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1. 发明授权

US08558375B2 Semiconductor package cooled by grounded cooler 有权
标题翻译：半导体封装由接地冷却器冷却
公开(公告)号：US08558375B2
公开(公告)日：2013-10-15
申请号：US13170475
申请日：2011-06-28
申请人： Kuniaki Mamitsu , Takahisa Kaneko , Masaya Tonomoto , Masayoshi Nishihata , Hiroyuki Wado , Chikage Noritake , Eiji Nomura , Toshiki Itoh
发明人： Kuniaki Mamitsu , Takahisa Kaneko , Masaya Tonomoto , Masayoshi Nishihata , Hiroyuki Wado , Chikage Noritake , Eiji Nomura , Toshiki Itoh
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/3672 , H01L23/3736 , H01L23/427 , H01L23/4334 , H01L23/46 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/06181 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/29339 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/06 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1517 , H01L2924/1579 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
摘要翻译：半导体器件包括封装和冷却器。半导体封装包括半导体元件，金属构件和用于封装半导体元件和金属构件的模制构件。金属构件具有热连接到半导体元件的金属部分，金属部分上的绝缘层和绝缘层上的导电层。导电层至少部分地暴露在模制构件的外部，并且用作用于辐射半导体元件的热的辐射表面。冷却器具有冷却剂通道，冷却剂通过该通道冷却导电层。导电层和冷却器电连接在一起。

2. 发明申请

US20120001318A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20120001318A1
公开(公告)日：2012-01-05
申请号：US13170475
申请日：2011-06-28
申请人： Kuniaki MAMITSU , Takahisa Kaneko , Masaya Tonomoto , Masayoshi Nishihata , Hiroyuki Wado , Chikage Noritake , Eiji Nomura , Toshiki Itoh
发明人： Kuniaki MAMITSU , Takahisa Kaneko , Masaya Tonomoto , Masayoshi Nishihata , Hiroyuki Wado , Chikage Noritake , Eiji Nomura , Toshiki Itoh
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/3672 , H01L23/3736 , H01L23/427 , H01L23/4334 , H01L23/46 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/06181 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/29339 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/06 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1517 , H01L2924/1579 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
摘要翻译：半导体器件包括封装和冷却器。半导体封装包括半导体元件，金属构件和用于封装半导体元件和金属构件的模制构件。金属构件具有热连接到半导体元件的金属部分，金属部分上的绝缘层和绝缘层上的导电层。导电层至少部分地暴露在模制构件的外部，并且用作用于辐射半导体元件的热的辐射表面。冷却器具有冷却剂通道，冷却剂通过该通道冷却导电层。导电层和冷却器电连接在一起。

3. 发明授权

US07183551B2 Infrared-ray absorption film 有权
标题翻译：红外线吸收膜
公开(公告)号：US07183551B2
公开(公告)日：2007-02-27
申请号：US11008804
申请日：2004-12-09
申请人： Toshiki Itoh
发明人： Toshiki Itoh
IPC分类号： G01J5/00
CPC分类号： H01L31/0216 , G01J5/04 , G01J5/046 , G01J5/08 , G01J5/0853 , G02B5/003 , G02B2207/107
摘要： The invention aims at providing an infrared-ray absorption film having a low reflection factor and a high absorption ratio equivalent to those of gold black through an economical process such as ink jet printing involving the steps of printing a porous material solution and then conducting sintering without using a vacuum process. The invention provides an infrared-ray absorption film using a porous material which suitably has a pore size within the range of hundreds of nm to several μm and is formed of a metal oxide of carbon or silica, an organic/inorganic hybrid material or a meso-porous material having the composition described above. The infrared-ray absorption film is produced by applying the porous material precursor solution onto a substrate and then conducting sintering.
摘要翻译：本发明的目的在于提供一种具有低反射系数和高吸收比的红外线吸收膜，其通过诸如喷墨印刷的经济方法与金黑相当，其包括印刷多孔材料溶液然后进行烧结而不进行烧结的步骤使用真空过程。本发明提供一种使用多孔材料的红外线吸收膜，该多孔材料适当地具有在数百nm到数μm之间的孔径，并且由碳或二氧化硅的金属氧化物，有机/无机混合材料或内消旋具有上述组成的有机材料。红外线吸收膜通过将多孔材料前体溶液涂布在基材上然后进行烧结来制造。

