专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07651881B2 Solid-state imaging device and method for manufacturing the same 失效
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07651881B2
公开(公告)日：2010-01-26
申请号：US10807348
申请日：2004-03-24
申请人： Kosuke Takasaki , Kazuhiro Nishida , Kiyofumi Yamamoto
发明人： Kosuke Takasaki , Kazuhiro Nishida , Kiyofumi Yamamoto
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L27/146 , H01L27/14683 , H01L2924/0002 , H01L2924/16235 , H01L2924/00
摘要： A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.
摘要翻译：将涂布有粘合剂的转印膜胶合到形成在玻璃基板上的多个间隔物。玻璃基板被放置在工作台上，转印膜的一端固定在卷绕辊上。剥离引导件设置在转印膜上方的位置。当工作台水平移动时，卷取辊被驱动以卷绕转印膜。卷绕转印膜时，玻璃基板与转印膜之间的夹角保持恒定。在转印膜剥离之后，将粘合剂均匀地转印到每个间隔物中。

2. 发明申请

US20080231739A1 SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20080231739A1
公开(公告)日：2008-09-25
申请号：US12128739
申请日：2008-05-29
申请人： Kosuke Takasaki , Kazuhiro Nishida , Kiyofumi Yamamoto
发明人： Kosuke Takasaki , Kazuhiro Nishida , Kiyofumi Yamamoto
IPC分类号： H04N5/335
CPC分类号： H01L27/14618 , H01L27/146 , H01L27/14683 , H01L2924/0002 , H01L2924/16235 , H01L2924/00
摘要： A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.
摘要翻译：将涂布有粘合剂的转印膜胶合到形成在玻璃基板上的多个间隔物。玻璃基板被放置在工作台上，转印膜的一端固定在卷绕辊上。剥离引导件设置在转印膜上方的位置。当工作台水平移动时，卷取辊被驱动以卷绕转印膜。卷绕转印膜时，玻璃基板与转印膜之间的夹角保持恒定。在转印膜剥离之后，将粘合剂均匀地转印到每个间隔物中。

3. 发明申请

US20060038204A1 Solid-state imaging device and method for manufacturing the same 审中-公开
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20060038204A1
公开(公告)日：2006-02-23
申请号：US11199992
申请日：2005-08-10
申请人： Kosuke Takasaki , Kazuhiro Nishida , Kiyofumi Yamamoto
发明人： Kosuke Takasaki , Kazuhiro Nishida , Kiyofumi Yamamoto
IPC分类号： H01L27/148
CPC分类号： H01L27/14618 , H01L27/146 , H01L27/14683 , H01L2924/0002 , H01L2924/16235 , H01L2924/00
摘要： A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.
摘要翻译：将涂布有粘合剂的转印膜胶合到形成在玻璃基板上的多个间隔物。玻璃基板被放置在工作台上，转印膜的一端固定在卷绕辊上。剥离引导件设置在转印膜上方的位置。当工作台水平移动时，卷取辊被驱动以卷绕转印膜。卷绕转印膜时，玻璃基板与转印膜之间的夹角保持恒定。在转印膜剥离之后，将粘合剂均匀地转印到每个间隔物中。

4. 发明授权

US08034652B2 Solid state imaging device and manufacturing method thereof 有权
标题翻译：固体摄像装置及其制造方法
公开(公告)号：US08034652B2
公开(公告)日：2011-10-11
申请号：US11887116
申请日：2006-03-24
申请人： Kazuhiro Nishida , Hitoshi Shimamura , Kosuke Takasaki
发明人： Kazuhiro Nishida , Hitoshi Shimamura , Kosuke Takasaki
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/566 , H01L23/3121 , H01L23/544 , H01L24/97 , H01L25/0657 , H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14643 , H01L27/14683 , H01L27/14685 , H01L27/148 , H01L2223/54433 , H01L2223/54486 , H01L2224/32225 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/8501 , H01L2224/85013 , H01L2224/97 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/15183 , H01L2924/15311 , H01L2924/15788 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , H01L2924/00 , H01L2224/85 , H01L2924/00012
摘要： A plurality of sensor packages (4) are fixed to a circuit assembly board (47) and placed on a lower mold die (56) of a transfer molding apparatus (54). Attached inside a cavity (58a) of an upper mold die (58) is a protection sheet (65), which will make contact with the upper face of a cover glass (6) of each sensor package (4). When the upper mold die (58) meshes with the lower mold die (56), the upper face of the cover glass (6) is tightly covered with the protection sheet (65). A plunger (62) is activated to fill the cavities (56a, 58a) with sealing resin (7). The upper face of the cover glass (6) is not stained or damaged when the peripheries of the sensor packages (4) are sealed.
摘要翻译：多个传感器封装（4）固定到电路组件板（47）上并放置在传送模塑设备（54）的下模具（56）上。安装在上模具（58）的空腔（58a）内的是与每个传感器封装（4）的盖玻璃（6）的上表面接触的保护片（65）。当上模具（58）与下模具（56）啮合时，盖玻璃（6）的上表面被保护片（65）紧紧地覆盖。柱塞（62）被启动以用密封树脂（7）填充空腔（56a，58a）。当传感器封装（4）的周边被密封时，盖玻璃（6）的上表面没有染色或损坏。

