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1. 发明授权

US07642611B2 Sensor device, sensor system and methods for manufacturing them 失效
标题翻译：传感器装置，传感器系统及其制造方法
公开(公告)号：US07642611B2
公开(公告)日：2010-01-05
申请号：US10598847
申请日：2005-03-29
申请人： Koji Tsuji , Yoshiharu Sanagawa , Masao Kirihara , Kazuo Gouda , Youichi Nishijima
发明人： Koji Tsuji , Yoshiharu Sanagawa , Masao Kirihara , Kazuo Gouda , Youichi Nishijima
IPC分类号： H01L27/14 , H01L29/82 , H01L29/84
CPC分类号： B81C1/0023 , B81B7/0048 , B81B7/007 , B81B2207/012 , B81B2207/096 , B81B2207/097 , G01P1/023 , G01P15/0802 , H01L2224/16225 , Y10T29/49002
摘要： A sensor system includes a sensor device (10) and an integrated circuit (20) for driving the device (10). The device (10) includes a sensor body (1) of a silicon-based material, an upper sealing member (2) of a silicon-based material, and a lower sealing member (3) of a silicon-based material. The upper sealing member (2) and the lower sealing member (3) are joined together to cooperatively house the body (1) therewithin in an airtight manner. The device (10) and the circuit (20) are formed as a stacked body. The body (1) is electrically connected to a wiring pattern (12) of the circuit (20) through a conductive through-path (4) penetrating the upper sealing member (4) and a mounting electrode (5) provided on an outer surface of the upper sealing member (2). The device (10) is connected to an MID substrate (30) through the circuit (20).
摘要翻译：传感器系统包括传感器装置（10）和用于驱动装置（10）的集成电路（20）。设备（10）包括硅基材料的传感器体（1），硅基材料的上密封构件（2）和硅基材料的下密封构件（3）。上密封构件（2）和下密封构件（3）接合在一起，以密封的方式在其中协同地容纳主体（1）。装置（10）和电路（20）形成为层叠体。主体（1）通过穿过上密封构件（4）的导电通路（4）和设置在外表面上的安装电极（5）与电路（20）的布线图案（12）电连接，的上密封构件（2）。设备（10）通过电路（20）连接到MID基板（30）。

2. 发明申请

US20080156095A1 Sensor Device, Sensor System and Methods for Manufacturing Them 失效
标题翻译：传感器装置，传感器系统及其制造方法
公开(公告)号：US20080156095A1
公开(公告)日：2008-07-03
申请号：US10598847
申请日：2005-03-29
申请人： Koji Tsuji , Yoshiharu Sanagawa , Masao Kirihara , Kazuo Gouda , Youichi Nishijima
发明人： Koji Tsuji , Yoshiharu Sanagawa , Masao Kirihara , Kazuo Gouda , Youichi Nishijima
IPC分类号： G01C19/00
CPC分类号： B81C1/0023 , B81B7/0048 , B81B7/007 , B81B2207/012 , B81B2207/096 , B81B2207/097 , G01P1/023 , G01P15/0802 , H01L2224/16225 , Y10T29/49002
摘要： A sensor system includes a sensor device (10) and an integrated circuit (20) for driving the device (10). The device (10) includes a sensor body (1) of a silicon-based material, an upper sealing member (2) of a silicon-based material and a lower sealing member (3) of a silicon-based material. The upper sealing member (2) and the lower sealing member (3) are joined together to cooperatively house the body (1) therewithin in an airtight manner. The device (10) and the circuit (20) are formed as a stacked body. The body (1) is electrically connected to a wiring pattern (12) of the circuit (20) through a conductive through-path (4) penetrating the upper sealing member (4) and a mounting electrode (5) provided on an outer surface of the upper sealing member (2). The device (10) is connected to an MID substrate (30) through the circuit (20).
摘要翻译：传感器系统包括传感器装置（10）和用于驱动装置（10）的集成电路（20）。设备（10）包括硅基材料的传感器体（1），硅基材料的上密封构件（2）和硅基材料的下密封构件（3）。上密封构件（2）和下密封构件（3）接合在一起，以密封的方式在其中协同地容纳主体（1）。装置（10）和电路（20）形成为层叠体。主体（1）通过穿过上密封构件（4）的导电通路（4）和设置在外表面上的安装电极（5）与电路（20）的布线图案（12）电连接，的上密封构件（2）。设备（10）通过电路（20）连接到MID基板（30）。