4. 发明授权

US6103423A Negative electrode for secondary cells and a non-aqueous electrolyte secondary cell comprising the same as at least one electrode 失效
标题翻译：用于二次电池的负电极和包含与至少一个电极相同的非水电解质二次电池
公开(公告)号：US6103423A
公开(公告)日：2000-08-15
申请号：US862962
申请日：1997-06-03
申请人： Toshiki Itoh , Kenji Yamamoto , Eiichi Okuno , Hiroshi Ueshima
发明人： Toshiki Itoh , Kenji Yamamoto , Eiichi Okuno , Hiroshi Ueshima
IPC分类号： H01M10/05 , H01M4/02 , H01M4/36 , H01M4/96 , H01M6/16 , H01M10/0525 , H01M10/0569 , H01M4/60
CPC分类号： H01M4/13 , H01M4/96 , H01M10/0525 , H01M2300/0037 , H01M4/587
摘要： A negative electrode comprises carbon particles which individually consist of a core of crystalline carbon and an amorphous carbon layer formed on at least a part of the surfaces of the core, and an amorphous carbon matrix dispersing the carbon particles therein. The carbon matrix is formed by thermal decomposition of a thermosetting resin. A non-aqueous electrolyte secondary cell which comprises an electrode of the type mentioned above as at least one of electrodes is also described.
摘要翻译：负极包含碳粒子，该碳粒子由结晶碳芯和形成在芯的至少一部分表面上的无定形碳层组成，以及分散碳粒子的无定形碳基体。碳基体是通过热分解热固性树脂形成的。还描述了包括上述类型的电极作为至少一个电极的非水电解质二次电池。

5. 发明授权

US06933002B2 Method for manufacturing organic EL device with protective layer 有权
标题翻译：制造保护层有机EL器件的方法
公开(公告)号：US06933002B2
公开(公告)日：2005-08-23
申请号：US10345234
申请日：2003-01-16
申请人： Ryonosuke Tera , Toshiki Itoh , Atsushi Yamamoto , Harumi Suzuki , Masaaki Ozaki , Takeshi Yamauchi
发明人： Ryonosuke Tera , Toshiki Itoh , Atsushi Yamamoto , Harumi Suzuki , Masaaki Ozaki , Takeshi Yamauchi
IPC分类号： H05B33/04 , H01L51/50 , H01L51/52 , H05B33/10 , H05B33/12 , H05B33/14 , C23C16/40 , B05D5/00 , B05D5/12
CPC分类号： H01L51/5256 , H01L51/5253 , Y10T428/24942
摘要： An organic EL device has a structure in which an anode, a hole transporting layer, an organic luminescent layer, and a cathode are disposed on a glass substrate in this order. The organic EL device further has a protective layer covering an outer surface of the structure to protect it from an external environment. The protective layer is formed by an ALE method at a temperature lower than glass transition temperatures materials constituting the hole transporting layer and the organic luminescent layer.
摘要翻译：有机EL器件具有其中阳极，空穴传输层，有机发光层和阴极依次设置在玻璃衬底上的结构。有机EL器件还具有覆盖该结构的外表面的保护层，以保护其免受外部环境的影响。保护层通过ALE法在低于构成空穴传输层和有机发光层的玻璃化转变温度的材料的温度下形成。

