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1. 发明授权

US09570311B2 Modular grinding apparatuses and methods for wafer thinning 有权
标题翻译：用于晶片薄化的模块化研磨装置和方法
公开(公告)号：US09570311B2
公开(公告)日：2017-02-14
申请号：US13370946
申请日：2012-02-10
申请人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： H01L21/304 , B24B37/04 , B24B37/00
CPC分类号： H01L21/304 , B24B37/00 , B24B37/042
摘要： Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.
摘要翻译：公开了使多个半导体晶片变薄的方法及其实施方法。一组研磨模块内的研磨模块接收并研磨半导体晶片。抛光模块从研磨模块接收半导体晶片并抛光晶片。抛光模块被配置为在比研磨模块构造成磨碎相应晶片的时间少的时间内抛光半导体晶片。

2. 发明授权

US09676114B2 Wafer edge trim blade with slots 有权
公开(公告)号：US09676114B2
公开(公告)日：2017-06-13
申请号：US13408327
申请日：2012-02-29
申请人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： B26D1/143 , B28D5/02 , B24D5/02 , B24D5/12 , B23D61/02 , B28D1/04 , B26D7/18 , B28D1/12
CPC分类号： B26D7/18 , B23D61/02 , B23D61/021 , B24D5/02 , B24D5/12 , B26D1/143 , B28D1/04 , B28D1/121 , B28D5/022 , Y10T83/0448 , Y10T83/9372
摘要： A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.

3. 发明申请

US20140024170A1 Methods for Minimizing Edge Peeling in the Manufacturing of BSI Chips 有权
标题翻译：在BSI芯片制造中最小化边缘剥离的方法
公开(公告)号：US20140024170A1
公开(公告)日：2014-01-23
申请号：US13551457
申请日：2012-07-17
申请人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： H01L31/18
CPC分类号： H01L27/1464 , H01L21/02087 , H01L21/0209 , H01L27/14687
摘要： A method includes forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer having a bevel. When the top metal lines are exposed, an etchant is supplied on the bevel, wherein regions of the wafer sprayed with the etchant has an inner defining line forming a first ring having a first diameter. A trimming step is performed to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter.
摘要翻译：一种方法包括在半导体衬底上形成顶部金属线，其中半导体衬底是具有斜面的晶片的一部分。当顶部金属线暴露时，在斜面上提供蚀刻剂，其中用蚀刻剂喷射的晶片的区域具有形成具有第一直径的第一环的内部限定线。进行修整步骤以修剪晶片的边缘部分，其中晶片的剩余部分的边缘具有基本上等于或小于第一直径的第二直径。

4. 发明申请

US20130023188A1 Apparatus for Wafer Grinding 有权
公开(公告)号：US20130023188A1
公开(公告)日：2013-01-24
申请号：US13188028
申请日：2011-07-21
申请人： Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang , Chun-Ting Kuo
发明人： Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang , Chun-Ting Kuo
IPC分类号： B24B1/00 , B24B7/00
CPC分类号： B24B7/228 , B24D7/14
摘要： A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.

5. 发明授权

US09120194B2 Apparatus for wafer grinding 有权
标题翻译：晶圆研磨设备
公开(公告)号：US09120194B2
公开(公告)日：2015-09-01
申请号：US13188028
申请日：2011-07-21
申请人： Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang , Chun-Ting Kuo
发明人： Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang , Chun-Ting Kuo
IPC分类号： B24B7/22 , B24D7/14
CPC分类号： B24B7/228 , B24D7/14
摘要： A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.
摘要翻译：砂轮包括具有第一附接谷物垫的外基部; 以及具有第二附着谷物垫的内框架; 以及由所述外基座和所述内框架共享的主轴，其中所述外基座和所述内框架中的至少一个可以沿着所述共享主轴轴线独立地移动; 并且其中所述外基座，所述内框架和所述共享主轴轴线都具有相同的中心。研磨系统包括上述砂轮和附接到共享主轴轴线的能够垂直移动的砂轮头，除了驱动砂轮旋转的马达之外，以及用于将晶片固定在卡盘台顶部的卡盘台; 其中所述砂轮与所述卡盘台的一部分重叠，所述卡盘台的每一个能够沿相反方向旋转。

6. 发明授权

US09064770B2 Methods for minimizing edge peeling in the manufacturing of BSI chips 有权
标题翻译： BSI芯片制造中边缘剥离最小化的方法
公开(公告)号：US09064770B2
公开(公告)日：2015-06-23
申请号：US13551457
申请日：2012-07-17
申请人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： H01L21/02 , H01L27/146
CPC分类号： H01L27/1464 , H01L21/02087 , H01L21/0209 , H01L27/14687
摘要： A method includes forming top metal lines over a semiconductor substrate, wherein the semiconductor substrate is a portion of a wafer having a bevel. When the top metal lines are exposed, an etchant is supplied on the bevel, wherein regions of the wafer sprayed with the etchant has an inner defining line forming a first ring having a first diameter. A trimming step is performed to trim an edge portion of the wafer, wherein an edge of a remaining portion of the wafer has a second diameter substantially equal to or smaller than the first diameter.
摘要翻译：一种方法包括在半导体衬底上形成顶部金属线，其中半导体衬底是具有斜面的晶片的一部分。当顶部金属线暴露时，在斜面上提供蚀刻剂，其中用蚀刻剂喷射的晶片的区域具有形成具有第一直径的第一环的内部限定线。进行修整步骤以修剪晶片的边缘部分，其中晶片的剩余部分的边缘具有基本上等于或小于第一直径的第二直径。

