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    • 1. 发明专利
    • Substrate cooling circuit for semiconductor manufacturing device and semiconductor manufacturing device provided with cooling circuit
    • 用于半导体制造装置的基板冷却电路和具有冷却电路的半导体制造装置
    • JP2003324095A
    • 2003-11-14
    • JP2002130397
    • 2002-05-02
    • Komatsu Ltd株式会社小松製作所
    • MASUTANI YOSHINOBUTSUJIMURA SHINJI
    • C23C14/50C23C16/50H01L21/265H01L21/3065H01L21/68H01L21/683
    • PROBLEM TO BE SOLVED: To provide cooling circuits for a semiconductor manufacturing device in which the influence of a magnetic field generated from a flow of a cooling medium is reduced. SOLUTION: A cooling device cools the semiconductor manufacturing device (10) for processing a wafer (W) under plasma gas atmosphere or electric field atmosphere by a cooling medium such as water. Each of cooling circuits (20, 30, and 40) is constituted of a 1st channel (27) for flowing the cooling medium in an optional direction and a 2nd channel (28) having approximately the same length to flow the cooling medium in the reverse direction against the flowing direction of the 1st passage (27), the 1st and 2nd channels (27, 28) are adjacently arranged and a magnetic field generated by the cooling medium flowing in the 1st channel (27) and the 2nd channel (28) is cancelled at the outside of the cooling circuit to reduce the influence of the magnetic field. Consequently various kinds of processing for manufacturing semiconductors can be suitably and stably performed. COPYRIGHT: (C)2004,JPO
    • 要解决的问题:提供一种半导体制造装置的冷却回路,其中由冷却介质的流动产生的磁场的影响减小。 解决方案:冷却装置冷却半导体制造装置(10),用于通过诸如水的冷却介质在等离子体气体气氛或电场气氛下处理晶片(W)。 每个冷却回路(20,30,40)由用于沿可选方向流动冷却介质的第一通道(27)和具有大致相同长度的第二通道(28)构成,以使冷却介质反向流动 相对于第一通道(27)的流动方向的方向相邻,第一和第二通道(27,28)相邻布置,并且由第一通道(27)和第二通道(28)中流动的冷却介质产生的磁场, 在冷却回路的外部被取消,以减小磁场的影响。 因此,可以适当且稳定地进行各种制造半导体的处理。 版权所有(C)2004,JPO
    • 4. 发明专利
    • Reducing agent aqueous solution mixing device and exhaust gas post-treatment device
    • 还原剂水溶液混合装置和排气后处理装置
    • JP2013133773A
    • 2013-07-08
    • JP2011285449
    • 2011-12-27
    • Komatsu Ltd株式会社小松製作所
    • IIJIMA TADASHIKIZAWA HIROSHIITO BOKUTSUJIMURA SHINJIKATO TAKASHIORITA TETSUONAMIMATSU HIROTOHARA KAZUOTOMIOKA HIROYUKI
    • F01N3/24B01D53/94F01N3/08F01N3/28
    • F01N3/2066B01D53/90B01D53/9409B01D2251/2067F01N3/2892F01N2240/20F01N2470/02F01N2610/02F01N2610/1453Y02T10/24
    • PROBLEM TO BE SOLVED: To provide a urea aqueous solution mixing device in which flow path resistance in an exhaust pipe is reduced by restraining a urea aqueous solution from adhering to an inner wall of the exhaust pipe.SOLUTION: The urea aqueous solution mixing device includes the exhaust pipe 4B, an injector 5, a mixing pipe 6, an inner pipe 7, and a circulation portion 20. The exhaust pipe 4B comprises an elbow portion 10 having a curved portion, and a straight portion 11. The injector 5, which is provided in the elbow portion 10, emits a jet of urea aqueous solution. The mixing pipe 6 comprises an outlet portion which is arranged in such a manner as to cover the periphery of the urea aqueous solution jetted from the injector 5 and which is formed with a space between itself and the inner wall of the exhaust pipe 4B, and a plurality of openings 6a which are formed on an outer peripheral surface. The inner pipe 7, which is arranged in the straight portion 11 of the exhaust pipe 4B, enables exhaust gas to be circulated through its inside and outer peripheral portion. The circulation portion 20, which is formed between the outlet portion of the mixing pipe 6 and the inner wall of the exhaust pipe 4B, guides the exhaust gas to the inner pipe 7.
    • 要解决的问题:提供一种尿素水溶液混合装置,其中通过抑制尿素水溶液粘附到排气管的内壁来降低排气管中的流路阻力。溶液:尿素水溶液混合装置包括 排气管4B,喷射器5,混合管6,内管7和循环部20.排气管4B包括具有弯曲部分的弯头部分10和直线部分11.喷射器5 设置在肘部10中,发射尿素水溶液的射流。 混合管6包括出口部分,其布置成覆盖从喷射器5喷射的尿素水溶液的周边,并且在其自身与排气管4B的内壁之间形成有空间,以及 形成在外周面上的多个开口部6a。 布置在排气管4B的直线部分11中的内管7能够使废气通过其内周和外周部分循环。 形成在混合管6的出口部与排气管4B的内壁之间的循环部20将废气引导到内管7。