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1. 发明申请

US20060058998A1 Indexing apparatus and indexing method 审中-公开
标题翻译：索引设备和索引方法
公开(公告)号：US20060058998A1
公开(公告)日：2006-03-16
申请号：US11202155
申请日：2005-08-12
申请人： Koichi Yamamoto , Takashi Masuko , Shinichi Tanaka
发明人： Koichi Yamamoto , Takashi Masuko , Shinichi Tanaka
IPC分类号： G10L15/04
CPC分类号： G10L17/00 , G06F16/95
摘要： An indexing apparatus includes an acquiring unit that acquires an acoustic signal; a dividing unit that divides the acoustic signal into a plurality of segments; an acoustic model producing unit that produces an acoustic model for each of the segments; a reliability determining unit that determines reliability of the acoustic model; a similarity vector producing unit that produces a similarity vector having elements that are the similarities between the acoustic model for a predetermined segment and the acoustic signal of each of the other segments, based on the reliability; a clustering unit that clusters similarity vectors produced by the similarity vector producing unit; and an indexing unit that indexes the acoustic signal based on the similarity vectors clustered.
摘要翻译：索引装置包括获取单元，其获取声信号; 分割单元，其将所述声信号分割成多个段; 声学模型生成单元，其为每个段产生声学模型; 确定声学模型的可靠性的可靠性确定单元; 相似度矢量产生单元，其基于可靠性产生具有作为预定段的声学模型与每个其它段的声学信号之间的相似度的元素的相似度向量; 聚类单元，其对相似矢量产生单元产生的相似性向量进行聚类; 以及索引单元，其基于聚类的相似矢量对声音信号进行索引。

2. 发明授权

US07647224B2 Apparatus, method, and computer program product for speech recognition 失效
标题翻译：用于语音识别的装置，方法和计算机程序产品
公开(公告)号：US07647224B2
公开(公告)日：2010-01-12
申请号：US11285013
申请日：2005-11-23
申请人： Masahide Ariu , Shinichi Tanaka , Takashi Masuko
发明人： Masahide Ariu , Shinichi Tanaka , Takashi Masuko
IPC分类号： G10L15/00 , G10L19/14 , G10L15/04
CPC分类号： G10L15/02
摘要： A speech recognition apparatus includes a sound information acquiring unit that acquires sound information, a unit segment dividing unit that divides the sound information into plural unit segments, a segment information acquiring unit that acquires segment information that indicates a feature of each unit segment, a segment relation value calculating unit that calculates a segment relation value that indicates a relative feature of a target segment which is a unit segment to be processed with respect to an adjacent segment which is a unit segment adjacent to the target segment, based on segment information of the target segment and segment information of the adjacent segment among the segment information, a recognition candidate storing unit that stores recognition candidates that are targets of speech recognition, and a recognition result selecting unit that selects a recognition result from the recognition candidates stored in the recognition candidate storing unit utilizing the segment relation value.
摘要翻译：一种语音识别装置，包括获取声音信息的声音信息获取单元，将声音信息分割为多个单位区段的单位分割单元，获取表示每个单位区间的特征的区段信息的分段信息获取单元，关系值计算单元，其基于所述目标段的分段信息，计算表示作为与所述目标段相邻的作为单位段的相邻段的要处理的单位段的目标段的相对特征的段关系值分段信息中的相邻段的目标段和段信息，存储作为语音识别的目标的识别候选的识别候选存储单元和从存储在识别候选中的识别候选中选择识别结果的识别结果选择单元存储单元关系价值。

