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    • 10. 发明申请
    • THERMAL STORAGE MEDIUM COMPOSITION AND THERMAL STORAGE MEDIUM
    • 热存储介质组合物和热存储介质
    • US20120261607A1
    • 2012-10-18
    • US13518448
    • 2010-12-24
    • Masashi ShimakageTakuya SanoToshiyuki HayakawaSusumu KomiyamaJunji Koujina
    • Masashi ShimakageTakuya SanoToshiyuki HayakawaSusumu KomiyamaJunji Koujina
    • C09K5/02
    • C09K5/063C08K5/005C08K5/01C08L53/025F28D20/02C08L53/00
    • [Object] The invention provides a thermal storage medium composition capable of forming a thermal storage medium which is free from phase separation or liquid phase bleeding and is excellent in shape retention properties even at or above the maximum crystal transition temperature of a paraffin compound and further exhibits excellent fluidity when being shaped.[Solution] A thermal storage medium composition includes 100 parts by mass of a hydrogenated diene copolymer and 50 to 4000 parts by mass of a paraffin compound, the hydrogenated diene copolymer being a conjugated diene copolymer that is obtained by hydrogenating a block copolymer which includes a block (A) that contains structural units (a-1) derived from a conjugated diene compound and has a vinyl bond content of not more than 20 mol %, and a block (B) that contains structural units (b-1) derived from a conjugated diene compound and has a vinyl bond content of 30 to 95 mol %, the hydrogenation ratio with respect to the double bonds derived from the conjugated diene compounds being not less than 90%.
    • 本发明提供能够形成不含相分离或液相渗出的热存储介质的热存储介质组合物,即使在石蜡化合物的最大晶体转变温度以上也具有优异的形状保持性,并且进一步 成型时表现出优异的流动性。 [解决方案]热存储介质组合物包含100质量份氢化二烯共聚物和50〜4000质量份石蜡复合物,氢化二烯共聚物是通过氢化嵌段共聚物而获得的共轭二烯共聚物,所述嵌段共聚物包括 含有来自共轭二烯化合物的结构单元(a-1),乙烯基键含量为20摩尔%以下的嵌段(A)和含有不超过20摩尔%的结构单元(b-1)的嵌段(B) 共轭二烯化合物的乙烯基键含量为30〜95摩尔%,相对于来自共轭二烯化合物的双键的氢化率为90%以上。