专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06770547B1 Method for producing a semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US06770547B1
公开(公告)日：2004-08-03
申请号：US09698186
申请日：2000-10-30
申请人： Kosuke Inoue , Hiroyuki Tenmei , Yoshihide Yamaguchi , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Madoka Minagawa , Naoya Kanda , Ichiro Anjo , Asao Nishimura , Akira Yajima , Kenji Ujiie
发明人： Kosuke Inoue , Hiroyuki Tenmei , Yoshihide Yamaguchi , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Madoka Minagawa , Naoya Kanda , Ichiro Anjo , Asao Nishimura , Akira Yajima , Kenji Ujiie
IPC分类号： H01L2120
CPC分类号： H01L23/3157 , H01L21/563 , H01L23/293 , H01L23/295 , H01L23/3114 , H01L2224/02377 , H01L2224/02381 , H01L2224/0401 , H01L2224/05548 , H01L2224/06102 , H01L2224/1403 , H01L2224/14515 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3025 , H01L2924/00 , H01L2924/01033 , H01L2924/01034
摘要： A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device.
摘要翻译：一种半导体装置，其中可以在没有任何底部填充的情况下进行倒装芯片接合，并且其包括半导体器件，通过掩模印刷含有颗粒的电绝缘材料在半导体器件上形成的电绝缘层，以及形成在电学上的外部连接端子绝缘层并与半导体器件的电极电连接。

2. 发明授权

US07057283B2 Semiconductor device and method for producing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07057283B2
公开(公告)日：2006-06-06
申请号：US10825436
申请日：2004-04-16
申请人： Kosuke Inoue , Hiroyuki Tenmei , Yoshihide Yamaguchi , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Madoka Minagawa , Naoya Kanda , Ichiro Anjo , Asao Nishimura , Akira Yajima , Kenji Ujiie
发明人： Kosuke Inoue , Hiroyuki Tenmei , Yoshihide Yamaguchi , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Madoka Minagawa , Naoya Kanda , Ichiro Anjo , Asao Nishimura , Akira Yajima , Kenji Ujiie
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L23/3157 , H01L21/563 , H01L23/293 , H01L23/295 , H01L23/3114 , H01L2224/02377 , H01L2224/02381 , H01L2224/0401 , H01L2224/05548 , H01L2224/06102 , H01L2224/1403 , H01L2224/14515 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3025 , H01L2924/00 , H01L2924/01033 , H01L2924/01034
摘要： A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device. The electrically insulating layer is formed with a thickness so as to provide α-ray shielding of the semiconductor device.
摘要翻译：一种半导体装置，其中可以在没有任何底部填充的情况下进行倒装芯片接合，并且其包括半导体器件，通过掩模印刷含有颗粒的电绝缘材料在半导体器件上形成的电绝缘层，以及形成在电学上的外部连接端子绝缘层并与半导体器件的电极电连接。电绝缘层形成为具有提供半导体器件的α射线屏蔽的厚度。

3. 发明授权

US06822317B1 Semiconductor apparatus including insulating layer having a protrusive portion 失效
标题翻译：包括具有突出部分的绝缘层的半导体装置
公开(公告)号：US06822317B1
公开(公告)日：2004-11-23
申请号：US09698168
申请日：2000-10-30
申请人： Kosuke Inoue , Hiroyuki Tenmei , Yoshihide Yamaguchi , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Madoka Minagawa , Naoya Kanda , Ichiro Anjo , Asao Nishimura , Akira Yajima , Kenji Ujiie
发明人： Kosuke Inoue , Hiroyuki Tenmei , Yoshihide Yamaguchi , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Madoka Minagawa , Naoya Kanda , Ichiro Anjo , Asao Nishimura , Akira Yajima , Kenji Ujiie
IPC分类号： H01L23495
CPC分类号： H01L23/3114 , H01L21/563 , H01L23/293 , H01L23/295 , H01L23/3157 , H01L2224/05001 , H01L2224/05124 , H01L2224/05147 , H01L2224/05569 , H01L2224/05573 , H01L2224/05644 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/01033 , H01L2924/01034
摘要： A semiconductor apparatus comprising a semiconductor device, an electrically insulating layer formed on the semiconductor device, and an external connection terminal formed on the electrically insulating layer and electrically connected to an electrode of the semiconductor device, wherein a power/ground line and a signal line in a region of from an edge of the electrically insulating layer to a uniform-thickness flat portion of the electrically insulating layer are different in kind of wiring pattern from each other.
摘要翻译：一种半导体器件，包括半导体器件，形成在半导体器件上的电绝缘层和形成在电绝缘层上并与半导体器件的电极电连接的外部连接端子，其中电源/接地线和信号线在从电绝缘层的边缘到电绝缘层的均匀厚度平坦部分的区域中，布线图案的种类不同。

