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1. 发明申请

US20060046455A1 Method of manufacturing electrical parts 有权
公开(公告)号：US20060046455A1
公开(公告)日：2006-03-02
申请号：US11200191
申请日：2005-08-10
申请人： Koji Nitta , Shinji Inazawa , Yoshihiro Hirata , Kazunori Okada
发明人： Koji Nitta , Shinji Inazawa , Yoshihiro Hirata , Kazunori Okada
IPC分类号： H01L21/44
CPC分类号： C25D5/34 , B81B2201/018 , B81B2207/07 , B81C1/00698 , C25D5/022 , C25D5/10 , H05K3/205 , H05K2203/0315 , H05K2203/1157
摘要： A method of manufacturing electrical parts is provided, which method comprises the steps of: forming a photoresist on a part of the surface of a substrate; forming a metal layer on the surface of the substrate after the photoresist has been formed; removing a part of the metal layer; removing a metal oxide film formed on the: surface of the metal layer as a result of removing a part of the metal layer; and removing the photoresist. With this method the contact resistance on the surfaces of the electrical parts can be decreased.

2. 发明授权

US07507665B2 Method of manufacturing electrical parts 有权
标题翻译：制造电器件的方法
公开(公告)号：US07507665B2
公开(公告)日：2009-03-24
申请号：US11200191
申请日：2005-08-10
申请人： Koji Nitta , Shinji Inazawa , Yoshihiro Hirata , Kazunori Okada
发明人： Koji Nitta , Shinji Inazawa , Yoshihiro Hirata , Kazunori Okada
IPC分类号： H01L21/4763 , H01L21/44
CPC分类号： C25D5/34 , B81B2201/018 , B81B2207/07 , B81C1/00698 , C25D5/022 , C25D5/10 , H05K3/205 , H05K2203/0315 , H05K2203/1157
摘要： A method of manufacturing electrical parts is provided, which method comprises the steps of: forming a photoresist on a part of the surface of a substrate; forming a metal layer on the surface of the substrate after the photoresist has been formed; removing a part of the metal layer; removing a metal oxide film formed on the: surface of the metal layer as a result of removing a part of the metal layer; and removing the photoresist. With this method the contact resistance on the surfaces of the electrical parts can be decreased.
摘要翻译：提供一种制造电气部件的方法，该方法包括以下步骤：在基板表面的一部分上形成光致抗蚀剂; 在形成光致抗蚀剂之后，在基板的表面上形成金属层; 去除所述金属层的一部分; 通过除去金属层的一部分，去除形成在金属层的表面上的金属氧化物膜; 并去除光致抗蚀剂。通过这种方法，可以减少电气部件表面上的接触电阻。

3. 发明申请

US20120176122A1 CONTACT PROBE, LINKED BODY OF CONTACT PROBES, AND MANUFACTURING METHODS THEREOF 审中-公开
标题翻译：联系方式，联系人联系方式及其制造方法
公开(公告)号：US20120176122A1
公开(公告)日：2012-07-12
申请号：US13395860
申请日：2011-01-18
申请人： Yoshihiro Hirata , Kazunori Kawase , Koji Nitta , Shinji Inazawa , Takeshi Tokuda
发明人： Yoshihiro Hirata , Kazunori Kawase , Koji Nitta , Shinji Inazawa , Takeshi Tokuda
IPC分类号： G01R1/06 , H01R43/16
CPC分类号： G01R3/00 , H01R13/2407 , H01R43/16 , H01R2201/20 , Y10T29/49204
摘要： A contact probe, a method of manufacturing a linked body of contact probes, and a method of manufacturing a contact probe, which allow for stable use are provided. Contact probe includes a contact portion to be brought into contact with an object to be measured, a main body portion connected to the contact portion, and a covering portion covering the whole circumference of a cross section of the main body portion in a direction intersecting with an extensional direction, excluding the contact portion. The covering portion is of a material having a lower volume resistivity than a volume resistivity of a material of the main body portion.
摘要翻译：提供接触探针，制造接触探针连接体的方法以及允许稳定使用的接触探针的制造方法。接触探针包括与待测物体接触的接触部分，连接到接触部分的主体部分和覆盖主体部分的横截面的整个周边的覆盖部分，该覆盖部分沿与延伸方向，不包括接触部分。覆盖部分是具有比主体部分的材料的体积电阻率低的体积电阻率的材料。

