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1. 发明授权

US06916410B2 Biosensor 有权
标题翻译：生物传感器
公开(公告)号：US06916410B2
公开(公告)日：2005-07-12
申请号：US10147213
申请日：2002-05-15
申请人： Koji Katsuki , Katsumi Hamamoto , Yuji Yagi , Takao Fukuoka
发明人： Koji Katsuki , Katsumi Hamamoto , Yuji Yagi , Takao Fukuoka
IPC分类号： C12Q1/00 , G01N27/327
CPC分类号： C12Q1/001
摘要： A biosensor is constituted by disposing an electrode system including a working electrode and a counter electrode on a substrate, forming an inorganic particulate-containing layer containing inorganic particulates thereon, and forming a reagent layer containing a reagent thereon. The inorganic particulates make it possible to prevent impurities in a sample from being in contact with the electrode system and being adsorbed therein, so that measurement is performed with high precision. The inorganic particulate-containing layer can be formed by applying a dispersion system of inorganic particulates and drying them, and it is preferable that the inorganic particulates are contained in the form of aggregates.
摘要翻译：生物传感器通过在基板上设置包括工作电极和对电极的电极系统构成，在其上形成含有无机微粒的无机颗粒含有层，并在其上形成含有试剂的试剂层。无机颗粒使得可以防止样品中的杂质与电极系统接触并被吸附，从而以高精度进行测量。无机颗粒层可以通过涂布无机颗粒的分散体并进行干燥而形成，优选以聚集体的形式含有无机微粒。

2. 发明授权

US08446727B2 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US08446727B2
公开(公告)日：2013-05-21
申请号：US12436976
申请日：2009-05-07
申请人： Tadafumi Yoshida , Hiroshi Osada , Yuji Yagi
发明人： Tadafumi Yoshida , Hiroshi Osada , Yuji Yagi
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/341 , H05K2201/09054 , H05K2201/09745 , H01L2924/00
摘要： There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.
摘要翻译：提供了一种电子部件，其包括安装电子元件的绝缘部件和安装有绝缘部件的热扩散部件，其中绝缘部件的热膨胀系数低于绝缘部件的热膨胀系数热扩散构件和绝缘构件以嵌入的方式安装在形成在热扩散构件的表面上的凹部中。

3. 发明申请

US20110291282A1 JUNCTION BODY, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR JUNCTION BODY 失效
标题翻译：连接体，半导体模块和结构体的制造方法
公开(公告)号：US20110291282A1
公开(公告)日：2011-12-01
申请号：US13148150
申请日：2010-02-02
申请人： Yasushi Yamada , Hiroshi Osada , Yuji Yagi , Tadafumi Yoshida
发明人： Yasushi Yamada , Hiroshi Osada , Yuji Yagi , Tadafumi Yoshida
IPC分类号： H01L23/14 , B23K1/20 , H01B5/00
CPC分类号： B23K35/007 , B22F7/006 , B22F7/08 , B23K35/262 , B23K35/28 , B23K35/30 , B32B15/01 , C22C9/02 , C22C13/00 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/83801 , H01L2224/83805 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1517 , H01L2924/15787 , H01L2924/1579 , H01L2924/351 , H01L2924/05432 , H01L2924/00 , H01L2924/01014 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014
摘要： A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 μm or more but 20 μm or less is provided between the joining surfaces and the three-dimensional web structure.
摘要翻译：接合体具有第一构件和第二构件，每个构件具有主要成分为铜的接合表面。在锡基焊料中含有主要成分为铜的三维网状结构的焊料构件设置在第一构件和第二构件之间。平均厚度为2μm以上且20μm以下的铜锡合金设置在接合面和三维网状结构体之间。

4. 发明授权

US06790665B2 Method of quantifying hemoglobin and method of measuring glycation ratio of hemoglobin 有权
标题翻译：血红蛋白定量方法及血红蛋白糖化比例测定方法
公开(公告)号：US06790665B2
公开(公告)日：2004-09-14
申请号：US10380961
申请日：2003-03-20
申请人： Satoshi Yonehara , Yuji Yagi
发明人： Satoshi Yonehara , Yuji Yagi
IPC分类号： G01N3372
CPC分类号： G01N33/721 , G01N21/31 , G01N21/78 , G01N33/723 , Y10S436/904
摘要： A method of determining Hb is provided, by which an amount of Hb can be determined easily and accurately without fear of damage to the environment. Hemoglobin in a sample is denatured with a tetrazolium compound to give denatured hemoglobin, and an amount of an optical change in the sample is measured at an absorption wavelength specific to the denatured hemoglobin. Using the amount of the optical change thus measured, an amount of the hemoglobin in the sample can be determined. The amount of the optical change preferably is measured at a wavelength in a range from 520 to 670 nm. According to this method, an amount of Hb can be determined with high accuracy as shown in FIG. 1.
摘要翻译：提供一种确定Hb的方法，通过该方法可以容易且准确地确定Hb的量，而不用担心对环境的损害。样品中的血红蛋白用四唑化合物变性以变性血红蛋白，并且在变性血红蛋白特异性的吸收波长处测量样品中的光学变化量。使用如此测量的光学变化量，可以确定样品中血红蛋白的量。光学变化的量优选在520〜670nm的波长下测定。根据该方法，可以高精度地确定Hb量，如图3所示。 1。

