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    • 1. 发明申请
    • SHEET PROCESSING DEVICE
    • 板材加工设备
    • US20090236798A1
    • 2009-09-24
    • US12478803
    • 2009-06-05
    • Kuniaki KIMURAKenichi WATANABE
    • Kuniaki KIMURAKenichi WATANABE
    • B65H31/36
    • B65H31/38B65H2301/4219B65H2801/06
    • In a sheet processing device in the form of an offset stacker, a sheet fence (103, 104) is provided on a side of sheets (S) to be processed stacked on a stack tray (3) opposite from a jogger (101, 102) so that the sheet fence accurately defines a final offset position of the sheets. Thereby, even when a transient offset position at which the sheets are stacked on the stack tray varies from one sheet to another, the side edges of sheets selected for offset stacking can be lined up without fail owing to the jogging action of the jogger and the supporting action of the sheet fence. A pair of joggers may be arranged on either side of the sheets, along with a pair of corresponding sheets fences on the opposing sides. The jogger and sheet fence on a same side may be supported by a common moveable frame (107, 108) so that the jogging action and sheet fence adjustment can be achieved by a common structure and a common drive unit.
    • 在偏移式堆垛机形式的片材处理装置中,片材篱笆(103,104)被设置在堆垛堆叠(3)上与加工器(101,102 ),使得板栅栏精确地限定纸张的最终偏移位置。 因此,即使当堆叠托盘上堆叠片材的瞬时偏移位置从一张片材变化到另一片时,由于顺序器的慢跑动作,可选择用于偏移堆叠的片材的侧边缘不会排列, 支持栏杆的动作。 一对慢跑器可以布置在纸张的两侧,以及在相对侧上的一对相应的纸板栅栏。 同一侧的慢跑者和篱笆可以由共同的可移动框架(107,108)支撑,使得可以通过公共结构和公共驱动单元来实现点动动作和薄板挡板调节。
    • 2. 发明申请
    • BOOKBINDING DEVICE
    • BOOKBINDING设备
    • US20130272817A1
    • 2013-10-17
    • US13773756
    • 2013-02-22
    • Kuniaki KIMURAKenichi WATANABE
    • Kuniaki KIMURAKenichi WATANABE
    • B42C9/00B42C5/00
    • B42C9/0056B42C5/00
    • A bookbinding device includes: a heater unit which applies a predetermined heat to a bookbinding tape by a heater so that a binding portion of a sheet bundle is pressure-bonded by melting an adhesive adhered to one surface of the bookbinding tape; a heater moving unit which moves the heater; a sheet bundle moving unit which moves the sheet bundle in a nipped state; and a control unit which controls the heater moving unit and the sheet bundle moving unit so as to perform a preliminary heating step in which the binding portion of the sheet bundle is heated by the heater in advance and heat-fixing step in which a bookbinding tape is heat-fixed to the binding portion of the sheet bundle by the heater while the bookbinding tape overlaps the binding portion of the heated sheet bundle.
    • 装订装置包括:加热器单元,其通过加热器将预定的热量施加到装订带上,使得通过熔化粘附到装订带的一个表面上的粘合剂来对片材束的结合部分进行压力粘合; 加热器移动单元,其移动加热器; 纸张捆移动单元,其在夹持状态下移动所述纸张束; 以及控制单元,其控制加热器移动单元和片材摞移动单元,以便执行预热加热步骤,其中片材束的装订部分预先由加热器加热,并且热定影步骤,其中装订带 通过加热器热固定到片材束的结合部分,同时装订带与加热的片材束的捆扎部分重叠。
    • 3. 发明申请
    • SHEET PROCESSING DEVICE
    • 板材加工设备
    • US20120299238A1
    • 2012-11-29
    • US13494592
    • 2012-06-12
    • Kuniaki KIMURAKenichi WATANABE
    • Kuniaki KIMURAKenichi WATANABE
    • B65H31/36
    • B65H31/38B65H2301/4219B65H2801/06
    • A sheet processing device in the form of an offset stacker, a sheet fence (103, 104) is provided on a side of sheets (S) to be processed stacked on a stack tray (3) opposite from a jogger (101, 102) so that the sheet fence accurately defines a final offset position of the sheets. When a transient offset position at which the sheets are stacked on the stack tray varies from one sheet to another, the side edges of sheets selected for offset stacking can be lined up without fail owing to the jogging action of the jogger and the supporting action of the sheet fence. A pair of joggers may be arranged on either side of the sheets, along with a pair of corresponding sheets fences on the opposing sides. The jogger and sheet fence on a same side may be supported by a common moveable frame (107, 108).