5. 发明申请

US20090053850A1 METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE 审中-公开
标题翻译：制造固态成像装置的方法
公开(公告)号：US20090053850A1
公开(公告)日：2009-02-26
申请号：US11909720
申请日：2006-03-24
申请人： Kazuhiro Nishida , Hitoshi Shimamura , Kosuke Takasaki
发明人： Kazuhiro Nishida , Hitoshi Shimamura , Kosuke Takasaki
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L24/73 , H01L27/14627 , H01L27/14683 , H01L27/14685 , H01L27/1469 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/8501 , H01L2224/85013 , H01L2224/97 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/181 , H01L2924/00 , H01L2224/85 , H01L2924/00012
摘要： A mask (68) is attached to a circuit assembly board (47) on which a plurality of sensor packages (4) are adhered. An upper face of a cover glass (6) of each sensor package (4) is protected by a mask section (68b) of the mask (68). The circuit assembly board (47) is set in a vacuum screen printing machine and paste of sealing resin (7) is supplied to it. The circuit assembly board (47) is moved in a horizontal direction on a stage with a squeegee (65) pressed onto an upper face of the mask (68). The squeegee (65) presses to fill the sealing resin (7) around each of the sensor packages (4).
摘要翻译：掩模（68）附接到其上粘附有多个传感器封装（4）的电路组件板（47）。每个传感器封装（4）的盖玻璃（6）的上表面由掩模（68）的掩模部分（68b）保护。将电路组装板（47）设置在真空丝网印刷机中，并向其供给密封树脂（7）的浆料。电路组装板（47）在水平方向上移动，其中刮板（65）被压在掩模（68）的上表面上。挤压机（65）按压以填充每个传感器封装（4）周围的密封树脂（7）。

6. 发明申请

US20090046183A1 Solid state imaging device and manufacturing method thereof 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20090046183A1
公开(公告)日：2009-02-19
申请号：US11887116
申请日：2006-03-24
申请人： Kazuhiro Nishida , Hitoshi Shimamura , Kosuke Takasaki
发明人： Kazuhiro Nishida , Hitoshi Shimamura , Kosuke Takasaki
IPC分类号： H04N5/335 , H01L21/02
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/566 , H01L23/3121 , H01L23/544 , H01L24/97 , H01L25/0657 , H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14643 , H01L27/14683 , H01L27/14685 , H01L27/148 , H01L2223/54433 , H01L2223/54486 , H01L2224/32225 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/8501 , H01L2224/85013 , H01L2224/97 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/15183 , H01L2924/15311 , H01L2924/15788 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , H01L2924/00 , H01L2224/85 , H01L2924/00012
摘要： A plurality of sensor packages (4) are fixed to a circuit assembly board (47) and placed on a lower mold die (56) of a transfer molding apparatus (54). Attached inside a cavity (58a) of an upper mold die (58) is a protection sheet (65), which will make contact with the upper face of a cover glass (6) of each sensor package (4). When the upper mold die (58) meshes with the lower mold die (56), the upper face of the cover glass (6) is tightly covered with the protection sheet (65). A plunger (62) is activated to fill the cavities (56a, 58a) with sealing resin (7). The upper face of the cover glass (6) is not stained or damaged when the peripheries of the sensor packages (4) are sealed.
摘要翻译：多个传感器封装（4）固定到电路组件板（47）上并放置在传送模塑设备（54）的下模具（56）上。安装在上模具（58）的空腔（58a）内的是与每个传感器封装（4）的盖玻璃（6）的上表面接触的保护片（65）。当上模具（58）与下模具（56）啮合时，盖玻璃（6）的上表面被保护片（65）紧紧地覆盖。柱塞（62）被启动以用密封树脂（7）填充空腔（56a，58a）。当传感器封装（4）的周边被密封时，盖玻璃（6）的上表面没有染色或损坏。

7. 发明申请

US20060128044A1 Solid state imaging device and producing method thereof 失效
公开(公告)号：US20060128044A1
公开(公告)日：2006-06-15
申请号：US11348308
申请日：2006-02-07
申请人： Kiyofumi Yamamoto , Kazuhiro Nishida
发明人： Kiyofumi Yamamoto , Kazuhiro Nishida
IPC分类号： H01L21/00
CPC分类号： H01L27/14634 , H01L27/14618 , H01L27/14632 , H01L27/14636 , H01L27/14683 , H01L27/14687 , H01L27/1469 , H01L2224/73204
摘要： A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. At positions of the contact terminals, plural through-holes are formed on the bottom side of the semiconductor substrate, and the contact terminals appear on a second surface of the semiconductor substrate. On an interconnection circuit pattern of the assembly substrate are formed stud bumps. When the semiconductor substrate is assembled onto the assembly substrate, the stud bumps enter into the through-holes to contact to the contact terminals. Thus the interconnection circuit pattern is electrically connected to the image sensors.

