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1. 发明授权

US07565637B2 Method of designing package for semiconductor device, layout design tool for performing the same, and method of manufacturing semiconductor device using the same 失效
标题翻译：设计用于半导体器件的封装的方法，用于执行该封装的布局设计工具以及使用其的半导体器件的制造方法
公开(公告)号：US07565637B2
公开(公告)日：2009-07-21
申请号：US11592168
申请日：2006-11-03
申请人： Koichi Seko , Shinya Tokunaga
发明人： Koichi Seko , Shinya Tokunaga
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , H01L23/66 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/15311 , H01L2224/05599
摘要： A package design method for a semiconductor device of designing a package including a package substrate provided with a wiring pattern, a chip mounted on the package substrate, and a sealing resin which covers the package substrate and the chip, and the wiring pattern including an external connection terminal and an internal connection terminal connected to the chip, the method comprising: setting an acceptable noise value of the package; designing a package layout on the basis of information on connection between the package substrate and the chip; and performing an optimization on package layout data so that an amount of noises remains within a range which is set beforehand, on the basis of the package layout data obtained in the designing process of the package layout.
摘要翻译：一种用于设计包括具有布线图案的封装基板，安装在封装基板上的芯片和覆盖封装基板和芯片的密封树脂的封装的半导体器件的封装设计方法，以及包括外部连接端子和连接到芯片的内部连接端子，所述方法包括：设置所述封装的可接受的噪声值; 在封装基板与芯片之间的连接信息的基础上设计封装布局; 并且基于在包装布局的设计过程中获得的包装布局数据，对包装布局数据执行优化，使得噪声量保持在预先设定的范围内。

2. 发明授权

US07831949B2 Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit 有权
标题翻译：半导体集成电路设计方法，设计装置，半导体集成电路系统，半导体集成电路安装基板，封装和半导体集成电路
公开(公告)号：US07831949B2
公开(公告)日：2010-11-09
申请号：US11819573
申请日：2007-06-28
申请人： Shinya Tokunaga , Mitsumi Ito , Nobufusa Iwanishi , Koichi Seko , Hiroaki Suzuki , Hiroyuki Tanaka , Yuichi Nishimura , Kazuhiko Fujimoto
发明人： Shinya Tokunaga , Mitsumi Ito , Nobufusa Iwanishi , Koichi Seko , Hiroaki Suzuki , Hiroyuki Tanaka , Yuichi Nishimura , Kazuhiko Fujimoto
IPC分类号： G06F17/50
CPC分类号： G06F17/5068 , H01L23/49838 , H01L23/50 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49112 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01087 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： To provide a method of designing a semiconductor integrated circuit with a high workability also in an increase in a scale of an LSI and an enhancement in an integration and designing a semiconductor integrated circuit system in which an unnecessary radiation is reduced and which is excellent in a heat characteristic, a reverse design flow to that in the conventional art is implemented, and a mounting substrate such as a printed-circuit board is first designed and a package substrate for mounting an LSI is designed based on a result of the design of the mounting substrate, and a layout design of the LSI to be mounted on the package substrate is then carried out.
摘要翻译：为了提供一种设计具有高可加工性的半导体集成电路的方法，同时也增加了LSI的规模，并提高了集成度，并设计了一种半导体集成电路系统，其中不必要的辐射被减少，并且在热特性，实现了与传统技术相反的设计流程，并且首先设计诸如印刷电路板的安装基板，并且基于安装的设计结果设计用于安装LSI的封装基板然后执行基板和要安装在封装基板上的LSI的布局设计。

