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    • 1. 发明申请
    • Nitride-based semiconductor light emitting diode
    • 氮化物半导体发光二极管
    • US20070284593A1
    • 2007-12-13
    • US11798677
    • 2007-05-16
    • Kun KoBang OhSeok HwangJe KimHyung ParkDong Kim
    • Kun KoBang OhSeok HwangJe KimHyung ParkDong Kim
    • H01L33/00H01L31/12H01L27/15H01L29/26
    • H01L33/38H01L33/20
    • A nitride-based semiconductor LED comprises a substrate; an n-type nitride semiconductor layer formed on the substrate; an active layer formed on a predetermined region of the n-type nitride semiconductor layer; a p-type nitride semiconductor layer formed on the active layer; a p-electrode formed on the p-type nitride semiconductor layer, the p-electrode having a p-type branch electrode; a p-type ESD pad formed at the end of the p-type branch electrode, the p-type ESD pad having a larger width than the end of the p-type branch electrode; an n-electrode formed on the n-type nitride semiconductor layer, on which the active layer is not formed, the n-electrode having an n-type branch electrode; and an n-type ESD pad formed at the end of the n-type branch electrode, the n-type ESD pad having a larger width than the end of the n-type branch electrode.
    • 氮化物系半导体LED包括基板; 在该基板上形成的n型氮化物半导体层; 形成在所述n型氮化物半导体层的预定区域上的有源层; 形成在有源层上的p型氮化物半导体层; 形成在p型氮化物半导体层上的p电极,p电极具有p型分支电极; 形成在p型分支电极的端部的p型ESD焊盘,p型ESD焊盘的宽度大于p型分支电极的端部; 形成在其上没有形成有源层的n型氮化物半导体层上的n电极,具有n型分支电极的n电极; 以及形成在n型分支电极的端部的n型ESD焊盘,该n型ESD焊盘的宽度大于n型分支电极的端部。
    • 2. 发明申请
    • Flip chip light emitting diode and method of manufacturing the same
    • 倒装芯片发光二极管及其制造方法
    • US20060261358A1
    • 2006-11-23
    • US11414362
    • 2006-05-01
    • Seok HwangJe KimYoung ParkMin KimHyo-Kyoung ChoKun KoBok Min
    • Seok HwangJe KimYoung ParkMin KimHyo-Kyoung ChoKun KoBok Min
    • H01L33/00
    • H01L33/38H01L33/382H01L33/62H01L2224/05001H01L2224/05022H01L2224/05568H01L2224/0557H01L2224/05571H01L2224/16H01L2933/0016
    • The present invention relates to a flip chip light emitting diode in which an n-type electrode is formed on an insulating layer so that a large light emitting area can be secured to thereby enhance a current-spreading effect and in which the n-type electrode serves as a light reflecting layer so that light is prevented from being transmitted into the rear surface to thereby enhance light emission efficiency. The flip chip light emitting diode includes an optically-transparent substrate; a light emitting substrate that is formed by sequentially laminating an n-type nitride semiconductor layer, an active layer, a p-type nitride semiconductor layer on the substrate and that includes mesas which are formed by etching the active layer and the p-type nitride semiconductor layer into a predetermined width so that a plurality of regions of the n-type nitride semiconductor layer are exposed; a plurality of p-type electrodes that are formed on the p-type nitride semiconductor layer of the light emitting structure; an insulating layer that is formed on the surface of the light emitting structure from a portion of the plurality of p-type electrodes to a portion of the n-type nitride semiconductor layer of the mesa; and an n-type electrode that is formed across the insulating layer and the mesa and comes in contact with the exposed n-type nitride semiconductor layer of the mesa.
    • 本发明涉及一种倒装芯片发光二极管,其中在绝缘层上形成n型电极,从而可以确保大的发光区域,从而提高电流扩散效应,其中n型电极 作为光反射层,防止光被透射到后表面,从而提高发光效率。 倒装芯片发光二极管包括光学透明基板; 通过在衬底上顺序地层叠n型氮化物半导体层,有源层,p型氮化物半导体层,并且包括通过蚀刻有源层和p型氮化物形成的台面而形成的发光衬底 半导体层形成预定宽度,以使n型氮化物半导体层的多个区域露出; 多个p型电极,形成在发光结构的p型氮化物半导体层上; 在所述发光结构的表面上形成从所述多个p型电极的一部分到所述台面的n型氮化物半导体层的一部分的绝缘层, 以及形成在绝缘层和台面两侧并与台面的暴露的n型氮化物半导体层接触的n型电极。
    • 3. 发明申请
    • Flip chip light emitting diode and method of manufacturing the same
    • 倒装芯片发光二极管及其制造方法
    • US20070012939A1
    • 2007-01-18
    • US11412984
    • 2006-04-28
    • Seok HwangJe KimYoung ParkKun KoJee KimJung ParkBok Min
    • Seok HwangJe KimYoung ParkKun KoJee KimJung ParkBok Min
    • H01L33/00H01L21/00
    • H01L33/08H01L33/32H01L33/38H01L2933/0016
    • The present invention relates to a flip chip light emitting diode, in which the flow of current concentrated on a portion adjacent to an n-type electrode can be induced into the center of a light emitting section and a current-spreading effect is accordingly enhanced, thereby increasing light emission efficiency of a light emitting diode chip, and a method of manufacturing the same. The method of manufacturing a flip chip light emitting diode includes sequentially forming an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer on an optically-transparent substrate; etching predetermined regions of the active layer and p-type nitride semiconductor layer and exposing a plurality of regions of the n-type nitride semiconductor layer so as to form a plurality of mesas; etching predetermined regions of the active layer and p-type nitride semiconductor layer positioned between the formed mesas and exposing the plurality of regions of the n-type nitride semiconductor layer so as to form a plurality of grooves; forming an insulating layer on the surface of the groove; forming a p-type electrode across the insulating layer formed on the upper portion of the p-type nitride semiconductor layer and the surface of the groove; and forming an n-type electrode on the formed mesa.