    • 形式为偏移堆叠器的片材处理装置,片状栅栏(103,104)设置在与加工器(101,102)相对的堆叠托盘(3)上堆叠的待处理纸张(S)的一侧, 使得板材栅栏精确地限定片材的最终偏移位置。 当堆叠托盘上堆叠片材的瞬时偏移位置从一张片材变化到另一片时,由于慢跑器的慢跑动作和选择用于偏移堆叠的片材的侧边缘可以被排成一行,并且支撑动作 板栅栏。 一对慢跑器可以布置在纸张的两侧,以及在相对侧上的一对相应的纸板栅栏。 同一侧的慢跑者和篱笆可以由公共可移动框架(107,108)支撑。
    • 4. 发明申请
    • BOOKBINDING APPARATUS
    • BOOKBINDING设备
    • US20130272819A1
    • 2013-10-17
    • US13773752
    • 2013-02-22
    • Kuniaki KIMURAKenichi WATANABE
    • Kuniaki KIMURAKenichi WATANABE
    • B42B5/10
    • B42B5/103
    • A bookbinding apparatus inserts ring parts of a comb-shaped ring into binding holes of a sheet bundle and files and binds the sheet bundle, sequentially and includes a binding hole forming section configured to form binding holes in the sheet, a compiling section configured to arrange the sheet in which the binding holes are formed to make the sheet bundle, a comb-shaped ring feeding section configured to feed the comb-shaped ring piece by piece, a binding section configured to receive the fed comb-shaped ring, insert the ring parts of the comb-shaped ring into the binding holes of the sheet bundle, and bind the sheet bundle, and a bound-book discharging section configured to transfer the sheet bundle bound by the binding section to a storage stacker.
    • 装订装置将梳形环的环形部件插入片材捆的装订孔中并依次进行文件捆绑并捆扎,并且包括装配孔形成部分,其构造成在片材中形成装订孔;编制部分, 其中装订孔形成以制成片材摞的片材,被配置为一体地供给梳状环件的梳形环供给部分,构造成接收进给的梳形环的装订部分,将环 梳形环的一部分插入片材束的装订孔中,并捆扎片材束,以及装订物排出部分,被配置为将由装订部分束缚的片材束传送到存放堆垛机。
    • 6. 发明申请
    • CONTROL CIRCUIT BOARD, CONTROL SYSTEM, AND COPYING METHOD
    • 控制电路板,控制系统和复制方法
    • US20130250644A1
    • 2013-09-26
    • US13804948
    • 2013-03-14
    • Kenichi WATANABE
    • Kenichi WATANABE
    • G11C5/06
    • G11C5/06G06F13/00G06F13/1668
    • A control circuit board includes a first storage unit configured to store therein predetermined data; a connecting unit configured to be connected to another control circuit board including a second storage unit; a switching unit configured to switch between a first state and a second state, the first state being a state in which data read from the first storage unit is enabled but data read from the second storage unit is disabled, the second state being a state in which data read from the first storage unit is disabled but data read from the second storage unit is enabled; and a storage control unit configured to write or read data to or from the first storage unit in the first state, and perform a copying operation that reads the data from the second storage unit and stores the read data in the first storage unit in the second state.
    • 控制电路板包括配置成在其中存储预定数据的第一存储单元; 连接单元,被配置为连接到包括第二存储单元的另一个控制电路板; 切换单元,被配置为在第一状态和第二状态之间切换,所述第一状态是其中从所述第一存储单元读取的数据被使能但从所述第二存储单元读取的数据被禁用的状态,所述第二状态是 从第一存储单元读取的数据被禁用,但是从第二存储单元读取的数据被使能; 以及存储控制单元,被配置为在所述第一状态下向所述第一存储单元写入数据或从所述第一存储单元读取数据,并执行从所述第二存储单元读取所述数据的复制操作,并将所读取的数据存储在所述第一存储单元中的所述第二存储单元中 州。
    • 7. 发明申请
    • SEMICONDUCTOR DEVICE HAVING A MULTILAYER INTERCONNECTION STRUCTURE
    • 具有多层互连结构的半导体器件
    • US20110121460A1
    • 2011-05-26
    • US13015594
    • 2011-01-28
    • Kenichi WATANABETomoji NakamuraSatoshi Otsuka
    • Kenichi WATANABETomoji NakamuraSatoshi Otsuka
    • H01L23/52
    • H01L23/481H01L23/522H01L23/5226H01L23/528H01L23/53238H01L23/5329H01L23/53295H01L2924/0002H01L2924/00
    • A semiconductor device has a multilayer interconnection structure, wherein the multilayer interconnection structure comprises at least a first interconnection layer and a second interconnection layer formed over the first interconnection layer, the first interconnection layer comprises a first conductor pattern embedded in a first interlayer insulation film and constituting a part of an interconnection pattern and a second, another interconnection pattern embedded in the first interlayer insulation film, the second interconnection layer comprises a third conductor pattern embedded in a second interlayer insulation film and constituting a part of said interconnection pattern, the third conductor pattern has an extension part in a part thereof so as to extend in a layer identical to the third conductor pattern, the third conductor pattern being electrically connected to the first conductor pattern at a first region of the extension part via a first via plug, the extension part making a contact with the second conductor pattern at a second region further away from, or closer to the third conductor pattern with regard to the first region via a second via-plug of a diameter smaller than the first via-plug, the extension part of the third conductor pattern, the first via-plug and the second via-plug form, together with the second interlayer insulation film, a dual damascene structure.
