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1. 发明专利

JP2014132540A Plasma surface treatment device 审中-公开
标题翻译：等离子体表面处理装置
公开(公告)号：JP2014132540A
公开(公告)日：2014-07-17
申请号：JP2013000736
申请日：2013-01-07
申请人： Kowa Dennetsu Keiki:Kk , 株式会社幸和電熱計器 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： KAWAI KIYOSHI , MURAKAMI HIROYOSHI , KITAGUCHI TATSUO , NAKAO SHIGEKI , HAYASHI TOMIO , KIRIYAMA KAZUO
IPC分类号： H05H1/24 , B01J19/08 , B29C33/10 , C23C16/44 , C23C16/50 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a plasma surface treatment device which has a sufficient exhaust function and enables downsizing of the device.SOLUTION: A plasma surface treatment device 1 radiates a plasma excitation gas generated by a plasma generating nozzle 2 from a plasma jetting port 22 to perform plasma treatment on a workpiece S. The plasma surface treatment device 1 includes: a gas recovery passage 3 in which a gas suction port 33 for suctioning the gas from an outer circumferential direction of the plasma jetting port 22 opens; and an ejector mechanism 4 which suctions the gas from the gas suction port 33 into the gas recovery passage 3 under negative pressure and exhausts the gas. The gas suction port 33 opens at an outer periphery of the plasma jetting port 22 in a circumferential form in a plan view.
摘要翻译：要解决的问题：提供一种等离子体表面处理装置，其具有足够的排气功能并且能够使装置小型化。解决方案：等离子体表面处理装置1将等离子体产生喷嘴2产生的等离子体激发气体从等离子体喷射口等离子体表面处理装置1包括：气体回收通道3，其中用于从等离子体喷射口22的外周方向抽吸气体的气体吸入口33打开; 以及在负压下从气体吸入口33吸入气体进入气体回收通道3并排出气体的喷射器机构4。气体吸入口33在等离子体喷射口22的外周以平面图的圆周方式开口。

2. 发明专利

JP2012020359A Cutting tool and device for evaluating cutting processing 有权
标题翻译：用于评估切割加工的切割工具和装置
公开(公告)号：JP2012020359A
公开(公告)日：2012-02-02
申请号：JP2010158985
申请日：2010-07-13
申请人： Kowa Dennetsu Keiki:Kk , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社幸和電熱計器
发明人： KAWAI KIYOSHI , KOMATSUZAKI TORU , HAYASHI TOMIO , KONISHI YOICHI , MATSUDA HIROSHI
IPC分类号： B23B27/00 , B23B51/00 , B23C9/00 , B23Q17/09
摘要： PROBLEM TO BE SOLVED: To provide a cutting tool and a device for evaluating cutting processing which increase a degree of freedom for arranging such cutting tools as a variety of bites and drills and working efficiency in exchanging the cutting tools, and evaluate a processing state of cutting processing on a timely basis to effectively prevent the deterioration of the cutting performance of a cutting blade and the occurrence of a nonconforming product.SOLUTION: The device for evaluating cutting processing includes: a body 20 detachably fixed to an edged tool stock of a machine tool; a machining blade 21 provided at a tip 22 of the body 20; a sensor 3 provided in the proximity of a cutting blade 21c of the machining blade 21 and acquiring the physical information of the machining blade 21; and a communication unit 5 detachably connected with a cable member 4 connected with the sensor 3 and transmitting the physical information acquired by the sensor 3 through wireless communication.
摘要翻译：要解决的问题：提供一种用于评估切割加工的切削工具和装置，其增加了用于布置诸如各种镗刀和钻头的切削工具的自由度和更换切削工具的工作效率，并评估及时进行切削加工的状态，有效防止切削刃的切削性能的劣化和不合格品的产生。解决方案：用于评估切割加工的装置包括：可拆卸地固定到机床的边缘刀具的主体20; 设置在主体20的尖端22处的加工刀片21; 设置在加工用刮板21的切削刃21c附近并获取加工用刮刀21的物理信息的传感器3; 以及通信单元5，其与与传感器3连接的电缆部件4可拆卸地连接，并且通过无线通信传输由传感器3获取的物理信息。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2014106004A X-ray stress measurement device 审中-公开
标题翻译： X射线应力测量装置
公开(公告)号：JP2014106004A
公开(公告)日：2014-06-09
申请号：JP2012256763
申请日：2012-11-22
申请人： Kowa Dennetsu Keiki:Kk , 株式会社幸和電熱計器 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： KAWAI KIYOSHI , MURAKAMI HIROYOSHI , KAWAI MASATARO , YAMAGUCHI TAKASHI
IPC分类号： G01N23/20
摘要： PROBLEM TO BE SOLVED: To provide an X-ray stress measurement device capable of accurately measuring stress in a circumferential direction and an axial direction of a sample by a side inclination method.SOLUTION: An X-ray stress measurement device 1 for measuring stress of a sample S by a side inclination method comprises: an X-ray generator 2 for making X rays enter the sample S; a diffraction X-ray detector 3 for detecting diffraction X-rays diffracted at a stress measurement point P; an inclination angle change mechanism 5 for performing circular arc movement of the X-ray generator 2 and the diffraction X-ray detector 3 to change an inclination angle ψ of a diffraction plane normal N to a sample surface normal Z; and a measurement direction switching mechanism 6 for rotating the X-ray generator 2, the diffraction X-ray detector 3 and the inclination angle change mechanism 5 to a phase of 90° in a horizontal direction to switch a stress measurement direction.
摘要翻译：要解决的问题：提供能够通过侧倾方法精确地测量样品的周向和轴向的应力的X射线应力测量装置。解决方案：一种用于测量样品的应力的X射线应力测量装置1 通过侧倾方法的样品S包括：用于使X射线进入样品S的X射线发生器2; 用于检测在应力测量点P衍射的衍射X射线的衍射X射线检测器3; 用于进行X射线发生器2和衍射X射线检测器3的圆弧运动以将衍射面法线N的倾斜角ψ改变为样品表面法线Z的倾斜角度变化机构5; 以及用于将X射线发生器2，衍射X射线检测器3和倾斜角度变化机构5沿水平方向旋转90度的测量方向切换机构6，以切换应力测量方向。