6. 发明申请

US20110034032A1 Method of formation or thermal spray coating 审中-公开
标题翻译：形成方法或热喷涂
公开(公告)号：US20110034032A1
公开(公告)日：2011-02-10
申请号：US12802497
申请日：2010-06-08
申请人： Toshiki Itoh , Kouzou Yoshimura , Ryonosuke Tera , Masashi Totokawa , Yasunori Ninomiya
发明人： Toshiki Itoh , Kouzou Yoshimura , Ryonosuke Tera , Masashi Totokawa , Yasunori Ninomiya
IPC分类号： H01L21/30
CPC分类号： C23C4/134 , C23C4/11 , H01L24/73 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： A method of formation of a thermal spray coating which forms a thermal spray coating on a coating-forming surface, characterized by comprising a thermal spraying step of thermally spraying feedstock powder on the coating-forming surface and a deposition and coating forming step of having the thermally sprayed feedstock powder deposit on the coating-forming surface and solidify to form a coating, in the deposition and coating forming step, when deposited on the coating-forming surface by thermal spraying, the feedstock powder deposits in the solid phase state in 50 to 90%, preferably 70 to 80%, of the whole so as to raise the ratio of the crystallite remaining in the feedstock powder and secure a high heat conductivity.
摘要翻译：一种形成热喷涂层的方法，其在涂层形成表面上形成热喷涂，其特征在于包括在喷涂形成表面上热喷涂原料粉末的热喷涂步骤，以及沉积和涂层形成步骤，热喷涂原料粉末沉积在涂层形成表面上并固化形成涂层，在沉积和涂层形成步骤中，当通过热喷涂沉积在涂层形成表面上时，原料粉末以50〜 90％，优选70〜80％，以提高原料粉末中残留的微晶的比例，确保高导热性。

7. 发明申请

US20050133722A1 Infrared-ray absorption film 有权
标题翻译：红外线吸收膜
公开(公告)号：US20050133722A1
公开(公告)日：2005-06-23
申请号：US11008804
申请日：2004-12-09
申请人： Toshiki Itoh
发明人： Toshiki Itoh
IPC分类号： G01J1/02 , H01L27/14 , H01L37/00
CPC分类号： H01L31/0216 , G01J5/04 , G01J5/046 , G01J5/08 , G01J5/0853 , G02B5/003 , G02B2207/107
摘要： The invention aims at providing an infrared-ray absorption film having a low reflection factor and a high absorption ratio equivalent to those of gold black through an economical process such as ink jet printing involving the steps of printing a porous material solution and then conducting sintering without using a vacuum process. The invention provides an infrared-ray absorption film using a porous material which suitably has a pore size within the range of hundreds of nm to several μm and is formed of a metal oxide of carbon or silica, an organic/inorganic hybrid material or a meso-porous material having the composition described above. The infrared-ray absorption film is produced by applying the porous material precursor solution onto a substrate and then conducting sintering.
摘要翻译：本发明的目的在于提供一种具有低反射系数和高吸收比的红外线吸收膜，其通过诸如喷墨印刷的经济方法与金黑相当，其包括印刷多孔材料溶液然后进行烧结而不进行烧结的步骤使用真空过程。本发明提供了一种使用多孔材料的红外线吸收膜，该多孔材料适当地具有在几百nm到几μm范围内的孔径，并且由碳或二氧化硅的金属氧化物，有机/无机混合材料或内消旋具有上述组成的有机材料。红外线吸收膜通过将多孔材料前体溶液涂布在基材上然后进行烧结来制造。