    • 半导体器件具有多层互连结构,其中所述多层互连结构至少包括形成在所述第一互连层上的第一互连层和第二互连层,所述第一互连层包括嵌入在第一层间绝缘膜中的第一导体图案, 构成互连图案的一部分和嵌入第一层间绝缘膜中的第二另一互连图案,第二互连层包括嵌入第二层间绝缘膜中并构成所述互连图案的一部分的第三导体图案,第三导体 图案的一部分具有延伸部分,以在与第三导体图案相同的层中延伸,第三导体图案经由第一通孔插头在延伸部分的第一区域处电连接到第一导体图案, 扩展部分制作ac 通过直径小于第一通孔插头的第二通孔插头,在相对于第一区域进一步远离或接近第三导体图案的第二区域处与第二导体图案接合,第三导体图案的延伸部分 导体图案,第一通孔塞和第二通孔塞形式与第二层间绝缘膜一起是双镶嵌结构。
    • 8. 发明申请
    • LIQUID CRYSTAL DISPLAY DEVICE AND INSPECTION METHOD THEREOF
    • 液晶显示装置及其检测方法
    • US20090201456A1
    • 2009-08-13
    • US12366984
    • 2009-02-06
    • Kenichi WATANABE
    • Kenichi WATANABE
    • G02F1/1345G02F1/133G01R31/00
    • G02F1/1345G02F2001/136254
    • An object of the present invention is to provide a technique capable of adapting to a narrow pitch between bumps of a recent driver LSI without reducing a size of a conductive pattern part. A liquid crystal display device according to the present invention includes a display unit and a plurality of wirings formed on an electrode substrate of the display unit. Thus, the liquid crystal display device according to the present invention further includes a driver LSI, measurement wirings branching from the plurality of wirings positioned between the display unit and the driver LSI, and a conductive pattern part formed above the measurement wiring excluding a branch point through a first insulation layer and formed over the measurement wirings branching from the plurality of wirings.
    • 本发明的目的是提供一种能够适应近期驱动器LSI的凸起之间的窄间距而不减小导电图案部分的尺寸的技术。 根据本发明的液晶显示装置包括显示单元和形成在显示单元的电极基板上的多个布线。 因此,根据本发明的液晶显示装置还包括驱动器LSI,从位于显示单元和驱动器LSI之间的多个布线分支的测量布线和形成在测量布线之上的导电图案部分,不包括分支点 通过第一绝缘层形成在从多个布线分支的测量配线上。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE HAVING WIRING MADE BY DAMASCENE METHOD AND CAPACITOR AND ITS MANUFACTURE METHOD
    • 具有通过方法和电容器制造的接线的半导体器件及其制造方法
    • US20130011995A1
    • 2013-01-10
    • US13613961
    • 2012-09-13
    • Kenichi WATANABE
    • Kenichi WATANABE
    • H01L21/02
    • H01L23/5223H01L21/76808H01L21/76834H01L23/53238H01L23/53295H01L28/75H01L2924/0002H01L2924/00
    • A wiring trench is formed in an interlayer insulating film partway in the depth direction of the interlayer insulating film. A via hole is formed extending from the bottom of the wiring trench to the bottom of the interlayer insulating film. A capacitor recess is formed reaching the bottom of the interlayer insulating film. A conductive member is embedded in the wiring trench and via hole. A capacitor is embedded in the capacitor recess, including a lower electrode, a capacitor dielectric film and an upper electrode. The lower electrode is made of the same material as that of the conductive member and disposed along the bottom and side surface of the capacitor recess. A concave portion is formed on an upper surface of the lower electrode, and the capacitor dielectric film covers an inner surface of the concave portion. The upper electrode is embedded in the concave portion.
    • 在层间绝缘膜的深度方向上的中间绝缘膜中形成布线沟槽。 形成从布线沟槽的底部到层间绝缘膜的底部延伸的通孔。 形成电容器凹部到达层间绝缘膜的底部。 导电构件嵌入布线沟槽和通孔中。 电容器嵌入在电容器凹部中,包括下电极,电容器电介质膜和上电极。 下电极由与导电部件相同的材料制成,并沿着电容器凹部的底面和侧面设置。 在下电极的上表面上形成凹部,电容电介质膜覆盖凹部的内表面。 上部电极嵌入凹部。