4. 发明授权

US06930388B2 Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure 有权
标题翻译：半导体器件及其制造方法以及半导体器件安装结构
公开(公告)号：US06930388B2
公开(公告)日：2005-08-16
申请号：US09811401
申请日：2001-03-20
申请人： Yoshihide Yamaguchi , Hiroyuki Tenmei , Kosuke Inoue , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Naoya Kanda , Madoka Minagawa , Ichiro Anjo , Asao Nishimura , Kenji Ujiie , Akira Yajima
发明人： Yoshihide Yamaguchi , Hiroyuki Tenmei , Kosuke Inoue , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Naoya Kanda , Madoka Minagawa , Ichiro Anjo , Asao Nishimura , Kenji Ujiie , Akira Yajima
IPC分类号： H01L23/29 , H01L21/56 , H01L21/60 , H01L23/12 , H01L23/31 , H01L23/485 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/12 , H01L23/3114 , H01L23/3171 , H01L24/11 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05171 , H01L2224/05644 , H01L2224/13099 , H01L2224/16 , H01L2224/45144 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/30105 , H01L2924/351 , H01L2924/00 , H01L2924/01034 , H01L2924/00014
摘要： A semiconductor device is provided which enables a flip chip connection without use of underfill. The semiconductor device includes a semiconductor element having circuit electrodes and a circuit surface coated with a protecting film. A stress relaxation layer is provided by coating a cured thermoplastic resin onto the protecting film of the circuit surface in a manner which leaves the circuit electrodes exposed and curing it and having an inclination in the edge portion thereof. A wiring layer with wirings is connected to each of the circuit electrodes and disposed so as to make an electrical connection from the circuit electrodes, via the edge portion of the stress relaxation layer, and to a desired portion on the surface of the stress relaxation layer. A protecting film is provided thereon, and an external connection terminal is also provided.
摘要翻译：提供一种半导体器件，其能够在不使用底部填充物的情况下实现倒装芯片连接。半导体器件包括具有电路电极的半导体元件和涂有保护膜的电路表面。通过将固化的热塑性树脂以使电路电极暴露并固化并且在其边缘部分具有倾斜的方式将固化的热塑性树脂涂覆到电路表面的保护膜上来提供应力松弛层。具有布线的布线层连接到每个电路电极，并布置成经由应力松弛层的边缘部分和电路电极的电连接到应力松弛层的表面上的期望部分。在其上设置有保护膜，并且还设置有外部连接端子。

5. 发明授权

US06624504B1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06624504B1
公开(公告)日：2003-09-23
申请号：US09698185
申请日：2000-10-30
申请人： Kosuke Inoue , Hiroyuki Tenmei , Yoshihide Yamaguchi , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Madoka Minagawa , Naoya Kanda , Ichiro Anjo , Asao Nishimura , Akira Yajima , Kenji Ujiie
发明人： Kosuke Inoue , Hiroyuki Tenmei , Yoshihide Yamaguchi , Noriyuki Oroku , Hiroshi Hozoji , Shigeharu Tsunoda , Madoka Minagawa , Naoya Kanda , Ichiro Anjo , Asao Nishimura , Akira Yajima , Kenji Ujiie
IPC分类号： H01L23495
CPC分类号： H01L23/293 , H01L21/563 , H01L23/295 , H01L23/3114 , H01L23/3157 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05568 , H01L2224/05569 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3025 , H01L2924/00 , H01L2924/01033 , H01L2924/01034
摘要： A semiconductor apparatus includes a semiconductor device having circuit electrodes aligned centrally of the semiconductor apparatus. A first electrically insulating layer is formed on said semiconductor device with said circuit electrodes being exposed from said first insulating layer. A second electrically insulating layer is formed on said first insulating layer, and external connection terminals are formed on said second insulating layer. A wiring is formed on said second insulating layer to electrically connect said external connect terminals to said circuit electrodes of said semiconductor device, and a third electrically insulating layer is formed on said second insulating layer and on said wiring. Particles are provided in the second insulating layer to control a shape of said second insulating layer.
摘要翻译：半导体装置包括具有对准半导体装置中心的电路电极的半导体装置。在所述半导体器件上形成第一电绝缘层，所述电路电极从所述第一绝缘层露出。在所述第一绝缘层上形成第二电绝缘层，在所述第二绝缘层上形成外部连接端子。在所述第二绝缘层上形成布线，以将所述外部连接端子电连接到所述半导体器件的所述电路电极，并且在所述第二绝缘层和所述布线上形成第三电绝缘层。在第二绝缘层中提供颗粒以控制所述第二绝缘层的形状。

