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1. 发明申请

US20090115056A1 DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE, AND MOBILE DEVICE 有权
标题翻译：器件安装板，半导体模块和移动设备
公开(公告)号：US20090115056A1
公开(公告)日：2009-05-07
申请号：US12263174
申请日：2008-10-31
申请人： Kouichi Saitou , Mayumi Nakasato , Ryosuke Usui
发明人： Kouichi Saitou , Mayumi Nakasato , Ryosuke Usui
IPC分类号： H01L23/492
CPC分类号： H01L23/49811 , H01L23/145 , H01L23/3733 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H05K1/0366 , H05K1/112 , H05K3/0041 , H05K3/3436 , H05K3/3457 , H05K2201/09509 , H05K2201/09527 , H05K2203/1152 , H01L2224/05599
摘要： A device mounting board includes an insulating layer formed of an insulating resin, a glass cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the glass cloth is larger than that of the resin. Thus, solder bumps are formed on the electrode of the device mounting board 10 with high precision.
摘要翻译：装置安装板包括由绝缘树脂形成的绝缘层，覆盖绝缘层表面的玻璃布和设置在穿过玻璃布的通孔中的电极。玻璃布与焊料的接触角大于树脂的接触角。因此，高精度地在器件安装板10的电极上形成焊料凸块。

2. 发明授权

US08097946B2 Device mounting board, semiconductor module, and mobile device 有权
标题翻译：设备安装板，半导体模块和移动设备
公开(公告)号：US08097946B2
公开(公告)日：2012-01-17
申请号：US12263174
申请日：2008-10-31
申请人： Kouichi Saitou , Mayumi Nakasato , Ryosuke Usui
发明人： Kouichi Saitou , Mayumi Nakasato , Ryosuke Usui
IPC分类号： H01L23/053 , H01L23/12
CPC分类号： H01L23/49811 , H01L23/145 , H01L23/3733 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H05K1/0366 , H05K1/112 , H05K3/0041 , H05K3/3436 , H05K3/3457 , H05K2201/09509 , H05K2201/09527 , H05K2203/1152 , H01L2224/05599
摘要： A device mounting board includes an insulating layer formed of an insulating resin, a glass cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the glass cloth is larger than that of the resin. Thus, solder bumps are formed on the electrode 14 of the device mounting board 10 with high precision.
摘要翻译：装置安装板包括由绝缘树脂形成的绝缘层，覆盖绝缘层表面的玻璃布和设置在穿过玻璃布的通孔中的电极。玻璃布与焊料的接触角大于树脂的接触角。因此，在装置安装基板10的电极14上高精度地形成焊锡凸块。

3. 发明申请

US20120288999A1 METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES 有权
标题翻译：制造半导体模块的方法
公开(公告)号：US20120288999A1
公开(公告)日：2012-11-15
申请号：US13554605
申请日：2012-07-20
申请人： Mayumi NAKASATO , Kouichi Saitou
发明人： Mayumi NAKASATO , Kouichi Saitou
IPC分类号： H01L21/78
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/3135 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/96 , H01L2221/68336 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/2101 , H01L2224/215 , H01L2224/2201 , H01L2224/221 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H01L2924/00
摘要： A method for fabricating a semiconductor module includes: bonding a semiconductor substrate onto a first insulating resin layer; dicing the semiconductor substrate into a plurality of individual semiconductor devices; widening the spacings between the adjacent semiconductor devices by expanding the first insulating resin layer in a biaxially stretched manner; fixing the plurality of semiconductor devices to a flat sheet, with a second insulating resin layer held between the plurality of semiconductor devices and the flat sheet, and removing the first insulating resin layer; stacking the plurality of semiconductor devices, a third insulating resin layer, and a metallic plate, in this order, so as to form a laminated body having electrodes by which to electrically connect the device electrodes to the metallic plate; forming a wiring layer by selectively removing the metallic plate and forming a plurality of semiconductor modules; and separating the semiconductor modules into individual units.
摘要翻译：一种制造半导体模块的方法包括：将半导体衬底接合到第一绝缘树脂层上; 将半导体衬底切割成多个单独的半导体器件; 通过以双向拉伸方式膨胀第一绝缘树脂层来加宽相邻半导体器件之间的间距; 将多个半导体器件固定到平板上，其中第二绝缘树脂层保持在多个半导体器件和平片之间，并且去除第一绝缘树脂层; 依次层叠多个半导体器件，第三绝缘树脂层和金属板，以形成具有电极的层叠体，用于将器件电极与金属板电连接; 通过选择性地去除所述金属板并形成多个半导体模块来形成布线层; 并将半导体模块分离成单独的单元。