4. 发明申请

US20090176027A1 METAL STRUCTURE AND FABRICATION METHOD THEREOF 失效
标题翻译：金属结构及其制造方法
公开(公告)号：US20090176027A1
公开(公告)日：2009-07-09
申请号：US12399589
申请日：2009-03-06
申请人： Kazunori OKADA , Yoshihiro Hirata , Shinji Inazawa , Masao Sakuta , Yoshiaki Tani , Teruhisa Sakata
发明人： Kazunori OKADA , Yoshihiro Hirata , Shinji Inazawa , Masao Sakuta , Yoshiaki Tani , Teruhisa Sakata
IPC分类号： B05D3/02
CPC分类号： C22F1/10 , G01R1/06733 , G01R1/0675 , G01R1/06755
摘要： A metal structure according to the present invention is unlikely to become brittle and has excellent hardness and creep resistance, characterized in that annealing has been applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. This metal structure includes at least two kinds of metal material, and annealing can be applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. For example, the present invention is advantageous in the manner of a microstructure for a contact probe. A fabricating method according to the present invention is a method of fabricating a metal structure unlikely to become brittle and having excellent hardness and creep resistance, characterized in that the step of applying annealing at a temperature not more than the temperature at which crystals of the metal material start to become larger is included.
摘要翻译：根据本发明的金属结构不可能变脆，并具有优异的硬度和抗蠕变性，其特征在于，在不高于金属材料的晶体开始变大的温度的温度下进行退火。该金属结构包括至少两种金属材料，并且可以在不高于金属材料的晶体开始变大的温度的温度下进行退火。例如，本发明对于接触探针的微结构的方式是有利的。根据本发明的制造方法是一种制造不易脆性并且具有优异的硬度和抗蠕变性的金属结构的方法，其特征在于，在不高于金属晶体的温度的温度下进行退火的步骤材料开始变大了。

5. 发明申请

US20060144485A1 Metal structure and method for production thereof 审中-公开
标题翻译：金属结构及其制造方法
公开(公告)号：US20060144485A1
公开(公告)日：2006-07-06
申请号：US10546824
申请日：2004-04-12
申请人： Kazunori Okada , Yoshihiro Hirata , Shinji Inazawa , Masao Sakuta , Yoshiaki Tani , Teruhisa Sakata
发明人： Kazunori Okada , Yoshihiro Hirata , Shinji Inazawa , Masao Sakuta , Yoshiaki Tani , Teruhisa Sakata
IPC分类号： C22C19/03 , C22F1/10
CPC分类号： C22F1/10 , G01R1/06733 , G01R1/0675 , G01R1/06755
摘要： A metal structure according to the present invention is unlikely to become brittle and has excellent hardness and creep resistance, characterized in that annealing has been applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. This metal structure includes at least two kinds of metal material, and annealing can be applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. For example, the present invention is advantageous in the manner of a microstructure for a contact probe. A fabricating method according to the present invention is a method of fabricating a metal structure unlikely to become brittle and having excellent hardness and creep resistance, characterized in that the step of applying annealing at at a temperature not more than the temperature at which crystals of the metal material start to become larger is included.
摘要翻译：根据本发明的金属结构不可能变脆，并具有优异的硬度和抗蠕变性，其特征在于，在不高于金属材料的晶体开始变大的温度的温度下进行退火。该金属结构包括至少两种金属材料，并且可以在不高于金属材料的晶体开始变大的温度的温度下进行退火。例如，本发明对于接触探针的微结构的方式是有利的。根据本发明的制造方法是制造不易脆性并且具有优异的硬度和抗蠕变性的金属结构的方法，其特征在于，在不高于所述晶体的温度的温度下进行退火的步骤，金属材料开始变大也包括在内。

6. 发明授权

US08052810B2 Metal structure and fabrication method thereof 失效
标题翻译：金属结构及其制造方法
公开(公告)号：US08052810B2
公开(公告)日：2011-11-08
申请号：US12399589
申请日：2009-03-06
申请人： Kazunori Okada , Yoshihiro Hirata , Shinji Inazawa , Masao Sakuta , Yoshiaki Tani , Teruhisa Sakata
发明人： Kazunori Okada , Yoshihiro Hirata , Shinji Inazawa , Masao Sakuta , Yoshiaki Tani , Teruhisa Sakata
IPC分类号： C23C14/00 , C22F1/10
CPC分类号： C22F1/10 , G01R1/06733 , G01R1/0675 , G01R1/06755
摘要： A metal structure according to the present invention is unlikely to become brittle and has excellent hardness and creep resistance, characterized in that annealing has been applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. This metal structure includes at least two kinds of metal material, and annealing can be applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. For example, the present invention is advantageous in the manner of a microstructure for a contact probe. A fabricating method according to the present invention is a method of fabricating a metal structure unlikely to become brittle and having excellent hardness and creep resistance, characterized in that the step of applying annealing at a temperature not more than the temperature at which crystals of the metal material start to become larger is included.
摘要翻译：根据本发明的金属结构不可能变脆，并具有优异的硬度和抗蠕变性，其特征在于，在不高于金属材料的晶体开始变大的温度的温度下进行退火。该金属结构包括至少两种金属材料，并且可以在不高于金属材料的晶体开始变大的温度的温度下进行退火。例如，本发明对于接触探针的微结构的方式是有利的。根据本发明的制造方法是一种制造不易脆性并且具有优异的硬度和抗蠕变性的金属结构的方法，其特征在于，在不高于金属晶体的温度的温度下进行退火的步骤材料开始变大了。