6. 发明授权

US07497096B2 Apparatus and method for conveying curved glass sheets 有权
标题翻译：用于输送弯曲玻璃板的设备和方法
公开(公告)号：US07497096B2
公开(公告)日：2009-03-03
申请号：US10792573
申请日：2004-03-04
申请人： Osamu Asai , Yoshiki Katada , Kenji Ujiie
发明人： Osamu Asai , Yoshiki Katada , Kenji Ujiie
IPC分类号： C03B13/16 , C03B13/00 , B65G13/00 , B65G21/10 , B65G41/00 , C03B23/033
CPC分类号： C03B35/189 , C03B35/165 , C03B35/166 , C03B35/187
摘要： An apparatus for conveying a curved glass sheet includes a disk roll conveyor and a roll conveyor set positioned downstream of the disk roll conveyor. The roll conveyor set has a plurality of roll conveyor units. In this apparatus, first and second adjusting devices are operable to provide the curved glass sheet with (a) a first conveyance route in which the disk roll conveyor and the roll conveyor set are in a horizontal position to provide a smooth horizontal conveyance surface or (b) a second conveyance route in which the disk roll conveyor is in a downward position and in which at least one roll conveyor unit at a downstream side of the roll conveyor set is in an upward position to provide a continuous concave conveyance surface.
摘要翻译：用于输送弯曲玻璃板的设备包括盘辊式输送机和位于盘式辊式输送机下游的辊式输送机组。辊式输送机组具有多个辊式输送机单元。在该装置中，第一调节装置和第二调节装置可操作以向弯曲的玻璃板提供（a）第一输送路径，其中盘辊式输送机和辊式输送机组处于水平位置以提供平滑的水平输送表面或（ b）第二输送路径，其中盘辊式输送机处于向下位置，并且其中在辊式输送机组的下游侧的至少一个辊式输送单元处于向上位置以提供连续的凹形输送表面。

