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1. 发明授权

US06413146B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06413146B1
公开(公告)日：2002-07-02
申请号：US09984433
申请日：2001-10-30
申请人： Seiji Katsuoka , Manabu Tsujimura , Kunihiko Sakurai , Hiroyuki Osawa
发明人： Seiji Katsuoka , Manabu Tsujimura , Kunihiko Sakurai , Hiroyuki Osawa
IPC分类号： B24B4900
CPC分类号： B24B37/345 , B24B27/0023 , B24B37/10 , B24B37/11 , B24B49/12 , B24B53/017 , Y10T29/53961
摘要： This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.
摘要翻译：本发明涉及用于研磨半导体晶片的抛光装置。该装置包括能够接收待抛光工件和抛光工件的存储部分。抛光工件的抛光单元包括主抛光台和二次抛光台，其中二次抛光台的抛光表面被构造成使得被抛光表面抛光的工件表面的至少一部分的二次抛光台延伸超过二次抛光台的抛光表面的边缘。还提供了一种膜厚测量装置，其测量在抛光工件上形成的膜的厚度，同时抛光的工件由推动器上方的顶环保持。

2. 发明授权

US06402597B1 Polishing apparatus and method 有权
标题翻译：抛光设备和方法
公开(公告)号：US06402597B1
公开(公告)日：2002-06-11
申请号：US09580829
申请日：2000-05-30
申请人： Kunihiko Sakurai , Seiji Katsuoka
发明人： Kunihiko Sakurai , Seiji Katsuoka
IPC分类号： B34B5300
CPC分类号： B24B53/017 , B24B37/015 , B24B37/04
摘要： A workpiece such as a semiconductor wafer is polished to a planar finish by a polishing apparatus. The polishing apparatus comprises a turntable having a polishing surface thereon, a top ring for holding a workpiece and pressing the workpiece against the polishing surface, a dressing apparatus having a dresser element for dressing the polishing surface by bringing the dresser element into contact with the polishing surface, and a temperature control device for controlling the temperature of the dresser element before dressing and/or during dressing.
摘要翻译：通过抛光装置将诸如半导体晶片的工件抛光成平面光洁度。抛光装置包括其上具有抛光表面的转台，用于保持工件并将工件压靠在抛光表面上的顶环，具有用于通过使修整器元件与抛光接触来修整抛光表面的修整器元件的修整装置表面和用于在敷料和/或敷料期间控制修整器元件的温度的温度控制装置。

3. 发明授权

US5643067A Dressing apparatus and method 失效
标题翻译：敷料装置和方法
公开(公告)号：US5643067A
公开(公告)日：1997-07-01
申请号：US571598
申请日：1995-12-13
申请人： Seiji Katsuoka , Kunihiko Sakurai , Tetsuji Togawa
发明人： Seiji Katsuoka , Kunihiko Sakurai , Tetsuji Togawa
IPC分类号： B24B53/00 , B24B53/007 , B24B53/017 , B24B21/18 , B24B33/00 , B24B47/26 , B24B55/00
CPC分类号： B24B53/017 , B24B53/00
摘要： A dressing apparatus is used to resurface a polishing surface of a polish cloth used to polish semiconductor wafers. A dressing brush which spins on its own axis is also coupled to a drive shaft of a main drive of the dressing apparatus through a planetary gear mechanism so that the brush will rotate or orbit about the drive shaft. Therefore, the dressing brush traces a complex path and its dressing action is spread over a wide surface area of the polishing cloth to produce thorough resurfacing of the polishing surface. The service life of the cloth is significantly increased and contributes to improving the overall efficiency of preparing high quality polished semiconductor wafers. For economy, the dressing apparatus can be mounted easily on a conventional polishing apparatus having a dressing facility.
摘要翻译：修整装置用于重新表面抛光用于抛光半导体晶片的抛光布的抛光表面。在其自身的轴线上旋转的修整刷也通过行星齿轮机构联接到修整设备的主驱动器的驱动轴，使得电刷将围绕驱动轴旋转或轨道。因此，修整刷跟踪复杂的路径，并且其修整作用分布在抛光布的宽表面区域上，以产生抛光表面的彻底表面。布的使用寿命显着增加，有助于提高制备高质量抛光半导体晶片的整体效率。为了经济，敷料装置可以容易地安装在具有修整设备的常规抛光装置上。