5. 发明授权

US06263735B1 Acceleration sensor 失效
标题翻译：加速度传感器
公开(公告)号：US06263735B1
公开(公告)日：2001-07-24
申请号：US09284960
申请日：1999-05-05
申请人： Masaya Nakatani , Yuji Yagi
发明人： Masaya Nakatani , Yuji Yagi
IPC分类号： G01P1508
CPC分类号： G01P15/125 , G01P15/0802 , G01P15/0922 , G01P15/123 , G01P2015/0828
摘要： An acceleration sensor made available without using a high-level semiconductor technology or a micro-machining technology. The sensor detects an acceleration with a high precision, yet the manufacturing cost is inexpensive. In the sensor, a silicon substrate (1) is used only for a portion with which a strain is caused by an acceleration, while an auxiliary substrate (4A,4B), a cap (8A,8B) and a mass substance (6A,6B) are formed of glass material. Joining of the silicon substrate (1) to the mass substance (6A,6B) and the auxiliary substrate (4A,4B), and the auxiliary substrate (4A,4B) to the cap (8A,8B) are made by direct bonding.
摘要翻译：在不使用高级半导体技术或微加工技术的情况下提供加速度传感器。该传感器以高精度检测加速度，但制造成本便宜。在传感器中，硅基板（1）仅用于由加速度引起应变的部分，而辅助基板（4A，4B），盖（8A，8B）和质量物质（6A， 6B）由玻璃材料形成。通过直接接合将硅基板（1）与质量物质（6A，6B）和辅助基板（4A，4B）以及辅助基板（4A，4B）接合到盖（8A，8B）。

6. 发明授权

US08471386B2 Junction body, semiconductor module, and manufacturing method for junction body 失效
标题翻译：接合体，半导体模块及接合体的制造方法
公开(公告)号：US08471386B2
公开(公告)日：2013-06-25
申请号：US13148150
申请日：2010-02-02
申请人： Yasushi Yamada , Hiroshi Osada , Yuji Yagi , Tadafumi Yoshida
发明人： Yasushi Yamada , Hiroshi Osada , Yuji Yagi , Tadafumi Yoshida
IPC分类号： H01L23/48
CPC分类号： B23K35/007 , B22F7/006 , B22F7/08 , B23K35/262 , B23K35/28 , B23K35/30 , B32B15/01 , C22C9/02 , C22C13/00 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/83801 , H01L2224/83805 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1517 , H01L2924/15787 , H01L2924/1579 , H01L2924/351 , H01L2924/05432 , H01L2924/00 , H01L2924/01014 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014
摘要： A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 μm or more but 20 μm or less is provided between the joining surfaces and the three-dimensional web structure.
摘要翻译：接合体具有第一构件和第二构件，每个构件具有主要成分为铜的接合表面。在锡基焊料中含有主要成分为铜的三维网状结构的焊料构件设置在第一构件和第二构件之间。平均厚度为2μm以上且20μm以下的铜锡合金设置在接合面和三维网状结构体之间。

7. 发明申请

US20100109016A1 POWER SEMICONDUCTOR MODULE 审中-公开
标题翻译：功率半导体模块
公开(公告)号：US20100109016A1
公开(公告)日：2010-05-06
申请号：US12596382
申请日：2008-04-17
申请人： Yuji Yagi , Yasushi Yamada , Ikuo Nakagawa , Takashi Atsumi , Mikio Shirai , Ikuo Ohnuma , Kiyohito Ishida , Yoshikazu Takaku
发明人： Yuji Yagi , Yasushi Yamada , Ikuo Nakagawa , Takashi Atsumi , Mikio Shirai , Ikuo Ohnuma , Kiyohito Ishida , Yoshikazu Takaku
IPC分类号： H01L23/488 , H01L29/12
CPC分类号： H01L23/3735 , H01L23/473 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/29111 , H01L2224/29113 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83447 , H01L2224/838 , H01L2224/83805 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/1579 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2224/83205
摘要： Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body.
摘要翻译：提供了一种功率半导体模块，其中两个部件通过Bi基焊料材料接合。在其表面上设置有Cu层，以通过Bi基焊料材料粘接在双组分上。两个部件，即待接合的部件，是半导体元件和绝缘部件的组合，或绝缘部件和散热器板的组合。绝缘部由Cu / SiNx / Cu层叠体构成。