    • 倒装芯片发光二极管技术领域本发明涉及一种倒装芯片发光二极管,其中集中在与n型电极相邻的部分上的电流可以被感应到发光部分的中心,从而相应地提高了电流扩展效果, 从而提高发光二极管芯片的发光效率及其制造方法。 制造倒装芯片发光二极管的方法包括在光学透明基板上依次形成n型氮化物半导体层,有源层和p型氮化物半导体层; 蚀刻有源层和p型氮化物半导体层的预定区域,并露出n型氮化物半导体层的多个区域以形成多个台面; 蚀刻位于形成的台面之间的有源层和p型氮化物半导体层的预定区域,并暴露出n型氮化物半导体层的多个区域以形成多个沟槽; 在所述槽的表面上形成绝缘层; 在形成在p型氮化物半导体层的上部和沟槽的表面上的绝缘层上形成p型电极; 并在形成的台面上形成n型电极。
    • 4. 发明申请
    • Nitride semiconductor light emitting diode and method of manufacturing the same
    • 氮化物半导体发光二极管及其制造方法
    • US20070007584A1
    • 2007-01-11
    • US11480901
    • 2006-07-06
    • Seok HwangJe KimKun KoBok Min
    • Seok HwangJe KimKun KoBok Min
    • H01L29/792
    • H01L33/42H01L27/156H01L33/08H01L33/38
    • The present invention relates to a GaN-based semiconductor light emitting diode and a method of manufacturing the same. The GaN-based semiconductor light emitting diode includes: a substrate; a n-type nitride semiconductor layer formed on the substrate; an active layer formed on a predetermined portion of the n-type nitride semiconductor layer; a p-type nitride semiconductor layer formed on the active layer; a transparent conductive layer formed on the p-type nitride semiconductor layer; an insulating layer formed on an upper center portion of the transparent conductive layer, the insulating layer having a contact hole defining a p-type contact region; a p-electrode formed on the insulating layer and electrically connected to the transparent conductive layer through the contact hole; and an n-electrode formed on the n-type nitride semiconductor layer where no active layer is formed.
    • 本发明涉及GaN基半导体发光二极管及其制造方法。 GaN基半导体发光二极管包括:基板; 在该基板上形成的n型氮化物半导体层; 形成在所述n型氮化物半导体层的预定部分上的有源层; 形成在有源层上的p型氮化物半导体层; 形成在p型氮化物半导体层上的透明导电层; 绝缘层,形成在所述透明导电层的上中心部分上,所述绝缘层具有限定p型接触区域的接触孔; p电极,形成在所述绝缘层上,并通过所述接触孔与所述透明导电层电连接; 以及形成在不形成有源层的n型氮化物半导体层上的n电极。
    • 8. 发明申请
    • Nitride based semiconductor device
    • 氮化物基半导体器件
    • US20060086932A1
    • 2006-04-27
    • US11098278
    • 2005-04-04
    • Sun KimDong ChoJe KimKyu LeeJeong OhDong Kim
    • Sun KimDong ChoJe KimKyu LeeJeong OhDong Kim
    • H01L29/06
    • H01L33/32B82Y20/00H01L33/06H01S5/0213H01S5/3216H01S5/34333H01S2304/12
    • The present invention provides a nitride based semiconductor device comprising an active layer having a quantum well layer and a quantum barrier layer, wherein the device includes an electron emitting layer formed of at least two repeats of a first nitride semiconductor layer and a second nitride semiconductor layer having different compositions between a n-type nitride semiconductor layer and the active layer, the first nitride semiconductor layer has an energy band gap greater than that of the quantum well layer, smaller than that of the quantum barrier layer, and decreasing closer to the active layer, and the second nitride semiconductor layer has an energy band gap at least higher than that of the adjacent first nitride semiconductor layer(s) and has a thickness capable of tunneling electrons.
    • 本发明提供了一种氮化物基半导体器件,其包括具有量子阱层和量子势垒层的有源层,其中该器件包括由至少两个重复的第一氮化物半导体层和第二氮化物半导体层形成的电子发射层 在n型氮化物半导体层和有源层之间具有不同的组成,第一氮化物半导体层的能带隙大于量子阱层的能带隙,小于量子势垒层的能带隙,并且更接近于活性层 层,并且第二氮化物半导体层具有至少比相邻的第一氮化物半导体层的能带隙高的能带隙,并且具有能够隧穿电子的厚度。