3. 发明申请

US20060136206A1 Apparatus, method, and computer program product for speech recognition 失效
标题翻译：用于语音识别的装置，方法和计算机程序产品
公开(公告)号：US20060136206A1
公开(公告)日：2006-06-22
申请号：US11285013
申请日：2005-11-23
申请人： Masahide Ariu , Shinichi Tanaka , Takashi Masuko
发明人： Masahide Ariu , Shinichi Tanaka , Takashi Masuko
IPC分类号： G10L15/00
CPC分类号： G10L15/02
摘要： A speech recognition apparatus includes a sound information acquiring unit that acquires sound information, a unit segment dividing unit that divides the sound information into plural unit segments, a segment information acquiring unit that acquires segment information that indicates a feature of each unit segment, a segment relation value calculating unit that calculates a segment relation value that indicates a relative feature of a target segment which is a unit segment to be processed with respect to an adjacent segment which is a unit segment adjacent to the target segment, based on segment information of the target segment and segment information of the adjacent segment among the segment information, a recognition candidate storing unit that stores recognition candidates that are targets of speech recognition, and a recognition result selecting unit that selects a recognition result from the recognition candidates stored in the recognition candidate storing unit utilizing the segment relation value.
摘要翻译：一种语音识别装置，包括获取声音信息的声音信息获取单元，将声音信息分割为多个单位区段的单位分割单元，获取表示每个单位区间的特征的区段信息的分段信息获取单元，关系值计算单元，其基于所述目标段的分段信息，计算表示作为与所述目标段相邻的作为单位段的相邻段的要处理的单位段的目标段的相对特征的段关系值分段信息中的相邻段的目标段和段信息，存储作为语音识别的目标的识别候选的识别候选存储单元和从存储在识别候选中的识别候选中选择识别结果的识别结果选择单元存储单元关系价值。

4. 发明申请

US20120263946A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER 审中-公开
标题翻译：半导体器件，制造半导体器件的方法和具有粘合层的半导体器件
公开(公告)号：US20120263946A1
公开(公告)日：2012-10-18
申请号：US13509362
申请日：2010-11-10
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
IPC分类号： B32B7/12 , C09J7/02 , H01L21/50
CPC分类号： H01L24/27 , C08F220/30 , H01L21/565 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/27002 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83201 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2224/93 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , Y10T428/2809 , Y10T428/31935 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/27 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.
摘要翻译：本发明公开了一种半导体器件的制造方法，包括以下步骤：通过在与半导体晶片的电路表面相对的表面上形成粘合剂组合物形成粘合剂层; 通过光照射使粘合剂层进入B阶段; 将半导体晶片与带到B级的粘合剂层一起切割成多个半导体芯片; 并且通过进行压接而使半导体芯片粘附到支撑构件或另一半导体芯片上，其中夹着粘合剂层。

5. 发明申请

US20110121435A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：光敏性粘合剂组合物，胶粘剂，粘合片，粘合剂图案，具有粘合层的半导体滤波器，半导体器件以及用于制造半导体器件的方法
公开(公告)号：US20110121435A1
公开(公告)日：2011-05-26
申请号：US12863068
申请日：2009-01-09
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
IPC分类号： H01L25/00 , C08J3/28 , B32B3/30 , H01L21/50
CPC分类号： C09J179/08 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08K5/0025 , C08K5/3417 , C08L79/08 , C08L2312/06 , C09J7/20 , C09J163/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2479/08 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24612 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater.
摘要翻译：一种感光性粘合剂组合物，其包含（A）具有羧基和/或羟基的树脂，（B）热固性树脂，（C）辐射聚合性化合物和（D）光引发剂，其中，3％组合物中的整个光引发剂混合物为200℃或更高。

6. 发明申请

US20080176167A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权
标题翻译：感光性粘合剂组合物，使用它们，粘合膜，粘合片，具有粘合层的半导体膜，半导体器件和电子部件
公开(公告)号：US20080176167A1
公开(公告)日：2008-07-24
申请号：US11969358
申请日：2008-01-04
申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： G03F7/004 , G03F7/26
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译：一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

7. 发明授权

US07387914B2 Semiconductor device and process for fabrication thereof 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US07387914B2
公开(公告)日：2008-06-17
申请号：US11379921
申请日：2006-04-24
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L21/48 , H01L21/50
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要翻译：将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