4. 发明专利

JP2014013183A X-ray stress measurement device and x-ray stress measurement method 有权
标题翻译： X射线应力测量装置和X射线应力测量方法
公开(公告)号：JP2014013183A
公开(公告)日：2014-01-23
申请号：JP2012150513
申请日：2012-07-04
申请人： Kowa Dennetsu Keiki:Kk , 株式会社幸和電熱計器 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： KAWAI KIYOSHI , MURAKAMI HIROYOSHI , KAWAI MASATARO , HAYASHI TOMIO , YAMAGUCHI TAKASHI
IPC分类号： G01N23/20
摘要： PROBLEM TO BE SOLVED: To provide an X-ray stress measurement device and an X-ray stress measurement method capable of measuring various samples with a simple configuration.SOLUTION: An X-ray stress measurement device 1 includes an X-ray generator 11 for entering X-rays into a sample S, and a diffracted X-ray detector 12 for detecting diffracted X-rays diffracted at a sample measuring point P. The X-ray generator 11, the diffracted X-ray detector 12, or the sample S is rotated to change an inclination angle Ψ of a diffraction surface normal N with respect to a sample surface normal Z, and stress in the sample is measured based on the inclination angle Ψ of the diffraction surface normal N and a diffraction angle 2θ of corresponding diffracted X-rays. The device includes a displacement amount measuring device 13 for measuring the displacement amount of the sample S from a standard fixed position in the sample normal direction. The diffraction angle 2θ is corrected based on the displacement amount measured by the displacement amount measuring device 13.
摘要翻译：要解决的问题：提供能够以简单的结构测量各种样品的X射线应力测量装置和X射线应力测量方法。解决方案：X射线应力测量装置1包括：X射线发生器11，用于将X射线进入样品S，以及衍射X射线检测器12，用于检测在样本测量点P衍射的衍射X射线.X射线发生器11，衍射X射线检测器12或样品S 旋转以相对于样品表面法线Z改变衍射面法线N的倾斜角Ψ，并且基于衍射面法线N的倾斜角Ψ和衍射角2θ来测量样品中的应力。的衍射X射线。该装置包括位移量测量装置13，用于从样本法线方向上的标准固定位置测量样品S的位移量。衍射角2＆thetas; 基于由位移量测量装置13测量的位移量进行校正。

