要翻译：用于制造冷却器的加热平面以获得更好的平坦度和粗糙度的方法包括具有研磨板和夹具的研磨机。然后，将冷却器布置在固定装置上。接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了冷却器和加热元件之间的导热效率。

5. 发明授权

US08235768B2 Cooler with ground heated plane and grinding method and apparatus thereof 有权
标题翻译：具有地面加热平面的冷却器及其研磨方法和装置
公开(公告)号：US08235768B2
公开(公告)日：2012-08-07
申请号：US12482000
申请日：2009-06-10
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： B24B1/00
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
摘要翻译：制造冷却器的加热平面的方法获得更好的平整度和粗糙度的方法包括具有研磨板和夹具的研磨机。然后，将冷却器布置在固定装置上。接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了冷却器和加热元件之间的导热效率。

6. 发明授权

US08322403B2 Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having the same 失效
标题翻译：用于并置热管和具有该热管的散热器的吸热表面的固定组件
公开(公告)号：US08322403B2
公开(公告)日：2012-12-04
申请号：US12554864
申请日：2009-09-04
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
IPC分类号： F28D15/02
CPC分类号： F28D15/0233 , F28D15/0275 , F28F2275/20 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.
摘要翻译：散热器包括固定基座，多个热管和固定体。固定底座的底面设有连接平面并向上延伸以形成固定臂。固定臂设置有多个第一凹槽。固定体设置有多个第二凹槽并与固定臂组合。第二凹槽对应于用于协同地接收和夹紧热管的蒸发部分的上边缘的第一凹槽。热管的蒸发部设有接触面和粘接面。蒸发部的接触面彼此相邻，蒸发部固定在固定基体的连接面上。通过这种布置，并置的热管可以与固定基座组装。此外，热管的冷凝部穿透多个翅片以形成散热器。

7. 发明申请

US20110197596A1 Heat-Dissipating Device For Supplying Cold Airflow 失效
标题翻译：用于供应冷气流的散热装置
公开(公告)号：US20110197596A1
公开(公告)日：2011-08-18
申请号：US12707755
申请日：2010-02-18
申请人： Chih-Hung Cheng , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
发明人： Chih-Hung Cheng , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
IPC分类号： F25B21/02 , F28D15/00
CPC分类号： H01L23/427 , F28D15/00 , F28D15/0275 , F28F2013/001 , H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating device (1) including a casing (10), a thermal insulation plate (20), a thermoelectric cooling chip (30), a heat-dissipating body (40), super heat pipes (52), a cooler (53), a first fan (54) and a second fan (60). The thermal insulation plate (20) divides the interior of the casing (10) into a hot air zone (ZH) and a cold air zone (ZC). The thermoelectric cooling chip (30) is disposed on the thermal insulation plate (20) with its hot-end surface (32) facing the hot air zone (ZH). The heat-dissipating body (40) is disposed in the hot air zone (ZH) to contact the hot-end surface (32). The super heat pipes (52) and the cooler (53) thermally contact a cold-end surface (31) of the thermoelectric cooling chip (30). Thus, the cold generated by the cold-end surface (31) can be rapidly and uniformly conducted to other places to form a cold airflow.
摘要翻译：一种散热装置（1），包括壳体（10），绝热板（20），热电冷却芯片（30），散热体（40），超热管（52），冷却器 53），第一风扇（54）和第二风扇（60）。绝热板（20）将壳体（10）的内部分成热空气区域（ZH）和冷空气区域（ZC）。热电冷却片（30）的热端面（32）与热空气区域（ZH）相对配置在绝热板（20）上。散热体（40）设置在热空气区域（ZH）中以与热端面（32）接触。超热管（52）和冷却器（53）与热电冷却芯片（30）的冷端表面（31）热接触。因此，由冷端面（31）产生的冷却可以迅速均匀地传导到其它位置，形成冷气流。

8. 发明申请

US20110024087A1 HEAT-DISSIPATING FINS, LARGE-AREA HEAT SINK HAVING SUCH HEAT-DISSIPATING FINS AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：散热片，具有这种散热片的大面积散热片及其制造方法
公开(公告)号：US20110024087A1
公开(公告)日：2011-02-03
申请号：US12511184
申请日：2009-07-29
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
IPC分类号： F28D15/02 , B23P15/26
CPC分类号： F28D15/02 , B23P15/26 , B23P2700/10 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49368 , Y10T29/49377 , Y10T29/49378 , Y10T29/4938 , H01L2924/00
摘要： The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.
摘要翻译：本发明涉及一种大面积散热器，其中散热体还在其有限的空间内设置。制造翅片的方法包括以下步骤：提供翅片，切割翅片以在其上形成可折叠件，将可折叠件折叠在翅片上并形成容纳孔，并将折叠件和翅片冲压成形成两个重叠的通孔。翅片，散热体和热管组装在一起以获得散热器。由于翅片和散热体同时散发发热元件的热量，所以可以提高散热器的散热效率。

9. 发明申请

US20100083500A1 LEVELING METHOD FOR BURYING EVAPORATING SECTION OF HEAT PIPE INTO THERMALLY CONDUCTIVE SEAT 有权
标题翻译：将热管蒸发蒸发到热导阀座的水平方法
公开(公告)号：US20100083500A1
公开(公告)日：2010-04-08
申请号：US12477471
申请日：2009-06-03
申请人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： B21D53/02
CPC分类号： B21D39/00 , B21D53/02 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F2275/12 , Y10T29/4935 , Y10T29/49353 , Y10T29/49373 , Y10T29/49391
摘要： A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.
摘要翻译：提供一种用于将热管的蒸发部分埋入导热座中的调平方法，用于通过将热管的蒸发部分形成为平坦表面的同时使热管和导热座的蒸发部分形成为平坦表面，热管正在埋入导热座中。此外，与冲压机配合使用，调平方法是在不需要改变冲压模具的条件下，对热管的蒸发部进行多次压配。

10. 发明授权

US08341967B2 Heat-dissipating device for supplying cold airflow 失效
标题翻译：用于供应冷气流的散热装置
公开(公告)号：US08341967B2
公开(公告)日：2013-01-01
申请号：US12707805
申请日：2010-02-18
申请人： Chih-Hung Cheng , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
发明人： Chih-Hung Cheng , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
IPC分类号： F25B21/02
CPC分类号： H01L23/427 , F25B21/02 , F25B2321/0251 , H01L23/3675 , H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102). The heat generated by the hot-end surface (31) is dissipated to the hot air outlet (121) by the thermal conduction of the heat-dissipating module (40). The cold generated by the cold-end surface (32) is conducted and distributed uniformly by the cold-airflow supplying module (50) to the cold air outlet (110).
摘要翻译：散热装置（1）包括壳体（10）和设置在壳体（10）内的绝热板（20）。绝热板（20）将壳体（10）的内部分成第一容纳空间（101）和第二容纳空间（102）。所述壳体（10）的热风出口（121）和第一空气入口（122）与所述第一容纳空间（101）连通。壳体（10）的冷气出口（110）和第二空气入口（123）与第二容纳空间（102）连通。一个热电冷却芯片（30）设置在绝热板（20）的通孔（200）中并且具有面向第一容纳空间（101）的热端表面（31）和冷端表面 32）面向第二容纳空间（102）。散热模块（40）被容纳在第一容纳空间（101）中。冷气流供给模块（50）被容纳在第二容纳空间（102）中。热端面（31）产生的热量通过散热模块（40）的热传导而散热到热风出口（121）。由冷端表面32产生的冷由冷气流供给模块50均匀地传导并均匀地分配到冷气出口110。

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