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    • 2. 发明授权
    • Light distribution of headlight beam
    • 大灯光束的分布
    • US4679935A
    • 1987-07-14
    • US664828
    • 1984-10-25
    • Yutaka FukudaKoji MinagawaHiroichi NabeshimaKoihiro MunekiYoshikatsu AsanoKazuo AokiYutaka Ishizaka
    • Yutaka FukudaKoji MinagawaHiroichi NabeshimaKoihiro MunekiYoshikatsu AsanoKazuo AokiYutaka Ishizaka
    • G01M11/06G01J1/00
    • G01M11/065G01M11/064
    • A method and apparatus for determining or adjusting a projecting direction of a light beam emitted from an automobile headlight is provided. In a first aspect of the present invention, the peripheral region of a light beam is used in determining its projecting direction. In particular, a region definable in a light pattern of the projected beam having a proportionality relation between log S and I, where S indicates the value of an area having light intensity I or above, is determined and its outer contour or any predetermined point in the contour is used in determining the projecting direction. In a second aspect, apparatus for determining a projecting direction of a light beam emitted from an automobile headlight includes an indicator which automatically indicates a predetermined position of a light pattern of the light beam projected. In a third aspect, there is provided a system for automatically adjusting a projecting direction of a light beam if it deviates from a predetermined direction using a motor engageable with a mounting structure of the headlight.
    • 提供了一种用于确定或调整从汽车前灯照射的光束的投射方向的方法和装置。 在本发明的第一方面中,光束的周边区域用于确定其投射方向。 特别地,确定具有log S和I之间的比例关系的投影光束的光图案区域,其中S表示具有光强度I或更高的区域的值,并且其外轮廓或任何预定点在 轮廓用于确定投影方向。 在第二方面中,用于确定从汽车前灯发射的光束的投影方向的装置包括自动指示投射的光束的光图案的预定位置的指示器。 在第三方面中,提供一种系统,用于如果使用可与前灯的安装结构接合的电动机偏离预定方向,则自动调节光束的投射方向。
    • 8. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110285427A1
    • 2011-11-24
    • US13129980
    • 2010-05-17
    • Masaki KoyamaYutaka Fukuda
    • Masaki KoyamaYutaka Fukuda
    • H03K3/027H01L29/739H01L29/78
    • H01L29/7391H01L24/73H01L29/0834H01L29/7397H01L2224/48472H01L2924/12036H01L2924/13055H01L2924/13091H01L2924/30107H01L2924/00
    • A semiconductor device includes: a semiconductor substrate having a first semiconductor layer and a second semiconductor layer formed on a first surface; a diode having a first electrode and a second electrode; a control pad; a control electrode electrically coupled with the control pad; and an insulation member. The first electrode is formed on a second surface of the first semiconductor layer. The second electrode is formed on the first surface. Current flows between the first electrode and the second electrode. The control pad is arranged on the first surface so that the pad inputs a control signal for controlling an injection amount of a carrier into the first semiconductor layer. The insulation member insulates between the control electrode and the second electrode and between the control electrode and the semiconductor substrate.
    • 半导体器件包括:具有形成在第一表面上的第一半导体层和第二半导体层的半导体衬底; 具有第一电极和第二电极的二极管; 控制板 与所述控制板电耦合的控制电极; 和绝缘构件。 第一电极形成在第一半导体层的第二表面上。 第二电极形成在第一表面上。 电流在第一电极和第二电极之间流动。 控制焊盘设置在第一表面上,使得焊盘输入用于控制载体进入第一半导体层的注入量的控制信号。 绝缘构件在控制电极和第二电极之间以及控制电极和半导体衬底之间绝缘。