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1. 发明授权

US5205460A Bonding apparatus 失效
标题翻译：接合装置
公开(公告)号：US5205460A
公开(公告)日：1993-04-27
申请号：US885186
申请日：1992-05-19
申请人： Koji Sato , Akio Bando
发明人： Koji Sato , Akio Bando
IPC分类号： H01L21/603 , B23K20/26 , H01L21/00 , H01L21/60
CPC分类号： H01L21/67017 , B23K20/26 , H01L24/78 , H01L2224/78 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01082
摘要： A bonding apparatus for semiconductor devices, etc., including a bonding stage which places chips, etc. thereon, a bonding tool which press-bonds leads to the chips, etc., and a wire brush which is next to the bonding stage so as to clean the bonding tool. The wire brush is attached to the upper surface of a brush-rotating plate which is rotatable about its axis, and the brush-rotating plate is rotary-driven by a motor. A complete cleaning of all the side surfaces as well as the undersurface of the bonding tool is accomplished by bringing the bonding tool into contact with portions of the wire brush which are off the center of the rotating wire brush.
摘要翻译：一种用于半导体器件的接合装置等，其中包括将芯片等放置在其上的接合台，压接在芯片等上的接合工具以及紧邻接合台的线刷，以便清洁粘合工具。电刷将电刷安装在可绕其轴线旋转的电刷旋转板的上表面上，电刷旋转板由电动机旋转驱动。焊接工具的所有侧表面以及下表面的完全清洁是通过使焊接工具与线刷的离开旋转钢丝刷中心的部分接触来实现的。

2. 发明授权

US4887758A Apparatus for connecting external leads 失效
标题翻译：用于连接外部引线的装置
公开(公告)号：US4887758A
公开(公告)日：1989-12-19
申请号：US302473
申请日：1989-01-26
申请人： Yasunobu Suzuki , Motohiko Kato , Akio Bando , Hisao Ishida , Akihiro Nishimura
发明人： Yasunobu Suzuki , Motohiko Kato , Akio Bando , Hisao Ishida , Akihiro Nishimura
IPC分类号： H01L21/60 , H01L21/00
CPC分类号： H01L21/67138 , H01L24/97 , H01L2224/50
摘要： An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch. The lead frame to which two sides of the solid-state device have been thus bonded is fed, and at a second bonding position, the leads on the other two opposite sides of the solid-state device are bonded to the lead frame by a second bonding tool.
摘要翻译：用于将固态器件的引线连接或接合到引线框架等的装置，其中通过冲头从薄膜载体冲出的固态装置首先由吸附粘合头拾起并保持。然后将升降臂纵向和横向地驱动，使得其上具有固态装置的吸附粘合头移动到第一粘结台上方的位置。然后，升降臂通过垂直驱动机构降低，由吸附粘合头保持的固态装置压靠指定的引线框架。第一接合工具被降低并且同时将固态器件的两个相对侧上的引线键合到引线框架。然后，第一接合工具被升高，并且吸附粘合头被升高并且移回到冲头上方的位置。馈送固态器件的两侧的引线框架，并且在第二接合位置，固态器件的另外两个相对侧上的引线被连接到引线框架上粘接工具。

3. 发明授权

US5953624A Bump forming method 失效
标题翻译：凸块成型方法
公开(公告)号：US5953624A
公开(公告)日：1999-09-14
申请号：US5788
申请日：1998-01-12
申请人： Akio Bando , Motohiko Katoh , Hirofumi Moroe
发明人： Akio Bando , Motohiko Katoh , Hirofumi Moroe
IPC分类号： H01L21/60 , H01L23/485 , H01L21/44
CPC分类号： H01L24/13 , H01L24/11 , H01L24/742 , H01L2224/1134 , H01L2224/13099 , H01L2224/742 , H01L2924/0001 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033
摘要： A method for forming a bump on, for instance, an electrode of a semiconductor device out of a wire comprising the steps of forming a ball at the end of the bonding wire, pressing the ball against the electrode, and separating the ball from the wire by cutting the wire by a pair of cutters that advance toward each other along the diameter of the wire. The cut surface of the ball or the bump can be flattened by the cutters that presses the cut surface.
摘要翻译：一种用于在例如电线的半导体器件的电极上形成凸起的方法，包括以下步骤：在接合线的末端形成球，将球压在电极上，并将球与线分离通过沿着线的直径彼此前进的一对切割器切割线。球或凸块的切割表面可以被按压切割表面的切割器压平。

4. 发明授权

US5156318A Ultrasonic bonding apparatus for bonding a semiconductor device to a tab tape 失效
标题翻译：用于将半导体器件接合到接片带的超声波接合装置
公开(公告)号：US5156318A
公开(公告)日：1992-10-20
申请号：US777075
申请日：1991-10-16
申请人： Yasushi Suzuki , Akio Bando
发明人： Yasushi Suzuki , Akio Bando
IPC分类号： H01L21/607 , B23K20/10 , H01L21/00 , H01L21/60
CPC分类号： H01L21/67144 , B23K20/106 , H01L2924/0002 , Y10S228/904
摘要： In a method for bonding inner leads arranged along a square opening of a tab tape to a semiconductor device, the inner leads of a pair of inner lead rows that face each other are bonded first to the semiconductor device and then a bonding tool is rotated 90 degrees so that inner leads of another pair of inner lead rows are bonded. An ultrasonic bonding apparatus that uses such a method includes a rotary shaft that has the bonding tool at the bottom and is rotated 90 degrees (or any desired angle) via rollers that are mounted eccentrically on the rotary shaft. When the rollers are moved back and forth via a cylinder assembly, the rotary shaft that is eccentric with the rollers is rotated and rotated back 90 degrees, thus making it possible to perform the bonding of inner leads arranged along the square opening of a tab tape by restraining the horn only twice.
摘要翻译：在将贴片带的正方形开口配置的内引线与半导体器件接合的方法中，将一对内引线列的内引线首先与半导体器件接合，接合工具旋转90度使得另一对内引线列的内引线接合。使用这种方法的超声波接合装置包括：旋转轴，其通过在偏心地安装在旋转轴上的辊而在底部具有接合工具并旋转90度（或任何所需角度）。当辊子通过气缸组件来回移动时，与辊子偏心的旋转轴旋转并旋转90度，从而使得可以执行沿着标签带的正方形开口布置的内部引线的接合通过限制喇叭只有两次。

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