4. 发明授权

US08592257B2 Method for manufacturing semiconductor modules 有权
标题翻译：半导体模块制造方法
公开(公告)号：US08592257B2
公开(公告)日：2013-11-26
申请号：US13554605
申请日：2012-07-20
申请人： Mayumi Nakasato , Kouichi Saitou
发明人： Mayumi Nakasato , Kouichi Saitou
IPC分类号： H01L21/00
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/3135 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/96 , H01L2221/68336 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/2101 , H01L2224/215 , H01L2224/2201 , H01L2224/221 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H01L2924/00
摘要： A method for fabricating a semiconductor module includes: bonding a semiconductor substrate onto a first insulating resin layer; dicing the semiconductor substrate into a plurality of individual semiconductor devices; widening the spacings between the adjacent semiconductor devices by expanding the first insulating resin layer in a biaxially stretched manner; fixing the plurality of semiconductor devices to a flat sheet, with a second insulating resin layer held between the plurality of semiconductor devices and the flat sheet, and removing the first insulating resin layer; stacking the plurality of semiconductor devices, a third insulating resin layer, and a metallic plate, in this order, so as to form a laminated body having electrodes by which to electrically connect the device electrodes to the metallic plate; forming a wiring layer by selectively removing the metallic plate and forming a plurality of semiconductor modules; and separating the semiconductor modules into individual units.
摘要翻译：一种制造半导体模块的方法包括：将半导体衬底接合到第一绝缘树脂层上; 将半导体衬底切割成多个单独的半导体器件; 通过以双向拉伸方式膨胀第一绝缘树脂层来加宽相邻半导体器件之间的间距; 将多个半导体器件固定到平板上，其中第二绝缘树脂层保持在多个半导体器件和平片之间，并且去除第一绝缘树脂层; 依次层叠多个半导体器件，第三绝缘树脂层和金属板，以形成具有电极的层叠体，用于将器件电极与金属板电连接; 通过选择性地去除所述金属板并形成多个半导体模块来形成布线层; 并将半导体模块分离成单独的单元。

5. 发明授权

US08438724B2 Method for producing substrate for mounting device and method for producing a semiconductor module 有权
标题翻译：用于安装装置的基板的制造方法和制造半导体模块的方法
公开(公告)号：US08438724B2
公开(公告)日：2013-05-14
申请号：US12900175
申请日：2010-10-07
申请人： Kouichi Saitou , Yoshio Okayama , Yoh Takano , Mayumi Nakasato
发明人： Kouichi Saitou , Yoshio Okayama , Yoh Takano , Mayumi Nakasato
IPC分类号： H05K3/30 , H01L21/82
CPC分类号： H05K3/4647 , H01L21/486 , H01L23/3114 , H01L23/48 , H01L23/49827 , H01L23/525 , H01L24/16 , H01L24/81 , H01L2224/0231 , H01L2224/02319 , H01L2224/0401 , H01L2224/13099 , H01L2224/81208 , H01L2224/81801 , H01L2224/81894 , H01L2224/83101 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/351 , H05K3/4652 , H05K2203/0369 , Y10T29/4913 , Y10T29/49156 , H01L2924/00
摘要： Methods for producing a substrate for mounting a device and for producing a semiconductor module are provided. The methods comprise preparing a metal plate on one major surface of which a plurality of projected electrodes are provided. An insulating resin layer is formed on the major surface so as to cover the top surface of the projected electrodes. The top surface of at least one of the plurality of projected electrodes is exposed by removing the insulating resin layer so that a major surface of the insulating resin layer opposite to the metal plate is level. A plurality of counter electrodes is arranged having a counterface to face the top face of the plurality of projected electrodes or a semiconductor device having a plurality of device electrodes is arranged to face the top face of the plurality of projected electrodes. The at least one of the plurality of projected electrodes, the top surface of which is exposed, is electrically connected with at least one of the plurality of counter electrodes facing the projected electrodes, by pressure-bonding the metal plate with the counter electrode. A wiring layer is formed by selectively removing the metal plate.
摘要翻译：提供了用于制造用于安装装置的基板和用于制造半导体模块的方法。所述方法包括在一个主表面上准备金属板，其上设置有多个突起电极。在主表面上形成绝缘树脂层以覆盖突起电极的顶表面。通过去除绝缘树脂层使多个突起电极中的至少一个的顶表面暴露，使得与金属板相对的绝缘树脂层的主表面水平。多个相对电极被布置成具有面对多个突出电极的顶面的相对面，或者具有多个器件电极的半导体器件被布置成面对多个突出电极的顶面。通过将金属板与对电极压接，多个突出电极中的至少一个突出电极的顶表面被暴露，与多个对置电极中的至少一个面向突出的电极电连接。通过选择性地去除金属板形成布线层。