3. 发明申请

US20080022252A1 Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit 有权
标题翻译：半导体集成电路设计方法，设计装置，半导体集成电路系统，半导体集成电路安装基板，封装和半导体集成电路
公开(公告)号：US20080022252A1
公开(公告)日：2008-01-24
申请号：US11819573
申请日：2007-06-28
申请人： Shinya Tokunaga , Mitsumi Ito , Nobufusa Iwanishi , Koichi Seko , Hiroaki Suzuki , Hiroyuki Tanaka , Yuichi Nishimura , Kazuhiko Fujimoto
发明人： Shinya Tokunaga , Mitsumi Ito , Nobufusa Iwanishi , Koichi Seko , Hiroaki Suzuki , Hiroyuki Tanaka , Yuichi Nishimura , Kazuhiko Fujimoto
IPC分类号： G06F17/50 , H01L23/48
CPC分类号： G06F17/5068 , H01L23/49838 , H01L23/50 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/49112 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01087 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： To provide a method of designing a semiconductor integrated circuit with a high workability also in an increase in a scale of an LSI and an enhancement in an integration and designing a semiconductor integrated circuit system in which an unnecessary radiation is reduced and which is excellent in a heat characteristic, a reverse design flow to that in the conventional art is implemented, and a mounting substrate such as a printed-circuit board is first designed and a package substrate for mounting an LSI is designed based on a result of the design of the mounting substrate, and a layout design of the LSI to be mounted on the package substrate is then carried out.
摘要翻译：为了提供一种设计具有高可加工性的半导体集成电路的方法，同时也增加了LSI的规模，并提高了集成度，并设计了一种半导体集成电路系统，其中不必要的辐射被减少，并且在热特性，实现了与传统技术相反的设计流程，并且首先设计诸如印刷电路板的安装基板，并且基于安装的设计结果设计用于安装LSI的封装基板然后执行基板和要安装在封装基板上的LSI的布局设计。

4. 发明申请

US20110210453A1 METHOD FOR DESIGNING ELECTRONIC SYSTEM 审中-公开
标题翻译：设计电子系统的方法
公开(公告)号：US20110210453A1
公开(公告)日：2011-09-01
申请号：US13107269
申请日：2011-05-13
申请人： Keiichi KUSUMOTO , Shinya Tokunaga , Mitumi Ito , Koichi Seko
发明人： Keiichi KUSUMOTO , Shinya Tokunaga , Mitumi Ito , Koichi Seko
IPC分类号： H01L23/48 , G06F17/50
CPC分类号： G06F17/5068 , H05K3/0005
摘要： When an electronic system is designed, then if an integrated circuit chip (LSI), a package (PKG), and a printed circuit board (PCB) are designed separately and in parallel, it will be found near the end of the design process that a satisfactory electrical characteristic is not achieved. Therefore, a design procedure of each part (e.g., an LSI, a PKG, a PCB, etc.) is decided, and allocation of resources to a part which is designed with a higher priority is decided, and thereafter, the other parts start to be designed. Therefore, a basic interconnect distribution for a circuit board is calculated based on a prediction function for predicting an interconnect distribution for the circuit board using design information of the circuit board as input data, and is output.
摘要翻译：当设计电子系统时，如果集成电路芯片（LSI），封装（PKG）和印刷电路板（PCB）被单独并行设计，则将在设计过程结束时发现不能达到令人满意的电气特性。因此，决定各部分（例如，LSI，PKG，PCB等）的设计程序，并且决定对设计为较高优先级的部分的资源分配，其后的部分开始设计。因此，基于用于使用电路板的设计信息预测电路板的互连分布的预测功能作为输入数据来计算电路板的基本互连分布，并被输出。

5. 发明申请

US20070105271A1 Method of designing package for semiconductor device, layout design tool for performing the same, and method of manufacturing semiconductor device using the same 失效
标题翻译：设计用于半导体器件的封装的方法，用于执行该封装的布局设计工具以及使用其的半导体器件的制造方法
公开(公告)号：US20070105271A1
公开(公告)日：2007-05-10
申请号：US11592168
申请日：2006-11-03
申请人： Koichi Seko , Shinya Tokunaga
发明人： Koichi Seko , Shinya Tokunaga
IPC分类号： H01L21/00
CPC分类号： G06F17/5068 , H01L23/66 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/15311 , H01L2224/05599
摘要： A package design method for a semiconductor device of designing a package including a package substrate provided with a wiring pattern, a chip mounted on the package substrate, and a sealing resin which covers the package substrate and the chip, and the wiring pattern including an external connection terminal and an internal connection terminal connected to the chip, the method comprising: setting an acceptable noise value of the package; designing a package layout on the basis of information on connection between the package substrate and the chip; and performing an optimization on package layout data so that an amount of noises remains within a range which is set beforehand, on the basis of the package layout data obtained in the designing process of the package layout.
摘要翻译：一种用于设计包括具有布线图案的封装基板，安装在封装基板上的芯片和覆盖封装基板和芯片的密封树脂的封装的半导体器件的封装设计方法，以及包括外部连接端子和连接到芯片的内部连接端子，所述方法包括：设置所述封装的可接受的噪声值; 在封装基板与芯片之间的连接信息的基础上设计封装布局; 并且基于在包装布局的设计过程中获得的包装布局数据，对包装布局数据执行优化，使得噪声量保持在预先设定的范围内。