8. 发明授权

US06792503B2 Disk storage accessing system and method for changing access path to storage devices 失效
标题翻译：磁盘存储访问系统和更改存储设备访问路径的方法
公开(公告)号：US06792503B2
公开(公告)日：2004-09-14
申请号：US10003095
申请日：2001-12-06
申请人： Yuji Yagi , Motoaki Hirabayashi
发明人： Yuji Yagi , Motoaki Hirabayashi
IPC分类号： G06F1200
CPC分类号： G06F3/0613 , G06F3/0635 , G06F3/0653 , G06F3/067 , G06F2206/1012
摘要： In one embodiment of the invention, a disk storage accessing system for enabling a plurality of computers to share and access a plurality of disk storage comprises a plurality of computers that refer to the disk storage. Each of the computers includes a counting module for counting a frequency of access to each of the disk storage, and a module for receiving an access path change command to change access paths for the computer to access a different disk storage according to the command. The system further comprises an instructing module for collecting and totaling a frequency of accesses to each disk storage, as counted by the counting module of each of the computers, as well as instructing a particular disk storage as a copy source disk storage to copy content in the copy source disk storage into one or more other disk storage as one or more target disk storage when the totaled access frequency is higher than a predetermined value, and for instructing the receiving module of a computer that accesses the copy source disk storage after receiving a report of copy completion, to change access paths so as to access a target disk storage instead of the copy source disk storage.
摘要翻译：在本发明的一个实施例中，用于使多个计算机能够共享和访问多个磁盘存储器的磁盘存储访问系统包括参考磁盘存储器的多个计算机。每个计算机包括用于计数对每个磁盘存储器的访问频率的计数模块，以及用于接收访问路径改变命令的模块，用于根据该命令改变计算机访问不同磁盘存储器的访问路径。该系统还包括一个指令模块，用于收集和总计每个磁盘存储器的访问频率，如由每个计算机的计数模块所计数，以及指示特定的磁盘存储器作为复制源磁盘存储器以复制内容当总共访问频率高于预定值时，将复制源磁盘存储到一个或多个其他磁盘存储器中作为一个或多个目标磁盘存储器，并且用于指示在接收到复制源磁盘存储器之后访问复制源磁盘存储器的计算机的接收模块报告复制完成，更改访问路径，以访问目标磁盘存储，而不是复制源磁盘存储。

9. 发明授权

US08283783B2 Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same 有权
标题翻译：焊料，其制造方法，接合体，其制造方法，功率半导体模块及其制造方法
公开(公告)号：US08283783B2
公开(公告)日：2012-10-09
申请号：US12669346
申请日：2008-11-19
申请人： Yasushi Yamada , Yuji Yagi , Yoshikazu Takaku , Ikuo Ohnuma , Kiyohito Ishida , Takashi Atsumi , Ikuo Nakagawa , Mikio Shirai
发明人： Yasushi Yamada , Yuji Yagi , Yoshikazu Takaku , Ikuo Ohnuma , Kiyohito Ishida , Takashi Atsumi , Ikuo Nakagawa , Mikio Shirai
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： C22C18/04 , B23K35/282 , B23K35/40 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/26175 , H01L2224/27013 , H01L2224/29 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29118 , H01L2224/29298 , H01L2224/32014 , H01L2224/83051 , H01L2224/83101 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/1579 , H01L2924/19042 , H01L2924/351 , Y10T428/12222 , H01L2924/00 , H01L2924/01049 , H01L2924/01028 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要： A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.
摘要翻译：本发明的锌基焊料55通过在其上除去氧化膜501或不存在氧化膜501的锌基材料50的表面上设置涂覆层51来制备，该涂层51包含主要是氧化物比氧化膜501更容易还原的金属。在本发明的接合体和功率半导体模块中，在接合部使用锌基焊料55，在接合后，涂层51 不存在。

10. 发明申请

US20090279276A1 ELECTRONIC COMPONENT 有权
标题翻译：电子元件
公开(公告)号：US20090279276A1
公开(公告)日：2009-11-12
申请号：US12436976
申请日：2009-05-07
申请人： Tadafumi Yoshida , Hiroshi Osada , Yuji Yagi
发明人： Tadafumi Yoshida , Hiroshi Osada , Yuji Yagi
IPC分类号： H05K7/06
CPC分类号： H01L23/367 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/341 , H05K2201/09054 , H05K2201/09745 , H01L2924/00
摘要： There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.
摘要翻译：提供了一种电子部件，其包括安装电子元件的绝缘部件和安装有绝缘部件的热扩散部件，其中绝缘部件的热膨胀系数低于绝缘部件的热膨胀系数热扩散构件和绝缘构件以嵌入的方式安装在形成在热扩散构件的表面上的凹部中。

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