4. 发明授权

US07101255B2 Polishing apparatus 失效
公开(公告)号：US07101255B2
公开(公告)日：2006-09-05
申请号：US11149168
申请日：2005-06-10
申请人： Seiji Katsuoka , Manabu Tsujimura , Kunihiko Sakurai , Hiroyuki Osawa
发明人： Seiji Katsuoka , Manabu Tsujimura , Kunihiko Sakurai , Hiroyuki Osawa
IPC分类号： B24B49/00 , B24B51/00 , B24B1/00
CPC分类号： B24B37/345 , B24B27/0023 , B24B37/10 , B24B37/11 , B24B49/12 , B24B53/017 , Y10T29/53961
摘要： This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

5. 发明授权

US06332826B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06332826B1
公开(公告)日：2001-12-25
申请号：US09341882
申请日：1999-09-08
申请人： Seiji Katsuoka , Manabu Tsujimura , Kunihiko Sakurai , Hiroyuki Osawa
发明人： Seiji Katsuoka , Manabu Tsujimura , Kunihiko Sakurai , Hiroyuki Osawa
IPC分类号： B24B4900
CPC分类号： B24B37/345 , B24B27/0023 , B24B37/10 , B24B37/11 , B24B49/12 , B24B53/017 , Y10T29/53961
摘要： This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.
摘要翻译：本发明涉及用于研磨半导体晶片的抛光装置。该装置包括能够接收待抛光工件和抛光工件的存储部分。抛光工件的抛光单元包括主抛光台和二次抛光台，其中二次抛光台的抛光表面被构造成使得被抛光表面抛光的工件表面的至少一部分的二次抛光台延伸超过二次抛光台的抛光表面的边缘。还提供了一种膜厚测量装置，其测量在抛光工件上形成的膜的厚度，同时抛光的工件由推动器上方的顶环保持。

6. 发明申请

US20050227596A1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US20050227596A1
公开(公告)日：2005-10-13
申请号：US11149168
申请日：2005-06-10
申请人： Seiji Katsuoka , Manabu Tsujimura , Kunihiko Sakurai , Hiroyuki Osawa
发明人： Seiji Katsuoka , Manabu Tsujimura , Kunihiko Sakurai , Hiroyuki Osawa
IPC分类号： B24B37/04 , B24B1/00 , B24B27/00 , B24B37/10 , B24B37/11 , B24B37/27 , B24B37/34 , B24B49/12 , B24B53/007 , B24B53/017
CPC分类号： B24B37/345 , B24B27/0023 , B24B37/10 , B24B37/11 , B24B49/12 , B24B53/017 , Y10T29/53961
摘要： This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.
摘要翻译：本发明涉及用于研磨半导体晶片的抛光装置。该装置包括能够接收待抛光工件和抛光工件的存储部分。抛光工件的抛光单元包括主抛光台和二次抛光台，其中二次抛光台的抛光表面被构造成使得被抛光表面抛光的工件表面的至少一部分的二次抛光台延伸超过二次抛光台的抛光表面的边缘。还提供了一种膜厚测量装置，其测量在抛光工件上形成的膜的厚度，同时抛光的工件由推动器上方的顶环保持。

7. 发明授权

US5647792A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5647792A
公开(公告)日：1997-07-15
申请号：US580341
申请日：1995-12-28
申请人： Seiji Katsuoka , Kunihiko Sakurai , Tetsuji Togawa
发明人： Seiji Katsuoka , Kunihiko Sakurai , Tetsuji Togawa
IPC分类号： B24B37/12 , B24B5/00
CPC分类号： B24B45/006 , B24B37/11
摘要： A polishing apparatus has a cloth cartridge detachably mounted on a turntable, an abrasive liquid nozzle for supplying an abrasive liquid onto an abrasive cloth of the cloth cartridge, and a top ring for holding a workpiece against the abrasive cloth. The turntable and the top ring are rotatable relatively to each other while the abrasive liquid is being supplied onto the abrasive cloth from the abrasive liquid nozzle and the workpiece is being held against the abrasive cloth. A cartridge tightener which is angularly movably mounted on the turntable has a tapered surface for engaging an engageable surface of the cloth cartridge in response to angular movement of the cartridge tightener. The tapered surface is included to a plane substantially perpendicular to an axis about which the turntable is rotatable. The cartridge tightener also has a resilient member acting between the tapered surface and the turntable and elastically deformable for applying resilient forces between the tapered surface and the engageable surface in response to angular movement of the cartridge tightener.
摘要翻译：抛光装置具有可拆卸地安装在转台上的布料盒，用于将研磨液体供应到布料筒的研磨布上的研磨液喷嘴和用于将工件保持在研磨布上的顶环。当研磨液从研磨液喷嘴供给到研磨布上并且工件被保持抵靠研磨布时，转盘和顶环可相对旋转。可旋转地安装在转台上的盒式收紧器具有锥形表面，用于响应于盒式收紧器的角度运动而啮合布料盒的可接合表面。锥形表面被包括在基本上垂直于转盘可旋转的轴线的平面内。盒式收紧器还具有作用在锥形表面和转盘之间的弹性构件，并且可弹性变形，以响应于盒式收紧器的角度运动而在锥形表面和可接合表面之间施加弹性力。

