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1. 发明授权

US4879100A Corona discharge treatment apparatus 失效
标题翻译：电晕放电处理装置
公开(公告)号：US4879100A
公开(公告)日：1989-11-07
申请号：US122158
申请日：1987-11-17
申请人： Koichi Tsutsui , Shoji Ikeda , Koji Ueki
发明人： Koichi Tsutsui , Shoji Ikeda , Koji Ueki
IPC分类号： C08J7/00 , B29C59/10 , H01T19/00
CPC分类号： B29C59/103 , H01T19/00 , Y10S422/907
摘要： To perform a corona discharge treatment, a high voltage needs to be impressed between a base electrode and a discharge electrode. One of the electrodes is linked to a high frequency and high voltage source, and the other electrode is grounded. When the electrode linked to the source is moved to be accommodated to a surface to be treated of an object, accidents of an electric shock or a short-circuit often result from an unexpected contact of the electrode on an operator or installation, or a troubles often result from spark or coming-part of contacts. In this invention, one of the electrodes is linked to the source and immovably arranged, while the other is grounded and is allowed to make the movement for accommodating the surface to be treated of the object and the discharge electrode to each other. According to the corona discharge treatment apparatus of this invention, such accidents as an electric shock or a short-circuit, etc., are foreclosed, and troubles are reduced.

2. 发明授权

US5444809A Flame retardant resin composition and flame retardant plastic optical fiber cable using the same 失效
标题翻译：阻燃树脂组合物和阻燃塑料光缆使用相同
公开(公告)号：US5444809A
公开(公告)日：1995-08-22
申请号：US300556
申请日：1994-09-06
申请人： Kazunori Aoki , Yasufumi Yamamoto , Koji Ueki
发明人： Kazunori Aoki , Yasufumi Yamamoto , Koji Ueki
IPC分类号： C09K21/12 , G02B6/44
CPC分类号： G02B6/4436 , C09K21/12 , Y10S428/921 , Y10T428/2964
摘要： A flame retardant resin composition comprising a mixture of:a) 10 to 70 parts by weight of an ethylene/(meth)acrylic ester copolymer;b) 30 to 90 parts by weight of a low crystalline ethylene/higher olefin copolymer;c) 0 to 30 parts by weight of an ethylene polymer selected from the group consisting of polyethylene and crystalline ethylene/.alpha.-olefin copolymers;d) 150 to 250 parts by weight, based on 100 parts by weight of the polymer components a), b) and c), of a metal hydroxide flame retardant; ande) 2 to 30 parts by weight of red phosphorus, anda flame retardant plastic optical fiber cable comprising a plastic optical fiber core and the above resin composition covering the plastic optical fiber core.
摘要翻译：一种阻燃树脂组合物，其包含以下混合物：a）10至70重量份的乙烯/（甲基）丙烯酸酯共聚物; b）30至90重量份的低结晶乙烯/较高级烯烃共聚物; c）0至30重量份选自聚乙烯和结晶乙烯/α-烯烃共聚物的乙烯聚合物; d）150至250重量份，基于100重量份的金属氢氧化物阻燃剂的聚合物组分a），b）和c）; 和e）2〜30重量份的红磷，以及包含塑料光纤芯的阻燃塑料光缆和覆盖塑料光纤芯的上述树脂组合物。

3. 发明授权

US5371649A Method and apparatus for corona discharge processing 失效
标题翻译：电晕放电处理方法及装置
公开(公告)号：US5371649A
公开(公告)日：1994-12-06
申请号：US72988
申请日：1993-06-07
申请人： Akinori Iwata , Makoto Moriyama , Kouichi Kuwano , Kensuke Akutsu , Koji Ueki , Ikuo Tochizawa , Hirohiko Koge , Takanori Hara , Yuji Tanaka , Masatoshi Fujii
发明人： Akinori Iwata , Makoto Moriyama , Kouichi Kuwano , Kensuke Akutsu , Koji Ueki , Ikuo Tochizawa , Hirohiko Koge , Takanori Hara , Yuji Tanaka , Masatoshi Fujii
IPC分类号： B29C59/10 , H01T19/04 , B29C35/00
CPC分类号： B29C59/103
摘要： In a method of corona discharge processing of resin formings surface, excellent corona discharge processing is possible, even if there is a distance between the resin formings and the discharge electrode, by generating a high voltage pulse having a pulse width of 1 .mu.s or more, an average electric field strength of 4 to 20 kv/cm denoted by applied voltage (wave height) versus interelectrode distance, and a pulse frequency of 10 pps or more. This processing is performed by the apparatus which comprises arranging a transfer conveyor to transfer the resin formings, a counter-electrode placed in a down side of the transfer conveyor, a dielectric to cover a surface of the counter-electrode, and a number of discharge electrodes which are arranged in a definite distance above the resin formings along the transfer route.
摘要翻译：在树脂制表面的电晕放电处理方法中，即使树脂构成物与放电电极之间存在距离，也可以通过产生脉冲宽度为1μm以上的高电压脉冲进行优良的电晕放电处理，由施加电压（波高）与电极间距离表示的平均电场强度为4〜20kv / cm，脉冲频率为10pps以上。该处理由包括布置传送输送机以传送树脂结构的装置，放置在转印输送机的下侧的对置电极，覆盖对置电极的表面的电介质和多个放电沿着传送路线布置在树脂结构上方一定距离上的电极。