7. 发明授权

US07432726B2 Probe 失效
标题翻译：探测
公开(公告)号：US07432726B2
公开(公告)日：2008-10-07
申请号：US10553064
申请日：2004-04-13
申请人： Tetsuji Ueno , Yoshihiro Hirata , Kazunori Okada , Kazunori Kawase
发明人： Tetsuji Ueno , Yoshihiro Hirata , Kazunori Okada , Kazunori Kawase
IPC分类号： G01R31/02
CPC分类号： G01R1/06733
摘要： According to an embodiment, a probe coming into contact with an electrode pad of a measurement object comprises a connection terminal part integrally formed and connected to a substrate, a contact part having a tapered configuration, and a supporting part which supports the contact part. The contact part extending from an end of the supporting part has a sectional configuration which shares at least one side face with the supporting part.
摘要翻译：根据实施例，与测量对象的电极焊盘接触的探针包括一体形成并连接到基板的连接端子部分，具有锥形构造的接触部分和支撑接触部分的支撑部件。从支撑部的端部延伸的接触部具有与支撑部分共享至少一个侧面的截面构造。

8. 发明申请

US20070001690A1 Probe 失效
标题翻译：探测
公开(公告)号：US20070001690A1
公开(公告)日：2007-01-04
申请号：US10553064
申请日：2004-04-13
申请人： Tetsuji Ueno , Yoshihiro Hirata , Kazunori Okada , Kazunori Kawase
发明人： Tetsuji Ueno , Yoshihiro Hirata , Kazunori Okada , Kazunori Kawase
IPC分类号： G01R31/02
CPC分类号： G01R1/06733
摘要： It is an object of the present invention to provide a beam splitter providing a high-contrast image and preventing light from scattering, and a laser scanning microscope provided with the above, in which there is provided a high-quality probe coming in contact with an electrode pad of a semiconductor device, in which a foreign substance is not likely to attach, a configuration is not likely changed and a preferable electrical contact can be maintained for a long time. According to the present invention, a probe coming into contact with an electrode pad of a measurement object comprises a connection terminal part integrally formed and connected to a substrate, a contact part having a tapered configuration, and a supporting part which supports the contact part. The contact part extending from an end of the supporting part has a sectional configuration which shares at least one side face with the supporting part.
摘要翻译：本发明的目的是提供一种提供高对比度图像并防止光散射的分束器，以及具有上述的激光扫描显微镜，其中提供了与由于外部物质不易附着的半导体器件的电极焊盘，因此不会发生形态变化，并且能够长时间保持优选的电接触。根据本发明，与测量对象的电极焊盘接触的探针包括一体地形成并连接到基板的连接端子部分，具有锥形构造的接触部分和支撑接触部分的支撑部分。从支撑部的端部延伸的接触部具有与支撑部分共享至少一个侧面的截面构造。

9. 发明授权

US07151385B2 Contact probe, method of manufacturing the contact probe, and device and method for inspection 有权
标题翻译：接触式探头，接触式探针的制造方法，检测装置及方法
公开(公告)号：US07151385B2
公开(公告)日：2006-12-19
申请号：US10470399
申请日：2002-01-22
申请人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
发明人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
IPC分类号： G01R31/02 , H01K3/10
CPC分类号： G01R1/06733 , G01R1/06738 , G01R1/06755 , G01R3/00 , Y10T29/49117 , Y10T29/49204
摘要： A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.
摘要翻译：制造接触探针的方法包括：电铸步骤，使用布置在基板（521）上的抗蚀剂膜（522）作为具有与接触探针对应的形状的图案框架，进行电铸以填充抗蚀剂膜的间隙（522），以形成金属层（526）;顶端成形步骤，用于倾斜和磨削用作接触探针的顶端部分的金属层（526）的该部分，以及取出步骤仅从图案框架中取出金属层（526）。

10. 发明申请

US20060255815A1 Contact probe and method of manufacturing the same and test apparatus and test method 审中-公开
标题翻译：接触式探头及其制造方法及试验装置及试验方法
公开(公告)号：US20060255815A1
公开(公告)日：2006-11-16
申请号：US11472621
申请日：2006-06-21
申请人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
发明人： Yoshihiro Hirata , Tsuyoshi Haga , Toshiyuki Numazawa , Kazuo Nakamae , Kazunori Okada , Jun Yorita
IPC分类号： G01R31/02
CPC分类号： G01R1/06733 , G01R1/06738 , G01R1/06755 , G01R3/00 , Y10T29/49117 , Y10T29/49204
摘要： A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.
摘要翻译：制造接触探针的方法包括：电铸步骤，使用布置在基板（521）上的抗蚀剂膜（522）作为具有与接触探针对应的形状的图案框架，进行电铸以填充抗蚀剂膜的间隙（522），以形成金属层（526）;顶端成形步骤，用于倾斜和磨削用作接触探针的顶端部分的金属层（526）的该部分，以及取出步骤仅从图案框架中取出金属层（526）。

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