5. 发明专利

JP2004103451A Plate heater 审中-公开
公开(公告)号：JP2004103451A
公开(公告)日：2004-04-02
申请号：JP2002265223
申请日：2002-09-11
申请人： Kowa Dennetsu Keiki:Kk , 株式会社幸和電熱計器
发明人： KAWAI KIYOSHI , OGITA KUNIO
IPC分类号： H05B3/20
摘要： PROBLEM TO BE SOLVED: To provide a plate heater for preventing deformation of the plate heater caused by distortion due to thermal expansion during energization.
SOLUTION: The plate heater formed by integrating a heating element and an electric insulator such as mica includes a slit which reaches to an outer peripheral edge and is formed on a part of the plate heater.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2010192167A Method of manufacturing induction heating coil used for induction hardening of crankshaft for engine and induction heating coil 有权
标题翻译：制造用于发动机和感应加热线圈的起重机的感应加热的感应加热线圈的制造方法
公开(公告)号：JP2010192167A
公开(公告)日：2010-09-02
申请号：JP2009033157
申请日：2009-02-16
申请人： Kdk:Kk , Kowa Dennetsu Keiki:Kk , 株式会社ケイディケイ , 株式会社幸和電熱計器
发明人： KAWAI KIYOSHI , ISHIHARA KAZUHIRO
IPC分类号： H05B6/36 , B23K20/00 , B23K20/24 , B23K101/38 , C21D1/10 , C21D9/30
CPC分类号： Y02P10/253
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an induction heating coil used for induction hardening of the crankshaft for an engine and an induction heating coil, prevented in deterioration of the product quality with excellent in product service life. SOLUTION: The method of manufacturing an induction heating coil includes: a first processing step S100 of boring groove parts 80a, etc. having a predetermined shape in a plurality of preforms 60-64 made of a base material of an induction heating coil body 10 to form a cooling water passage 5 as a whole by combining the preforms 60-64 on joining surfaces 60a, etc.; a joining step S110 of forming one molded body 6 by respectively combining the preforms 60-64 having the groove parts 80a, etc. bored in the first processing step S100 on predetermined joining surfaces 60a, etc. and joining the joining surfaces 60a, etc. of the preforms 60-64 by solid-phase welding; and a second processing step S120 of shaving the induction heating coil body 10 based on the shape of the groove parts 80a, etc. with respect to the molded body 6 joined in the joining step S110. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造用于发动机曲轴和感应加热线圈的感应加热线圈的方法，防止产品质量恶化，并且产品使用寿命优异。解决方案：制造感应加热线圈的方法包括：在由感应加热线圈的基材制成的多个预成型件60-64中具有预定形状的镗孔部分80a等的第一加工步骤S100 主体10通过将预成型件60-64组合在接合表面60a等上而整体形成冷却水通道5; 通过在预定的接合表面60a等上分别组合在第一处理步骤S100中钻出的具有凹槽部分80a等的预成型件60-64并且接合接合表面60a等来形成一个成型体6的接合步骤S110。的预成型坯60-64通过固相焊接; 以及基于在接合步骤S110中接合的成型体6的槽部80a等的形状来对感应加热线圈体10进行剃刮的第二处理步骤S120。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2011017496A Fluid heating device and substrate treatment device using the same 有权
标题翻译：流体加热装置和使用该流体加热装置的基板处理装置
公开(公告)号：JP2011017496A
公开(公告)日：2011-01-27
申请号：JP2009162769
申请日：2009-07-09
申请人： Kowa Dennetsu Keiki:Kk , 株式会社幸和電熱計器
发明人： KAWAI KIYOSHI
IPC分类号： F24H1/10 , H01L21/304 , H05B6/10
摘要： PROBLEM TO BE SOLVED: To provide a fluid heating device and a substrate treatment device using the same capable of improving the heating efficiency of fluid while preventing the deterioration of a heating element.SOLUTION: In the fluid heating device which includes a pipe 5 formed of a non-magnetic material and feeding the fluid in its internal space, an induction heating coil 6 wound on an outer side of the pipe 5, and the heating element 7 formed of a magnetic material and heated by induction heating, and in which the heating element 7 is allowed to generate heat by applying a high-frequency electric current to the induction heating coil 6, and the fluid flowing in the pipe 5 is heated by the heating element 7 generating heat, the pipe 5 has a hollow cylindrical body 50, and a storage section 51 extended to an intermediate section of an internal space along the shaft center C of the body 50, defined from the internal space of the body 50, and communicating with an external space, and the heating element 7 is received in the storage section 51.
摘要翻译：要解决的问题：提供一种流体加热装置和使用该流体加热装置的基板处理装置，其能够提高流体的加热效率，同时防止加热元件的劣化。解决方案：在包括管5的流体加热装置中，该管5由非磁性材料并在其内部空间供给流体，卷绕在管5的外侧的感应加热线圈6和由磁性材料形成并通过感应加热加热的加热元件7，其中加热元件7通过向感应加热线圈6施加高频电流而产生热量，并且通过发热元件7在管道5中流动的流体被加热，管5具有中空圆筒体50，以及从本体50的内部空间限定的沿主体部50的轴心C延伸到内部空间的中间部并与外部空间连通的收纳部51，以及加热元件7被容纳在存储部分51中。