4. 发明授权

US06330728B2 Brush scrubbing apparatus 失效
公开(公告)号：US06330728B2
公开(公告)日：2001-12-18
申请号：US09758214
申请日：2001-01-12
申请人： Koji Ueki , Takashi Osako
发明人： Koji Ueki , Takashi Osako
IPC分类号： B08B104
CPC分类号： H01L21/67046 , B08B1/04
摘要： A brush scrubbing apparatus is made up of a wafer holder which retains a wafer, a brush which removes a particle on the wafer, a driver which rotates at least one of the wafer holder and the wafer, an alignment mechanism which defines a relative position between the brush and the wafer holder, and controller which controls the alignment mechanism responding to a driving power supply voltage in the driver. The brush scrubbing apparatus can precisely get the reference position for deciding the pushing distance without using the eye measurement.

5. 发明授权

US06254690B1 Semiconductor wafer cleaning method using a semiconductor wafer cleaning device that supports a lower surface of the wafer 失效
标题翻译：使用支撑晶片的下表面的半导体晶片清洁装置的半导体晶片清洁方法
公开(公告)号：US06254690B1
公开(公告)日：2001-07-03
申请号：US09276796
申请日：1999-03-26
申请人： Koji Ueki
发明人： Koji Ueki
IPC分类号： B08B100
CPC分类号： H01L21/67028 , B08B1/04 , Y10S134/902
摘要： Disclosed herein is a semiconductor wafer cleaning method using a semiconductor wafer cleaning device. The method includes providing a semiconductor wafer cleaning device with a back brush, bringing the back brush into contact with the entire lower surface of the semiconductor wafer, and cleaning an upper surface of the semiconductor wafer with a surface brush so as to clean the entire surface of the semiconductor wafer in an ever-horizontal state.
摘要翻译：这里公开了使用半导体晶片清洗装置的半导体晶片清洗方法。该方法包括：提供具有后刷的半导体晶片清洗装置，使后刷与半导体晶片的整个下表面接触，并用表面刷清洁半导体晶片的上表面，以便清洁整个表面的半导体晶片处于水平状态。

6. 发明授权

US06219872B1 Brush scrubbing apparatus 失效
标题翻译：刷子洗刷装置
公开(公告)号：US06219872B1
公开(公告)日：2001-04-24
申请号：US09263687
申请日：1999-03-05
申请人： Koji Ueki , Takashi Osako
发明人： Koji Ueki , Takashi Osako
IPC分类号： B08B104
CPC分类号： H01L21/67046 , B08B1/04
摘要： A brush scrubbing apparatus is made up of a wafer holder which retains a wafer, a brush which removes a particle on the wafer, a driver which rotates at least one of the wafer holder and the wafer, an alignment mechanism which defines a relative position between the brush and the wafer holder, and controller which controls the alignment mechanism responding to a driving power supply voltage in the driver. The brush scrubbing apparatus can precisely get the reference position for deciding the pushing distance without using the eye measurement.
摘要翻译：刷子洗涤装置由保持晶片的晶片保持器，去除晶片上的颗粒的刷子，旋转晶片保持器和晶片中的至少一个的驱动器构成的晶片保持器，限定了晶片保持器和晶片之间的相对位置的对准机构刷子和晶片保持器，以及控制器，其响应于驱动器中的驱动电源电压来控制对准机构。刷洗装置可以精确地获得用于决定推送距离的参考位置，而不使用眼睛测量。

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