3. 发明申请

US20080038921A1 Method of Manufacturing Semiconductor Device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US20080038921A1
公开(公告)日：2008-02-14
申请号：US10598372
申请日：2005-03-15
申请人： Kazuo Gouda , Koji Tsuji , Masao Kirihara , Youichi Nishijima
发明人： Kazuo Gouda , Koji Tsuji , Masao Kirihara , Youichi Nishijima
IPC分类号： H01L21/306
CPC分类号： B81C1/00142 , B81B2201/0242 , B81B2203/0136 , B81B2203/0353
摘要： A method of manufacturing a semiconductor device. In this method, a concave portion is formed in one surface in the thickness direction of a primary base plate comprising a semiconductor substrate with a relatively large thickness dimension. Then, through-holes are formed by a reactive-ion etching process using as a mask an opening formed in an oxide film provided on the other surface in the thickness direction of the primary base plate. The opening has a narrow width in a region corresponding to the concave portion and a wide width in the remaining region. Thus, respective times necessary for the wide-width through-hole to penetrate through the primary base plate and necessary for the narrow-width through-hole to reach a bottom surface of the concave portion can be approximately equalized to complete the common etching process of the wide-width through-hole and the narrow-width through-hole approximately simultaneously.
摘要翻译：一种制造半导体器件的方法。在该方法中，在包括具有相对较大的厚度尺寸的半导体衬底的初级基板的厚度方向的一个表面上形成凹部。然后，通过反应离子蚀刻工艺形成通孔，该方法使用在主基板的厚度方向上设置在另一个表面上的氧化膜中形成的开口作为掩模。开口部在与凹部对应的区域中宽度窄，其余区域宽。因此，宽度通孔贯穿初级基板所需的各个时间和窄通孔所需的到达凹部的底面的时间可以近似相等，以完成普通的蚀刻工艺大孔同时宽通孔和窄通孔。

4. 发明申请

US20080053224A1 Gyro Sensor And Sensor Apparatus Using Same 失效
标题翻译：陀螺传感器和传感器使用相同
公开(公告)号：US20080053224A1
公开(公告)日：2008-03-06
申请号：US10598333
申请日：2005-03-14
申请人： Koji Tsuji , Kazuo Gouda , Masao Kirihara , Youichi Nishijima , Satoshi Hyodo
发明人： Koji Tsuji , Kazuo Gouda , Masao Kirihara , Youichi Nishijima , Satoshi Hyodo
IPC分类号： G01C19/56
CPC分类号： G01C19/5719
摘要： Disclosed is a gyro sensor, comprises a primary base plate (1) and a support base plate (2) which are superimposed on one another. The primary base plate (1) is provided with a driven mass body (11) to be driven in such a manner as to be vibrated in a direction intersecting with a surface of the support base plate (2), and a detection mass body (12) coupled with the driven mass body (11) through a drive spring (13) and adapted to be displaceable in a plane along the support base plate (2). Two detection springs (15) extending in the arranging direction of the driven mass body (11) and the detection mass body (12) are connected, respecti
摘要翻译：公开了一种陀螺传感器，包括彼此重叠的主基板（1）和支撑基板（2）。主基板（1）设置有驱动质量体（11），其被驱动以便在与支撑基板（2）的表面相交的方向上振动，并且检测质量体（ 12），其通过驱动弹簧（13）与被驱动质量体（11）联接并且适于沿着支撑基板（2）在平面中移位。在从动质量体（11）和检测质量体（12）的排列方向上延伸的两个检测弹簧（15）

5. 发明授权

US07484410B2 Gyro sensor and sensor apparatus using same 失效
标题翻译：陀螺传感器和传感器装置使用相同
公开(公告)号：US07484410B2
公开(公告)日：2009-02-03
申请号：US10598333
申请日：2005-03-14
申请人： Koji Tsuji , Kazuo Gouda , Masao Kirihara , Youichi Nishijima , Satoshi Hyodo
发明人： Koji Tsuji , Kazuo Gouda , Masao Kirihara , Youichi Nishijima , Satoshi Hyodo
IPC分类号： G01C19/56 , G01P9/04
CPC分类号： G01C19/5719
摘要： Disclosed is a gyro sensor, which comprises a primary base plate (1) and a support base plate (2) which are superimposed on one another. The primary base plate (1) is provided with a driven mass body (11) to be driven in such a manner as to be vibrated in a direction intersecting with a surface of the support base plate (2), and a detection mass body (12) coupled with the driven mass body (11) through a drive spring (13) and adapted to be displaceable in a plane along the support base plate (2). Two detection springs (15) extending in the arranging direction of the driven mass body (11) and the detection mass body (12) are connected, respectively, to opposite side of the detection mass body (12), and the other ends of the detection springs (15) are connected together through a coupling segment (16). A fixing segment (17) provided at a longitudinally intermediate portion of the coupling segment (16) is fixed to the support base plate (2). A member formed by integrating the driven mass body (11) and the detection mass body (12) through the drive spring (13) is supported relative to the support base plate (2) by the detection springs (15) in a cantilever manner.
摘要翻译：公开了一种陀螺传感器，其包括彼此重叠的主基板（1）和支撑基板（2）。主基板（1）设置有驱动质量体（11），其被驱动以便在与支撑基板（2）的表面相交的方向上振动，并且检测质量体（ 12），其通过驱动弹簧（13）与被驱动质量体（11）联接并且适于沿着支撑基板（2）在平面中移位。沿被驱动质量体（11）和检测质量体（12）的排列方向延伸的两个检测弹簧（15）分别连接到检测质量体（12）的相对侧，另一端检测弹簧（15）通过联接段（16）连接在一起。设置在联接段（16）的纵向中间部分的固定段（17）固定到支撑基板（2）上。通过驱动弹簧（13）将被驱动质量体（11）和检测质量体（12）集成形成的部件通过检测弹簧（15）以悬臂方式相对于支撑基板（2）支撑。