7. 发明授权

US08316908B2 Method and device for preliminarily bonding laminated glass using curved roll 有权
标题翻译：使用弯曲辊预先粘合夹层玻璃的方法和装置
公开(公告)号：US08316908B2
公开(公告)日：2012-11-27
申请号：US12997042
申请日：2009-06-16
申请人： Kenji Ujiie , Yoshiki Katada , Koji Tamai , Chikao Nakashima
发明人： Kenji Ujiie , Yoshiki Katada , Koji Tamai , Chikao Nakashima
IPC分类号： B29C65/00
CPC分类号： B60J1/00 , B32B17/10036 , B32B17/10761 , B32B17/10816 , Y10T156/1741
摘要： [Object] When press-bonding superposed curved glass plates together by a plurality of curved rolls, even if curvature of the curved glass changes, a preliminary bonding method and device of a laminated glass can cope with a variety of curvatures of the curved glass plate by an easy adjustment.[Means to solve] The preliminary bonding device of the laminated glass has a pair of arcuately-curved rigid fixed shafts, each of which has an arc shape at a middle portion thereof and a linear shape at both ends thereof, a pair of curved rolls, each of which is formed from a covering roll member of a flexible resin layer that covers whole outermost circumferential surfaces of a plurality of short rigid cylindrical members that are provided at an outer circumference of the fixed shaft and are able to rotate through bearings, a roll driving means which drives and rotates the covering roll member of the curved roll, a curvature direction adjusting means that can adjust an angle of a direction of a curved convex portion of the arcuate fixed shaft, and a roll pressing means which sandwiches and presses the glass plates between the curved rolls. By adjusting rotation of the fixed shafts of the pair of upper and lower curved rolls by means of the curvature direction adjusting means, the preliminary bonding device can bond the glass plates of the laminated glass plate from a flat glass plate to a curved glass plate by sandwiching and pressing the glass plates.
摘要翻译：当通过多个弯曲辊将叠加的弯曲玻璃板压合在一起时，即使弯曲玻璃的曲率发生变化，夹层玻璃的预粘合方法和装置可以应对弯曲玻璃板的各种曲率通过一个容易的调整。 [解决方案]夹层玻璃的预粘合装置具有一对弧形的刚性固定轴，其中间部分具有弧形，两端具有直线形状，一对弯曲辊其每一个由柔性树脂层的覆盖辊构件形成，所述覆盖辊构件覆盖设置在固定轴的外周并且能够通过轴承旋转的多个短刚性圆柱形构件的整个最外周表面，滚动驱动装置，其驱动并旋转弯曲辊的覆盖辊构件;曲率方向调节装置，其可以调节弓形固定轴的弯曲凸部的方向的角度;以及辊压装置，其夹持并按压弯曲辊之间的玻璃板。通过利用曲率方向调节装置来调整上下一对弯曲辊的固定轴的旋转，预粘接装置可以将平板玻璃板的玻璃板从平板玻璃板接合到弯曲的玻璃板上夹住并按压玻璃板。

8. 发明申请

US20120073417A1 Method and Device for Cutting a Sheet Material 审中-公开
标题翻译：切割片材的方法和装置
公开(公告)号：US20120073417A1
公开(公告)日：2012-03-29
申请号：US13376786
申请日：2010-06-02
申请人： Kenji Ujiie , Koji Tamai , Chikao Nakashima
发明人： Kenji Ujiie , Koji Tamai , Chikao Nakashima
IPC分类号： B26D7/32 , B26D7/01 , B26D7/20 , B26D1/45
CPC分类号： B26D7/018 , B26D7/0006 , B26D7/20 , B26F1/3813 , Y10T83/04 , Y10T83/0453 , Y10T83/2066 , Y10T83/75
摘要： [Task] A sheet material is cut in a predetermined closed loop shape.[Means for solving task]A cutting apparatus for a sheet material, comprises: an air table which is capable of ejecting or sucking air through a plurality of minute punching sections thereof; a template having at least one recess groove section in a predetermined closed loop shape mounted and fixed onto the air table and a punching section located at each of positions on the template which is coincident with a position of each of the punching sections of the air table; a cutter blade disposed on an upper position of the sheet material mounted on the template to cut the sheet material along the recess groove section of the template; and cutter blade driving means which is capable of moving and rotating the cutter blade in X, Y, and Z coordinate axes.
摘要翻译： [任务]以预定的闭环形状切割片材。 [解决任务的手段]一种用于片材的切割装置，包括：能够通过其多个微小冲压部排出或吸入空气的空气台; 模板，其具有安装并固定在空气台上的预定闭环形状的至少一个凹槽部分和位于模板上的每个位置处的冲孔部分，其与空气台的每个冲压部分的位置重合 ; 切割刀片，设置在安装在模板上的片材的上部位置，以沿着模板的凹槽部分切割片材; 以及能够使刀片在X，Y，Z坐标轴上移动和旋转的刀片驱动装置。