6. 发明申请

US20110027945A1 SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME 有权
标题翻译：用于安装装置的基板及其制造方法，半导体模块及其制造方法以及提供该装置的便携式装置
公开(公告)号：US20110027945A1
公开(公告)日：2011-02-03
申请号：US12900175
申请日：2010-10-07
申请人： Kouichi Saitou , Yoshio Okayama , Yoh Takano , Mayumi Nakasato
发明人： Kouichi Saitou , Yoshio Okayama , Yoh Takano , Mayumi Nakasato
IPC分类号： H01L21/50 , H05K3/02
CPC分类号： H05K3/4647 , H01L21/486 , H01L23/3114 , H01L23/48 , H01L23/49827 , H01L23/525 , H01L24/16 , H01L24/81 , H01L2224/0231 , H01L2224/02319 , H01L2224/0401 , H01L2224/13099 , H01L2224/81208 , H01L2224/81801 , H01L2224/81894 , H01L2224/83101 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/351 , H05K3/4652 , H05K2203/0369 , Y10T29/4913 , Y10T29/49156 , H01L2924/00
摘要： A substrate for mounting a device comprises: an insulating resin layer; a plurality of projected electrodes that are connected electrically to a wiring layer provided on one major surface of the insulating resin layer, and that project toward the insulating resin layer from the wiring layer; and a counter electrode provided at a position corresponding to each of the plurality of projected electrodes on the other major surface of the insulating resin layer. Among the projected electrodes, a projected length of part of the projected electrodes is smaller than that of the other projected electrodes; and the projected electrode and the counter electrode corresponding thereto are capacitively-coupled, and the projected electrode and the counter electrode are connected electrically.
摘要翻译：用于安装装置的基板包括：绝缘树脂层; 多个突起电极，其电连接到设置在所述绝缘树脂层的一个主表面上的布线层，并且从所述布线层向所述绝缘树脂层突出; 以及设置在与绝缘树脂层的另一个主表面上的多个突出电极中的每一个对应的位置处的对置电极。在投影电极中，部分投影电极的投影长度小于其他投射电极的投影长度; 并且对应于其的投影电极和对电极电容耦合，并且投影电极和对电极电连接。

7. 发明申请

US20110074021A1 DEVICE MOUNTING BOARD, AND SEMICONDUCTOR MODULE 审中-公开
标题翻译：器件安装板和半导体模块
公开(公告)号：US20110074021A1
公开(公告)日：2011-03-31
申请号：US12895417
申请日：2010-09-30
申请人： Mayumi NAKASATO , Kouichi Saitou , Tetsuya Yamamoto
发明人： Mayumi NAKASATO , Kouichi Saitou , Tetsuya Yamamoto
IPC分类号： H01L23/48 , H05K1/11
CPC分类号： H05K3/4007 , H01L23/49811 , H01L24/11 , H01L2224/05144 , H01L2224/05155 , H01L2224/05647 , H01L2924/14 , H01L2924/351 , H05K1/111 , H05K2201/0355 , H05K2201/0367 , H05K2201/09745 , H05K2201/10674 , H05K2203/0369 , H01L2924/00 , H01L2924/00014
摘要： A device mounting board includes an insulating resin layer, a wiring layer provided on one of main surfaces of the insulating resin layer, and bump electrodes connected electrically to the wiring layer and protruding on a side of the insulating resin layer from the wiring layer. A semiconductor module is formed by having the bump electrodes connected to a semiconductor device. A recess is provided in the top face of each bump electrode. The recess communicates with an opening provided on a side surface of the bump electrode.
摘要翻译：装置安装板包括绝缘树脂层，设置在绝缘树脂层的一个主表面上的布线层以及与布线层电连接并从绝缘树脂层的布线层突出的凸起电极。通过将凸块电极连接到半导体器件来形成半导体模块。在每个凸起电极的顶面设置凹部。凹部与设置在凸块电极的侧面上的开口连通。