6. 发明授权

US07370882B2 Air bag system having diffuser structure 有权
标题翻译：具有扩散器结构的气囊系统
公开(公告)号：US07370882B2
公开(公告)日：2008-05-13
申请号：US10484496
申请日：2002-07-22
申请人： Shinya Tokunaga , Mitsuyoshi Ohno
发明人： Shinya Tokunaga , Mitsuyoshi Ohno
IPC分类号： B60R21/16
CPC分类号： B60R21/261 , B60R21/213 , B60R21/232 , B60R21/26
摘要： An air bag system is provided in which an air bag stored in a folded state in a vehicle is adapted to be inflated by a gas supplied from an inflator through a diffuser so as to protect an occupant of the vehicle. In the air bag system, the diffuser is disposed on one side of the inflator such that the diffuser and the inflator are substantially aligned with each other, and the diffuser includes a gas feed portion that is exposed to a gas inlet formed in a generally middle portion of the air bag as viewed in a longitudinal direction thereof.
摘要翻译：提供了一种气囊系统，其中以车辆的折叠状态存储的气囊适于由通过扩散器从充气机供给的气体充气，以保护车辆乘员。在气囊系统中，扩散器设置在充气机的一侧，使得扩散器和充气机基本上彼此对准，并且扩散器包括气体供给部分，该气体供给部分暴露于形成在大致中间气囊的长度方向的一部分。

7. 发明申请

US20050156323A1 Semiconductor apparatus 审中-公开
标题翻译：半导体装置
公开(公告)号：US20050156323A1
公开(公告)日：2005-07-21
申请号：US11022967
申请日：2004-12-28
申请人： Shinya Tokunaga
发明人： Shinya Tokunaga
IPC分类号： H01L23/12 , H01L21/60 , H01L21/607 , H01L23/13 , H01L23/58 , H01L25/00 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L23/13 , H01L24/48 , H01L24/49 , H01L24/81 , H01L25/0657 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2225/06582 , H01L2924/00014 , H01L2924/01079 , H01L2924/15153 , H01L2924/15159 , H01L2924/15165 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In case that a size of an upper layer semiconductor chip is larger than a lower layer semiconductor chip, a semiconductor chip is packed without damaging it. In a semiconductor apparatus in which a second semiconductor chip 103 is laminated on a first semiconductor chip 102, and accommodated in one package, at least one side among four sides which configure an outer edge of the second semiconductor chip 103 is configured in such a manner that it is larger than four sides which configure an outer edge of the first semiconductor chip 102, and thereby, a protruding portion which is protruded from the outer edge of the first semiconductor chip 102 is provided, and a convex supporting part 110 is provided on a surface of a circuit substrate 101 on which the first semiconductor chip 102 and the second semiconductor chip 103 are laminated, and the protruding portion is configured in such a manner that it can be supported by the convex supporting part 110.
摘要翻译：在上层半导体芯片的尺寸大于下层半导体芯片的情况下，不会损坏半导体芯片。在第二半导体芯片103层压在第一半导体芯片102上并且容纳在一个封装中的半导体装置中，构成第二半导体芯片103的外边缘的四个边中的至少一个侧面被配置为其大于构成第一半导体芯片102的外边缘的四个边，并且由此设置从第一半导体芯片102的外边缘突出的突出部分，并且凸起支撑部分110设置在其上层叠有第一半导体芯片102和第二半导体芯片103的电路基板101的表面，并且突出部构造成能够由凸形支撑部110支撑。