6. 发明授权

US07592263B2 Method of manufacturing semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07592263B2
公开(公告)日：2009-09-22
申请号：US10598372
申请日：2005-03-15
申请人： Kazuo Gouda , Koji Tsuji , Masao Kirihara , Youichi Nishijima
发明人： Kazuo Gouda , Koji Tsuji , Masao Kirihara , Youichi Nishijima
IPC分类号： H01L21/302
CPC分类号： B81C1/00142 , B81B2201/0242 , B81B2203/0136 , B81B2203/0353
摘要： A method of manufacturing a semiconductor device. In this method, a concave portion is formed in one surface in the thickness direction of a primary base plate comprising a semiconductor substrate with a relatively large thickness dimension. Then, through-holes are formed by a reactive-ion etching process using as a mask an opening formed in an oxide film provided on the other surface in the thickness direction of the primary base plate. The opening has a narrow width in a region corresponding to the concave portion and a wide width in the remaining region. Thus, respective times necessary for the wide-width through-hole to penetrate through the primary base plate and necessary for the narrow-width through-hole to reach a bottom surface of the concave portion can be approximately equalized to complete the common etching process of the wide-width through-hole and the narrow-width through-hole approximately simultaneously.
摘要翻译：一种制造半导体器件的方法。在该方法中，在包括具有相对较大的厚度尺寸的半导体衬底的初级基板的厚度方向的一个表面上形成凹部。然后，通过反应离子蚀刻工艺形成通孔，该方法使用在主基板的厚度方向上设置在另一个表面上的氧化膜中形成的开口作为掩模。开口部在与凹部对应的区域中宽度窄，其余区域宽。因此，宽度通孔贯穿初级基板所需的各个时间和窄通孔所需的到达凹部的底面的时间可以近似相等，以完成普通的蚀刻工艺大孔同时宽通孔和窄通孔。

7. 发明授权

US08097850B2 Infrared sensor 有权
标题翻译：红外传感器
公开(公告)号：US08097850B2
公开(公告)日：2012-01-17
申请号：US12302024
申请日：2007-05-23
申请人： Yuichi Uchida , Hiroshi Yamanaka , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Youichi Nishijima
发明人： Yuichi Uchida , Hiroshi Yamanaka , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Youichi Nishijima
IPC分类号： G01J5/20
CPC分类号： G01J5/10 , H01L27/14618 , H01L27/14625 , H01L27/14665 , H01L2924/0002 , H01L2924/00
摘要： To improve thermal insulation, a thermal infrared sensing element is carried on a sensor mount of a porous material and is spaced upwardly from a substrate by means of anchor studs projecting on the substrate. The sensor mount is formed with a pair of coplanar beams carry thereon leads extending from the sensing element. The leads and the beams are secured to the upper ends of the anchor studs to hold the sensing element at a predetermined height above the substrate. The beams and the leads are combined with each other by intermolecular adhesion such that the sensing element as well as the sensor mount can be altogether supported to the anchor studs.
摘要翻译：为了改善绝热性，热红外传感元件被承载在多孔材料的传感器座上，并且通过突出在基底上的锚固螺柱与衬底间隔开。传感器支架形成有一对共面梁，其上承载有从感测元件延伸的引线。引线和梁被固定到锚栓的上端以将感测元件保持在基板上方的预定高度处。梁和引线通过分子间粘附而彼此组合，使得感测元件以及传感器座可以一起被支撑到锚栓上。