7. 发明授权

US10643853B2 Wafer thinning apparatus having feedback control and method of using 有权
公开(公告)号：US10643853B2
公开(公告)日：2020-05-05
申请号：US13371046
申请日：2012-02-10
申请人： Yuan-Hsuan Chen , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
发明人： Yuan-Hsuan Chen , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
IPC分类号： H01L21/306 , H01L21/304 , B24B49/05 , B24B49/04 , B24B37/005 , B24B49/00 , B24B37/04 , H01L21/66
CPC分类号： H01L21/30625 , B24B37/005 , B24B37/04 , B24B49/00 , B24B49/04 , B24B49/05 , H01L21/304 , H01L22/12 , H01L22/20
摘要： A wafer thinning apparatus includes a first metrology tool configured to measure an initial thickness of the wafer. The wafer thinning apparatus further includes a controller connected to the first metrology tool, and configured to determine a polishing time based on the initial thickness, a predetermined thickness and a material removal rate. The wafer thinning apparatus further includes a polishing tool connected to the controller configured to polish the wafer for a period of time equal to the polishing time. The wafer thinning apparatus includes a second metrology tool connected to the controller and the polishing tool, and configured to measure a polished thickness. The controller is configured to update the material removal rate based on the polished thickness, the predetermined thickness and the polishing time.

8. 发明授权

US09721984B2 Image sensor manufacturing methods 有权
公开(公告)号：US09721984B2
公开(公告)日：2017-08-01
申请号：US13445766
申请日：2012-04-12
申请人： Mu-Han Cheng , Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang
发明人： Mu-Han Cheng , Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang
IPC分类号： H01L27/146
CPC分类号： H01L27/14623 , H01L27/1464 , H01L27/14687
摘要： Semiconductor devices and back side illumination (BSI) sensor manufacturing methods are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece and forming an integrated circuit on a front side of the workpiece. A grid of a conductive material is formed on a back side of the workpiece using a damascene process.

9. 发明申请

US20130273686A1 Image Sensor Manufacturing Methods 有权
标题翻译：图像传感器制造方法
公开(公告)号：US20130273686A1
公开(公告)日：2013-10-17
申请号：US13445766
申请日：2012-04-12
申请人： Mu-Han Cheng , Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang
发明人： Mu-Han Cheng , Kuo-Hsiu Wei , Kei-Wei Chen , Ying-Lang Wang
IPC分类号： H01L31/0232 , H01L21/28
CPC分类号： H01L27/14623 , H01L27/1464 , H01L27/14687
摘要： Semiconductor devices and back side illumination (BSI) sensor manufacturing methods are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece and forming an integrated circuit on a front side of the workpiece. A grid of a conductive material is formed on a back side of the workpiece using a damascene process.
摘要翻译：公开了半导体器件和背面照明（BSI）传感器制造方法。在一个实施例中，制造半导体器件的方法包括提供工件并在工件的前侧形成集成电路。使用镶嵌工艺在工件的背面上形成导电材料的格栅。

10. 发明授权

US06769959B2 Method and system for slurry usage reduction in chemical mechanical polishing 失效
标题翻译：化学机械抛光中浆料用量减少的方法和系统
公开(公告)号：US06769959B2
公开(公告)日：2004-08-03
申请号：US10050314
申请日：2002-01-15
申请人： Kei-Wei Chen , Ting-Chun Wang , Shih-Tzung Chang , Yu-Ku Lin , Ying-Lang Wang , Ming-Wen Chen , Kuo-Hsiu Wei
发明人： Kei-Wei Chen , Ting-Chun Wang , Shih-Tzung Chang , Yu-Ku Lin , Ying-Lang Wang , Ming-Wen Chen , Kuo-Hsiu Wei
IPC分类号： B24B100
CPC分类号： B24B37/04 , B24B57/02
摘要： A method and system is disclosed for reducing slurry usage in a chemical mechanical polishing operation utilizing at least one polishing pad thereof. Slurry can be intermittently supplied to a chemical mechanical polishing device. The slurry is generally flushed so that a portion of said slurry is trapped in a plurality of pores of at least one polishing pad associated with said chemical mechanical polishing device, wherein only a minimum amount of said slurry necessary is utilized to perform said chemical mechanical polishing operation, thereby reducing slurry usage and maintaining a consistent level of slurry removal rate performance and a decrease in particle defects thereof. The present invention thus discloses a method and system for intermittently delivering slurry to a chemical mechanical polishing device in a manner that significantly conserves slurry usage.
摘要翻译：公开了一种利用其至少一个抛光垫在化学机械抛光操作中减少浆料使用的方法和系统。浆料可以间歇地供应到化学机械抛光装置。通常将浆料冲洗，使得所述浆料的一部分被捕获在与所述化学机械抛光装置相关联的至少一个抛光垫的多个孔中，其中仅使用最少量的所需浆料来进行所述化学机械抛光操作，从而减少浆料的使用并保持一致的浆料去除速率性能水平和其颗粒缺陷的减少。因此，本发明公开了一种用于以显着节省浆料使用的方式间歇地将浆料输送到化学机械抛光装置的方法和系统。

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