8. 发明申请

US20140038008A1 BATTERY MODULE 审中-公开
标题翻译：电池模块
公开(公告)号：US20140038008A1
公开(公告)日：2014-02-06
申请号：US13983050
申请日：2012-01-11
申请人： Kouichi Saitou , Ryosuke Usui , Yoh Takano
发明人： Kouichi Saitou , Ryosuke Usui , Yoh Takano
IPC分类号： H01M10/50
CPC分类号： H01M10/647 , H01M2/206 , H01M10/613
摘要： A battery cell module includes a plurality of battery cells arranged to each other, bus bars used to connect external terminals of the plurality of battery cells, and separators provided between adjacent battery cells. Each battery cell includes an electrode body, a casing that houses the electrode body, and external terminals, provided external to the casing, which are electrically connected to the electrode body. The separator includes a heat transfer section that performs heat transfer between the heat section and the battery cell and an insulator that electrically insulates between the heat transfer section and the battery cell. The heat transfer section has a thermal conductivity higher than that of the insulator.
摘要翻译：电池单元模块包括彼此配置的多个电池单元，用于连接多个电池单元的外部端子的汇流条以及设置在相邻电池单元之间的隔板。每个电池单元包括电极体，容纳电极体的壳体和设置在壳体外部的外部端子，其电连接到电极体。分离器包括在热部和电池单元之间进行热传递的传热部和在传热部和电池单元之间电绝缘的绝缘体。传热部的导热系数比绝缘体高。

9. 发明授权

US09045620B2 Rubber composition, cross-linked rubber composition, and tire 有权
标题翻译：橡胶组合物，交联橡胶组合物和轮胎
公开(公告)号：US09045620B2
公开(公告)日：2015-06-02
申请号：US14238899
申请日：2012-08-31
申请人： Kouichi Saitou , Keiichi Aomatsu , Masaki Yanagioka
发明人： Kouichi Saitou , Keiichi Aomatsu , Masaki Yanagioka
IPC分类号： C08K3/34 , C08J9/32 , C08K7/26 , C08K3/36 , B60C1/00
CPC分类号： C08K7/26 , B60C1/0016 , C08K3/36 , C08K2201/002 , C08K2201/003 , Y02T10/862 , C08L21/00
摘要： An object of the present invention is to provide: a rubber composition which, when it is applied to a component member (such as a tread) of a tire, exhibits good wear resistance without deteriorating rolling resistance of the tire; a cross-linked rubber composition obtained by cross-linking the rubber composition; and a tire using the rubber composition or the cross-linked rubber composition as a material thereof. Specifically, the present invention provides a rubber composition obtained by blending and kneading a rubber component and hydrated silica together, characterized in that: provided that D represents the average primary particle diameter and LP represents the log differential pore volume at a pore diameter of 30 nm, of the hydrated silica in the rubber composition, D and LP satisfy relationships represented by following formula (1) and (2). LP>−0.045×D+1.45 (1) D
摘要翻译：本发明的目的在于提供一种橡胶组合物，其在施加到轮胎的构成部件（胎面）时表现出良好的耐磨性，而不会降低轮胎的滚动阻力; 通过交联橡胶组合物得到的交联橡胶组合物; 以及使用橡胶组合物或交联橡胶组合物作为其材料的轮胎。具体地说，本发明提供了通过将橡胶成分和水合二氧化硅共混并捏合而得到的橡胶组合物，其特征在于：D表示平均一次粒径，LP表示孔径为30nm的对数微分孔体积的橡胶组合物中的水合二氧化硅，D和LP满足由下式（1）和（2）表示的关系。 LP> -0.045×D + 1.45（1）D <30nm（2）。

10. 发明授权

US06998767B2 Projection tube having different neck diameters 失效
标题翻译：具有不同颈径的投影管
公开(公告)号：US06998767B2
公开(公告)日：2006-02-14
申请号：US09909195
申请日：2001-07-19
申请人： Kouichi Saitou , Kazumasa Hirai , Tetsuo Asano , Kotaro Aoki , Yasuo Tanaka
发明人： Kouichi Saitou , Kazumasa Hirai , Tetsuo Asano , Kotaro Aoki , Yasuo Tanaka
IPC分类号： H01J31/00
CPC分类号： H01J29/861 , H01J2229/8606
摘要： A projection tube having a high focusing performance at a low deflection power includes a funnel, a neck portion and a stem portion which seals the neck portion. The neck portion of the projection tube includes a first neck portion which is connected to the funnel and has a first neck outer diameter, and also includes a second neck portion which accommodates an electron gun and has a second neck outer diameter which is larger than the first neck outer diameter.
摘要翻译：在低偏转功率下具有高聚焦性能的投影管包括密封颈部的漏斗，颈部和杆部。投影管的颈部包括连接到漏斗并且具有第一颈部外径的第一颈部，并且还包括容纳电子枪的第二颈部，并且具有比第二颈部外径大的第二颈部外径第一颈外径。

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