9. 发明授权

US07371606B2 Manufacturing method of a semiconductor device 失效
标题翻译：半导体器件的制造方法
公开(公告)号：US07371606B2
公开(公告)日：2008-05-13
申请号：US11012156
申请日：2004-12-16
申请人： Kenji Ujiie , Bunji Kuratomi
发明人： Kenji Ujiie , Bunji Kuratomi
IPC分类号： H01L21/66 , H01L21/00 , H01L23/495 , H01L23/28
CPC分类号： H01L23/3121 , H01L21/561 , H01L21/565 , H01L24/97 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05569 , H01L2224/05572 , H01L2224/056 , H01L2224/16 , H01L2224/16225 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2224/81 , H01L2924/00 , H01L2924/00014
摘要： The yield of a sealing process for a semiconductor device which adopts a flip-chip mounting method is to be improved. In a molding process wherein plural semiconductor chip ICs mounted on a parts mounting surface of a substrate matrix through bump electrodes are to be sealed all together with a sealing resin in a reduced state of the internal pressure of a cavity of a molding apparatus, a clamping pressure at the time of clamping the substrate matrix by both a lower die and an upper die of a molding die is set at a relatively low pressure in an initial stage of injection of the sealing resin and is changed to a relatively high pressure when the sealing resin has covered the semiconductor chip ICs located in a final stage in the resin injecting direction.
摘要翻译：提高采用倒装芯片安装方法的半导体器件的密封工艺的成品率。在通过突起电极安装在基板矩阵的零件安装表面上的多个半导体芯片IC将与密封树脂一起密封在模制装置的空腔的内部压力的状态下的模制过程中，夹紧在密封树脂的注入的初始阶段中，通过模具的下模和上模将夹持基板矩阵的压力设定在相对低的压力，并且当密封树脂已经覆盖了位于树脂注入方向的最后阶段的半导体芯片IC。

10. 发明申请

US20110100530A1 Method and Device for Preliminarily Bonding Laminated Glass Using Curved Roll 有权
标题翻译：使用弯曲辊预先粘合层压玻璃的方法和装置
公开(公告)号：US20110100530A1
公开(公告)日：2011-05-05
申请号：US12997042
申请日：2009-06-16
申请人： Kenji Ujiie , Yoshiki Katada , Koji Tamai , Chikao Nakashima
发明人： Kenji Ujiie , Yoshiki Katada , Koji Tamai , Chikao Nakashima
IPC分类号： B32B17/00 , B32B37/10
CPC分类号： B60J1/00 , B32B17/10036 , B32B17/10761 , B32B17/10816 , Y10T156/1741
摘要： [Object] When press-bonding superposed curved glass plates together by a plurality of curved rolls, even if curvature of the curved glass changes, a preliminary bonding method and device of a laminated glass can cope with a variety of curvatures of the curved glass plate by an easy adjustment.[Means to Solve] The preliminary bonding device of the laminated glass has a pair of arcuately-curved rigid fixed shafts, each of which has an arc shape at a middle portion thereof and a linear shape at both ends thereof, a pair of curved rolls, each of which is formed from a covering roll member of a flexible resin layer that covers whole outermost circumferential surfaces of a plurality of short rigid cylindrical members that are provided at an outer circumference of the fixed shaft and are able to rotate through bearings, a roll driving means which drives and rotates the covering roll member of the curved roll, a curvature direction adjusting means that can adjust an angle of a direction of a curved convex portion of the arcuate fixed shaft, and a roll pressing means which sandwiches and presses the glass plates between the curved rolls. By adjusting rotation of the fixed shafts of the pair of upper and lower curved rolls by means of the curvature direction adjusting means, the preliminary bonding device can bond the glass plates of the laminated glass plate from a flat glass plate to a curved glass plate by sandwiching and pressing the glass plates.
摘要翻译：当通过多个弯曲辊将叠加的弯曲玻璃板压合在一起时，即使弯曲玻璃的曲率发生变化，夹层玻璃的预粘合方法和装置可以应对弯曲玻璃板的各种曲率通过一个容易的调整。 [解决手段]夹层玻璃的预粘合装置具有一对弧形的刚性固定轴，其中间部分具有圆弧状，其两端呈直线状，一对弯曲辊其每一个由柔性树脂层的覆盖辊构件形成，所述覆盖辊构件覆盖设置在固定轴的外周并且能够通过轴承旋转的多个短刚性圆柱形构件的整个最外周表面，滚动驱动装置，其驱动并旋转弯曲辊的覆盖辊构件;曲率方向调节装置，其可以调节弓形固定轴的弯曲凸部的方向的角度;以及辊压装置，其夹持并按压弯曲辊之间的玻璃板。通过利用曲率方向调节装置来调整上下一对弯曲辊的固定轴的旋转，预粘接装置可以将平板玻璃板的玻璃板从平板玻璃板接合到弯曲的玻璃板上夹住并按压玻璃板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式