8. 发明申请

US20070098995A1 Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device 审中-公开
标题翻译：粘合膜及其制备方法以及粘合片和半导体器件
公开(公告)号：US20070098995A1
公开(公告)日：2007-05-03
申请号：US10560073
申请日：2004-06-10
申请人： Takashi Masuko , Keisuke Ookubo , Keiichi Hatakeyama , Masami Yusa
发明人： Takashi Masuko , Keisuke Ookubo , Keiichi Hatakeyama , Masami Yusa
IPC分类号： B32B27/00 , C08L63/00 , C08L79/08 , B32B37/00
CPC分类号： H01L21/6835 , C09J7/10 , C09J7/35 , C09J2201/36 , C09J2463/00 , C09J2479/08 , H01L21/67132 , H01L21/6836 , H01L24/27 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2221/6839 , H01L2221/68395 , H01L2224/274 , H01L2224/27436 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8319 , H01L2224/83856 , H01L2224/8388 , H01L2224/83885 , H01L2224/92 , H01L2224/92247 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01067 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/00014
摘要： An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape for an ultra-thin wafer, or a dicing tape to be laminated, can reduce a thermal stress such as warpage of a wafer, can simplify a step of manufacturing a semiconductor device, and is excellent in heat resistance and humidity resistance reliance, an adhesive sheet in which the adhesive film and a dicing tape are laminated, as well as a semiconductor device.
摘要翻译：本发明的目的是提供一种芯片粘附粘合剂膜，其可以在低于超薄晶片的保护带的软化温度或切割胶带的温度下层压在晶片的背面上可以降低晶片的翘曲等热应力，能够简化半导体装置的制造工序，耐热性和耐湿性依赖性优异，粘贴薄膜和切割胶带的粘合片层叠，以及半导体器件。

9. 发明申请

US20050001044A1 Thermostat for two-system cooling device 失效
标题翻译：双系统冷却装置恒温器
公开(公告)号：US20050001044A1
公开(公告)日：2005-01-06
申请号：US10494047
申请日：2003-06-18
申请人： Takashi Masuko , Akira Mori , Toru Yoshihara
发明人： Takashi Masuko , Akira Mori , Toru Yoshihara
IPC分类号： F01P7/16 , F16K31/68 , G05D23/13 , G05D23/02
CPC分类号： F16K11/02 , F01P7/16 , F01P2003/027 , F01P2037/02 , G05D23/134
摘要： A thermostat independently controlling cooling water passages of two circuits, including a first valve body having first and second passages in constant communication. A third passage is selectively connected to those passages. Communication of the third passage is disconnected when the cooling water temperature is below a prescribed temperature, and the valve is opened when the cooling water temperature is equal to or higher than the prescribed temperature. A second valve body, having fourth and fifth passages selectively in communication, closes the valve to disconnect those passages when the cooling water temperature is below the prescribed temperature, and opens the valve by operating the first valve body to link the passages when the cooling water temperature is equal to or higher than the prescribed temperature. A tubular sleeve prevents first and second control chambers, respectively including the first and second valve bodies, from communicating with each other.
摘要翻译：一种独立控制两个电路的冷却水通道的恒温器，包括具有恒定连通的第一和第二通道的第一阀体。选择性地连接到第三通道。当冷却水温度低于规定温度时，第三通道的通信断开，当冷却水温度等于或高于规定温度时，阀门打开。具有选择性连通的第四和第五通道的第二阀体在冷却水温度低于规定温度时关闭阀门以断开这些通道，并且当冷却水通过操作第一阀体连接通道而打开阀门温度等于或高于规定温度。管状套筒防止分别包括第一和第二阀体的第一和第二控制室彼此连通。

10. 发明授权

US5667899A Electrically conductive bonding films 失效
标题翻译：导电接合膜
公开(公告)号：US5667899A
公开(公告)日：1997-09-16
申请号：US482516
申请日：1995-06-07
申请人： Masami Yusa , Shinji Takeda , Takashi Masuko , Yasuo Miyadera , Mitsuo Yamazaki
发明人： Masami Yusa , Shinji Takeda , Takashi Masuko , Yasuo Miyadera , Mitsuo Yamazaki
IPC分类号： C08J5/18 , C08K3/08 , C08L79/08 , H01B1/22 , B32B27/18 , C09J7/00
CPC分类号： C08J5/18 , C08K3/08 , C08L79/08 , H01B1/22 , C08J2379/08 , Y10S428/901 , Y10S525/928 , Y10T428/24917 , Y10T428/25 , Y10T428/256 , Y10T428/31681 , Y10T428/31721
摘要： An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.
摘要翻译：用于将IC或LSI与引线框架接合的导电接合膜。该膜包含（A）通过使四羧酸二酐组分反应得到的聚酰亚胺树脂，其中由下式（I）表示的四羧酸二酐的含量：其中n表示2-20的整数至少70摩尔％，与二胺; 和（B）导电填料。任选地，该膜还可以包含每分子具有至少两个热交联的酰亚胺基的热固性树脂或酰亚胺化合物。

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