8. 发明授权

US06356251B1 Matrix type liquid-crystal display with optical data communication feature 有权
标题翻译：具有光学数据通信功能的矩阵型液晶显示器
公开(公告)号：US06356251B1
公开(公告)日：2002-03-12
申请号：US09294899
申请日：1999-04-20
申请人： Susumu Naito , Toshiki Itoh
发明人： Susumu Naito , Toshiki Itoh
IPC分类号： G09G334
CPC分类号： G09G3/20 , G09G3/3611 , G09G2300/0426 , G09G2310/0267 , G09G2310/0275 , G09G2360/141
摘要： A matrix type display is provided in which information is transmitted to a flat panel display element such as a liquid crystal or electroluminescent panel utilizing optical communication. Synchronization signals are transmitted from a synchronization circuit to scan electrode driving circuits through optical communication utilizing a plurality of pairs of light-emitting elements and light-receiving elements facing each other, and image data is transmitted from a memory circuit to signal electrode driving circuits through non-interfering optical communication signals utilizing a plurality of opposing pairs of light-emitting elements and light-receiving elements.
摘要翻译：提供一种矩阵型显示器，其中使用光通信将信息传送到诸如液晶或电致发光面板的平板显示元件。同步信号通过利用多对发光元件和彼此面对的光接收元件的光通信从同步电路发送到扫描电极驱动电路，并且图像数据从存储器电路传输到信号电极驱动电路，通过使用多个相对的发光元件对和光接收元件的非干涉光通信信号。

9. 发明授权

US06353067B1 Polyolefin stretch film 失效
标题翻译：聚烯烃拉伸膜
公开(公告)号：US06353067B1
公开(公告)日：2002-03-05
申请号：US09576805
申请日：2000-05-23
申请人： Masao Kameyama , Toshiyuki Ishii , Toshiki Itoh
发明人： Masao Kameyama , Toshiyuki Ishii , Toshiki Itoh
IPC分类号： C08F2010
CPC分类号： C08J5/18 , C08J2323/08
摘要： The polyolefin stretch film comprises a film produced from a resin composition principally composed of a polyolefin resin consisting either entirely of ethylene (meth)acrylic acid copolymer or ethylene (meth)acrylic acid (meth)acrylic ester terpolymer, or a mixed resin of both, and being, insofar as necessary, compounded with an anti-fogging agent and a tackifier, such film having a stress at 100% elongation in the longitudinal direction of 12-30 MPa and a stress at 100% elongation in the transverse direction of 5-11 MPa. This film is suitably used as a stretch wrap film material for packaging food and various items, inasmuch as it is free of pollution and sanitary/health hazard problems, and imparts a large elongation, excellent cut property of traverse direction, adherence/conformance property (cling property), elastic recovery after distention by fingertips, etc., adequate stress at 100% elongation and, moreover, a good balance between the stresses at elongation in the longitudinal direction and in the transverse direction, respectively, which properties all in all enable the film to accomplish wrapping virtually free of surface wrinkle formation and film breakage in a continuous stretch wrapping operation, thus rendering the film fully compatible with the automatic wrapping machine. Furthermore, since it can be formed at a high speed by the extrusion film forming technique employing a straight manifold die, the film has a merit of high productivity.
摘要翻译：聚烯烃拉伸膜包括由主要由全部由乙烯（甲基）丙烯酸共聚物或乙烯（甲基）丙烯酸（甲基）丙烯酸酯三元共聚物组成的聚烯烃树脂或两者的混合树脂组成的树脂组合物制成的膜，并且在必要时与防雾剂和增粘剂混合，这种薄膜的长度方向的伸长率为100％，应力为12-30MPa，横向的伸长率为100％时的应力为5〜 11MPa。该膜适合用作包装食品和各种物品的拉伸保鲜膜材料，因为它没有污染和卫生/健康危害问题，并且具有大的伸长率，横向方向的优良切割性，粘附/一致性（粘附性），通过指尖膨胀后的弹性恢复等，在100％伸长率下具有足够的应力，此外，在纵向和横向上的伸长应力之间分别具有良好的平衡，所有这些都能够实现该薄膜在连续的拉伸包装操作中实现几乎没有表面皱纹形成和薄膜断裂的包裹，从而使薄膜与自动包装机完全兼容。此外，由于可以通过使用直的歧管模具的挤出成膜技术高速地形成，所以该膜具有高生产率的优点。

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