8. 发明授权

US06768236B2 Spindle motor and disk drive furnished therewith 失效
标题翻译：主轴电机和磁盘驱动器配备
公开(公告)号：US06768236B2
公开(公告)日：2004-07-27
申请号：US10604977
申请日：2003-08-29
申请人： Shinya Tokunaga , Kaoru Uenosono
发明人： Shinya Tokunaga , Kaoru Uenosono
IPC分类号： H02K708
CPC分类号： F16C33/107 , F16C17/026 , F16C17/045 , F16C17/107 , F16C2370/12 , H02K5/1675
摘要： Spindle motor utilizing a dynamic-pressure bearing device having a full-fill structure and capable of discharging air bubbles from the lubricating oil after it is charged into the bearing device, as well as air bubbles appearing in the oil due to cavitation in handling. Thrust and radial bearing sections are configured within bearing clearances in between the rotor, the shaft, and a shaft-encompassing hollow bearing member. A communicating passage enabling the oil to redistribute itself within the bearing clearances is formed in the bearing member. At least one ray-like groove that reaches from the radially inward edge of dynamic-pressure-generating grooves in the thrust bearing section to the rim of the shaft-encompassing hollow is furnished in the bearing member. When the motor rotates the air bubbles are stirred and minced by the ray-like groove, and migrate toward release at the single oil-air interface.
摘要翻译：主轴电动机利用具有全填充结构的动压轴承装置，并且能够在润滑油装载到轴承装置中之后从润滑油中排出气泡，以及由于处理中的空化而出现在油中的气泡。推力轴承和径向轴承部分配置在转子，轴和包含轴的中空轴承部件之间的轴承间隙内。在轴承构件中形成有使油能够在轴承间隙内重新分布的连通通道。至少一个从止推轴承部分的动压产生槽的径向向内的边缘到包围轴的中空部分的轮缘的至少一个射线状槽被设置在轴承部件中。当电动机旋转时，气泡被射线状槽搅拌并切碎，并在单一油 - 空气界面处向释放状态迁移。

9. 发明授权

US07380989B2 Fluid dynamic pressure bearing and recording disk drive device comprising the same 失效
标题翻译：流体动压轴承和包括该流体动压轴承的记录盘驱动装置
公开(公告)号：US07380989B2
公开(公告)日：2008-06-03
申请号：US10908113
申请日：2005-04-28
申请人： Itsuo Murata , Harushige Osawa , Ming Feng , Shinya Tokunaga
发明人： Itsuo Murata , Harushige Osawa , Ming Feng , Shinya Tokunaga
IPC分类号： F16C33/02 , F16C33/06
CPC分类号： G11B19/2018 , F16C17/107 , F16C33/103 , F16C33/107 , F16C2370/12 , H02K7/085
摘要： In a radial minute gap between a substantially columnar shaft and an inner peripheral face of a substantially cylindrical sleeve, oil is retained and a radial dynamic pressure bearing is formed. A plurality of recessed portions are arranged in a circumferential direction on at least one of an outer peripheral face of the shaft and the inner peripheral face of the sleeve and a first hill portion is provided to an axial end portion of each the recessed portion. Thus, it is possible to achieve a dynamic pressure bearing with which sufficient radial shaft support can be obtained in spite of a short axial length.
摘要翻译：在基本上圆柱形的轴和基本圆柱形套筒的内周面之间的径向微小间隙中，保持油并形成径向动压轴承。在轴的外周面和套筒的内周面中的至少一个上沿圆周方向布置有多个凹部，并且在每个凹部的轴向端部设置有第一山丘部。因此，可以获得尽可能短的轴向长度可获得足够的径向轴支撑的动压轴承。

10. 发明授权

US07114144B2 Mask pattern inspecting method, inspection apparatus, inspecting data used therein and inspecting data generating method 有权
标题翻译：掩模图案检查方法，检查装置，检查数据，检查数据生成方法
公开(公告)号：US07114144B2
公开(公告)日：2006-09-26
申请号：US10722346
申请日：2003-11-26
申请人： Shinya Tokunaga , Hiroyuki Tsujikawa , Tadashi Tanimoto
发明人： Shinya Tokunaga , Hiroyuki Tsujikawa , Tadashi Tanimoto
IPC分类号： G06F17/50
CPC分类号： G03F1/84 , G03F7/70616 , G06T7/0004 , G06T2207/30148
摘要： A method of inspecting a photomask for a semiconductor integrated circuit formed based on drawing pattern data, includes the steps of classifying a drawing pattern of the semiconductor integrated circuit into a plurality of ranks in accordance with a predetermined reference and extracting the same, determining inspecting accuracy for each of the ranks, and deciding quality of the photomask depending on whether the determined inspecting accuracy is satisfied.
摘要翻译：一种检查基于绘制图形数据形成的半导体集成电路的光掩模的方法，包括以下步骤：根据预定的参考将半导体集成电路的绘制图案分类成多个等级并提取它们，并提取它们，确定检查精度并且根据所确定的检查精度是否满足来确定光掩模的质量。

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