8. 发明专利

JP2006084155A Metal melting device 有权
标题翻译：金属熔化设备
公开(公告)号：JP2006084155A
公开(公告)日：2006-03-30
申请号：JP2004271343
申请日：2004-09-17
申请人： Kowa Dennetsu Keiki:Kk , 株式会社幸和電熱計器
发明人： KAWAI KIYOSHI
IPC分类号： F27B14/06 , B22D17/28 , B22D35/06 , C23C30/00 , F27D3/10 , F27D3/14 , F27D11/06 , F27D21/00
摘要： PROBLEM TO BE SOLVED: To supply a required quantity of melting object metal to a molding machine when necessary, without using a huge melting furnace and a molten metal holding furnace.
SOLUTION: A melting object metal raw material is stored in a hopper 3 made of steel. A heating induction coil 1 for heating the hopper 3 and heating and melting the melting object metal raw material, is wound on an outer peripheral part of the hopper 3. The hopper 3 is composed of a highly conductive material having the heat resistant temperature higher than the melting object metal. A high frequency power source 2 for flowing a high frequency current is connected to the heating induction coil 1. The metal is melted by heating the hopper 3 by flowing the high frequency current by the heating induction coil 1.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了在必要时向成形机提供所需量的熔化对象金属，而不使用巨大的熔化炉和熔融金属保持炉。解决方案：将熔化的对象金属原料储存在由钢制成的料斗3中。用于加热料斗3并加热和熔化熔化对象金属原料的加热感应线圈1被卷绕在料斗3的外周部分上。料斗3由耐热温度高于熔化对象金属。用于流过高频电流的高频电源2连接到加热感应线圈1上。通过由加热感应线圈1流动高频电流来加热料斗3来熔化金属。版权所有（C））2006，JPO＆NCIPI

9. 发明专利

JP2005274115A Fluid heating device 审中-公开
标题翻译：流体加热装置
公开(公告)号：JP2005274115A
公开(公告)日：2005-10-06
申请号：JP2004124861
申请日：2004-03-23
申请人： Kowa Dennetsu Keiki:Kk , 株式会社幸和電熱計器
发明人： KAWAI KIYOSHI
IPC分类号： H05B6/06 , F24H1/10 , H01L21/02 , H05B6/10
摘要： PROBLEM TO BE SOLVED: To provide a fluid heating device capable of efficiently heating without generating abnormal sound (blowing noise) and without limitation in machining, and possible to be miniaturized.
SOLUTION: This fluid heating device is provided with a heating tube 6 to be provided on the way of a pipe, in which a fluid to be heated flows, a coil 5 wound around the peripheral part of the heating tube to heat the heating tube 6, and a high frequency power source device 1 for letting the high frequency current flow to the coil 5. The heating tube 5 is made of a conductive material, and has both end parts 6b, and fluid gathering parts 6b of both the end parts are connected to each other through a plurality of connecting tubes 6a.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够有效地加热而不产生异常声音（吹风噪声）并且不限于机械加工并且可能小型化的流体加热装置。解决方案：该流体加热装置设置有加热管6，该加热管6设置在待加热流体流动的管道上，卷绕在加热管的周边部分上的线圈5以加热加热管6和用于使高频电流流向线圈5的高频电源装置1.加热管5由导电材料制成，并且具有两端部6b和两者的流体收集部6b 端部通过多个连接管6a彼此连接。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2004134475A Temperature raising/lowering device for semiconductor device 有权
公开(公告)号：JP2004134475A
公开(公告)日：2004-04-30
申请号：JP2002295554
申请日：2002-10-09
申请人： Kowa Dennetsu Keiki:Kk , 株式会社幸和電熱計器
发明人： KAWAI KIYOSHI
IPC分类号： H05B3/20 , H01L21/02 , H01L21/027 , H05B3/00 , H05B3/68
摘要： PROBLEM TO BE SOLVED: To enable a temperature raising/lowering device for a semiconductor to quickly and accurately respond to a set temperature by reducing the size and thickness of the device.
SOLUTION: The temperature raising/lowering device is constituted of a heating element which efficiently and uniformly heats a liner plate through a heat transfer system, a Peltier element which cools the liner plate through the heat transfer system, and a control circuit which controls the liner plate to a set temperature based on the signal from a temperature sensor which detects the temperature of the liner plate. Since the temperature raising/lowering device is reduced in size and thickness, the device can quickly and accurately respond to the set temperature.
COPYRIGHT: (C)2004,JPO

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