8. 发明授权

US06918814B2 Polishing apparatus 失效
公开(公告)号：US06918814B2
公开(公告)日：2005-07-19
申请号：US10145698
申请日：2002-05-16
申请人： Seiji Katsuoka , Manabu Tsujimura , Kunihiko Sakurai , Hiroyuki Osawa
发明人： Seiji Katsuoka , Manabu Tsujimura , Kunihiko Sakurai , Hiroyuki Osawa
IPC分类号： B24B37/04 , B24B1/00 , B24B27/00 , B24B37/10 , B24B37/11 , B24B37/27 , B24B37/34 , B24B49/12 , B24B53/007 , B24B53/017 , B24B49/00
CPC分类号： B24B37/345 , B24B27/0023 , B24B37/10 , B24B37/11 , B24B49/12 , B24B53/017 , Y10T29/53961
摘要： This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

9. 发明授权

US5860847A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5860847A
公开(公告)日：1999-01-19
申请号：US708948
申请日：1996-09-06
申请人： Kunihiko Sakurai , Tetsuji Togawa , Toyomi Nishi , Seiji Katsuoka , Hiromi Yajima , Masako Kodera
发明人： Kunihiko Sakurai , Tetsuji Togawa , Toyomi Nishi , Seiji Katsuoka , Hiromi Yajima , Masako Kodera
IPC分类号： B24B37/013 , B24B37/04 , B24B49/04 , B24B49/16 , H01L21/66 , B24B49/00
CPC分类号： B24B37/013 , B24B37/04 , B24B49/04 , B24B49/16 , H01L22/26
摘要： A polishing apparatus has a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring disposed above the turntable for supporting a workpiece to be polished against the abrasive cloth under predetermined pressure. The turntable is rotatable by a first motor through a timing pulley connected to the first motor, and the top ring is rotatable by a second motor through a timing pulley connected to the second motor. A torque detector incorporated in the timing pulley connected to at least one of the first motor and the second motor detects an output torque produced by the at least one of the first motor and the second motor.
摘要翻译：抛光装置具有安装在其上表面上的研磨布的转台和设置在转盘上方的顶环，用于在预定压力下将待抛光的工件支撑在磨料上。转盘可以通过连接到第一马达的定时皮带由第一马达旋转，并且顶环可以通过连接到第二马达的定时皮带的第二马达转动。并入到与第一电动机和第二电动机中的至少一个连接的正时轮中的转矩检测器检测由第一电动机和第二电动机中的至少一个产生的输出转矩。

10. 发明授权

US5839947A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5839947A
公开(公告)日：1998-11-24
申请号：US795511
申请日：1997-02-05
申请人： Norio Kimura , Kunihiko Sakurai , Tetsuji Togawa , Seiji Katsuoka , Toyomi Nishi
发明人： Norio Kimura , Kunihiko Sakurai , Tetsuji Togawa , Seiji Katsuoka , Toyomi Nishi
IPC分类号： B24B53/007 , B24B53/017 , B24B5/00 , B24B29/00
CPC分类号： B24B53/017
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括其上具有抛光表面的转台，用于保持要抛光的工件的顶环，并将工件压靠在抛光表面上，该抛光表面可在转盘内部的抛光位置和位于转盘外部的待机位置之间移动转盘和用于在顶环处于待机位置时保持顶环的至少下表面湿润的第一装置。抛光装置还包括用于修整转台上的抛光表面的修整工具，以及用于在修整工具处于待机位置时保持敷料工具的至少下表面湿润的第二装置。

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