8. 发明授权

US07345349B2 Solid state imaging device and producing method thereof 失效
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07345349B2
公开(公告)日：2008-03-18
申请号：US11785839
申请日：2007-04-20
申请人： Kiyofumi Yamamoto , Kazuhiro Nishida
发明人： Kiyofumi Yamamoto , Kazuhiro Nishida
IPC分类号： H01L31/0203
CPC分类号： H01L27/14634 , H01L27/14618 , H01L27/14632 , H01L27/14636 , H01L27/14683 , H01L27/14687 , H01L27/1469 , H01L2224/73204
摘要： A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. At positions of the contact terminals, plural through-holes are formed on the bottom side of the semiconductor substrate, and the contact terminals appear on a second surface of the semiconductor substrate. On an interconnection circuit pattern of the assembly substrate are formed stud bumps. When the semiconductor substrate is assembled onto the assembly substrate, the stud bumps enter into the through-holes to contact to the contact terminals. Thus the interconnection circuit pattern is electrically connected to the image sensors.
摘要翻译：将固态成像装置的半导体基板连接到盖玻璃上，然后进行背面研磨以使厚度更小。在半导体基板的第一面形成由图像传感器和多个接触端子构成的多个单元。在接触端子的位置处，在半导体衬底的底侧形成有多个通孔，并且接触端子出现在半导体衬底的第二表面上。在组装衬底的互连电路图案上形成有凸块。当将半导体衬底组装到组件衬底上时，凸块凸起进入通孔以与接触端子接触。因此，互连电路图案电连接到图像传感器。

9. 发明授权

US07259438B2 Solid state imaging device and producing method thereof 失效
公开(公告)号：US07259438B2
公开(公告)日：2007-08-21
申请号：US10992776
申请日：2004-11-22
申请人： Kiyofumi Yamamoto , Kazuhiro Nishida
发明人： Kiyofumi Yamamoto , Kazuhiro Nishida
IPC分类号： H01L31/0203
CPC分类号： H01L27/14634 , H01L27/14618 , H01L27/14632 , H01L27/14636 , H01L27/14683 , H01L27/14687 , H01L27/1469 , H01L2224/73204
摘要： A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. At positions of the contact terminals, plural through-holes are formed on the bottom side of the semiconductor substrate, and the contact terminals appear on a second surface of the semiconductor substrate. On an interconnection circuit pattern of the assembly substrate are formed stud bumps. When the semiconductor substrate is assembled onto the assembly substrate, the stud bumps enter into the through-holes to contact to the contact terminals. Thus the interconnection circuit pattern is electrically connected to the image sensors.

10. 发明申请

US20050110107A1 Solid state imaging device and producing method thereof 失效
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20050110107A1
公开(公告)日：2005-05-26
申请号：US10992776
申请日：2004-11-22
申请人： Kiyofumi Yamamoto , Kazuhiro Nishida
发明人： Kiyofumi Yamamoto , Kazuhiro Nishida
IPC分类号： H01L27/14 , H01L23/00 , H01L23/02 , H01L27/146 , H01L31/0203
CPC分类号： H01L27/14634 , H01L27/14618 , H01L27/14632 , H01L27/14636 , H01L27/14683 , H01L27/14687 , H01L27/1469 , H01L2224/73204
摘要： A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. At positions of the contact terminals, plural through-holes are formed on the bottom side of the semiconductor substrate, and the contact terminals appear on a second surface of the semiconductor substrate. On an interconnection circuit pattern of the assembly substrate are formed stud bumps. When the semiconductor substrate is assembled onto the assembly substrate, the stud bumps enter into the through-holes to contact to the contact terminals. Thus the interconnection circuit pattern is electrically connected to the image sensors.
摘要翻译：将固态成像装置的半导体基板连接到盖玻璃上，然后进行背面研磨以使厚度更小。在半导体基板的第一面形成由图像传感器和多个接触端子构成的多个单元。在接触端子的位置处，在半导体衬底的底侧形成有多个通孔，并且接触端子出现在半导体衬底的第二表面上。在组装衬底的互连电路图案上形成有凸块。当将半导体衬底组装到组件衬底上时，凸块凸起进入通孔以与接触端子接触。因此，互连电路图案电连接到图像传感器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式