8. 发明申请

US20100230595A1 INFRARED SENSOR 有权
标题翻译：红外传感器
公开(公告)号：US20100230595A1
公开(公告)日：2010-09-16
申请号：US12302024
申请日：2007-05-23
申请人： Yuichi Uchida , Hiroshi Yamanaka , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Youichi Nishijima
发明人： Yuichi Uchida , Hiroshi Yamanaka , Koji Tsuji , Masao Kirihara , Takaaki Yoshihara , Youichi Nishijima
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/0224 , H01L31/09
CPC分类号： G01J5/10 , H01L27/14618 , H01L27/14625 , H01L27/14665 , H01L2924/0002 , H01L2924/00
摘要： To improve thermal insulation, a thermal infrared sensing element is carried on a sensor mount of a porous material and is spaced upwardly from a substrate by means of anchor studs projecting on the substrate. The sensor mount is formed with a pair of coplanar beams carry thereon leads extending from the sensing element. The leads and the beams are secured to the upper ends of the anchor studs to hold the sensing element at a predetermined height above the substrate. The beams and the leads are combined with each other by intermolecular adhesion such that the sensing element as well as the sensor mount can be altogether supported to the anchor studs.
摘要翻译：为了改善绝热性，热红外传感元件被承载在多孔材料的传感器座上，并且通过突出在基底上的锚固螺柱与衬底间隔开。传感器支架形成有一对共面梁，其上承载有从感测元件延伸的引线。引线和梁被固定到锚栓的上端以将感测元件保持在基板上方的预定高度处。梁和引线通过分子间粘附而彼此组合，使得感测元件以及传感器座可以一起被支撑到锚栓上。

9. 发明申请

US20120235044A1 INFRARED SENSOR MODULE 有权
标题翻译：红外传感器模块
公开(公告)号：US20120235044A1
公开(公告)日：2012-09-20
申请号：US13513426
申请日：2010-12-17
申请人： Mitsuhiko Ueda , Takami Okubayashi , Takanori Sugiyama , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Masao Kirihara
发明人： Mitsuhiko Ueda , Takami Okubayashi , Takanori Sugiyama , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Masao Kirihara
IPC分类号： G01J5/04 , G01J5/02
CPC分类号： G01J5/16 , G01J5/02 , G01J5/0205 , G01J5/0215 , G01J5/04 , G01J5/046 , G01J5/08 , G01J5/0806 , G01J5/0875 , H01L2224/48137 , H01L2924/3025 , H01L2924/00
摘要： An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.
摘要翻译：红外线传感器模块包括：红外线传感器装置，设置在基板上并被配置为接收红外信号; 信号处理电路装置，被配置为处理来自所述红外线传感器装置的输出; 设置在距红外线传感器装置预定距离处的金属壳体，该金属壳体包括设置有用于将红外线传感器装置上的图像与外部红外信号耦合的光学系统的光入射窗，并且容纳红外线传感器装置和信号处理电路装置; 以及设置在所述红外线传感器装置和所述壳体之间的传感器盖和所述信号处理电路装置，所述传感器盖包括被配置为将经由所述光学系统进入的所述红外线信号引导到所述红外线传感器装置的透光部。

10. 发明授权

US08952331B2 Infrared sensor module 有权
标题翻译：红外传感器模块
公开(公告)号：US08952331B2
公开(公告)日：2015-02-10
申请号：US13513426
申请日：2010-12-17
申请人： Mitsuhiko Ueda , Takami Okubayashi , Takanori Sugiyama , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Masao Kirihara
发明人： Mitsuhiko Ueda , Takami Okubayashi , Takanori Sugiyama , Yoshiharu Sanagawa , Takanori Aketa , Yushi Nakamura , Masao Kirihara
IPC分类号： G01J5/20 , G01J5/16 , G01J5/02 , G01J5/04 , G01J5/08
CPC分类号： G01J5/16 , G01J5/02 , G01J5/0205 , G01J5/0215 , G01J5/04 , G01J5/046 , G01J5/08 , G01J5/0806 , G01J5/0875 , H01L2224/48137 , H01L2924/3025 , H01L2924/00
摘要： An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.
摘要翻译：红外线传感器模块包括：红外线传感器装置，设置在基板上并被配置为接收红外信号; 信号处理电路装置，被配置为处理来自所述红外线传感器装置的输出; 设置在距红外线传感器装置预定距离处的金属壳体，该金属壳体包括设置有用于将红外线传感器装置上的图像与外部红外信号耦合的光学系统的光入射窗，并且容纳红外线传感器装置和信号处理电路装置; 以及设置在所述红外线传感器装置和所述壳体之间的传感器盖和所述信号处理电路装置，所述传感器盖包括被配置为将经由所述光学系统进入的所述红外线信号引导到所述红外线传感器装置的透光部。

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