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1. 发明申请

US20100132992A1 DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE 有权
标题翻译：器件安装板和半导体模块
公开(公告)号：US20100132992A1
公开(公告)日：2010-06-03
申请号：US12626807
申请日：2009-11-27
申请人： Koichi SAITO , Tetsuya YAMAMOTO
发明人： Koichi SAITO , Tetsuya YAMAMOTO
IPC分类号： H05K1/18 , H05K1/11
CPC分类号： H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/02319 , H01L2224/02331 , H01L2224/02351 , H01L2224/02377 , H01L2224/0311 , H01L2224/0312 , H01L2224/03436 , H01L2224/0361 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/05647 , H01L2224/1132 , H01L2224/11849 , H01L2224/131 , H01L2224/94 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00014 , H01L2224/11 , H01L2224/03 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要： In a semiconductor module having the structure in which a bump electrode provided on a wiring layer is connected to a device electrode provided on a semiconductor device, connection reliability between the bump electrode and the device electrode is improved. An insulating resin layer is provided between the semiconductor device and the wiring layer. The bump electrode, formed integrally with the wiring layer and projected from the wiring layer toward the insulating resin layer, is electrically connected to the device electrode provided on the semiconductor device. Part of the height of the wiring layer on the end side in a bump connection area is lower than that of the wiring in a wiring area extending toward the side opposite to the end side.
摘要翻译：在具有设置在布线层上的凸块电极连接到设置在半导体器件上的器件电极的结构的半导体模块中，突起电极和器件电极之间的连接可靠性得到改善。在半导体器件和布线层之间设置绝缘树脂层。与布线层一体形成并从布线层朝向绝缘树脂层突出的突起电极与设置在半导体器件上的器件电极电连接。突起连接区域的端侧的布线层的高度的一部分比在与端侧相反的一侧延伸的布线区域的布线的高度的部分低。

2. 发明申请

US20100247221A1 PRINTER 有权
标题翻译：打印机
公开(公告)号：US20100247221A1
公开(公告)日：2010-09-30
申请号：US12722885
申请日：2010-03-12
申请人： Hiroyuki TSUGARU , Tetsuya YAMAMOTO , Katsutoshi MUKAIJIMA , Gen MATSUSHIMA
发明人： Hiroyuki TSUGARU , Tetsuya YAMAMOTO , Katsutoshi MUKAIJIMA , Gen MATSUSHIMA
IPC分类号： B41J11/66
CPC分类号： B41J15/042 , B26D1/085 , B26D7/00 , B26D7/24 , B26D7/2614 , B41J11/70 , B41J29/02
摘要： A printer includes a fixed blade attached to a cover unit; a movable blade that faces a fixed blade, freely reciprocates relative to the fixed blade when the cover unit is closed and cuts the recording medium together with the fixed blade by overlapping the fixed blade during reciprocation; a movable blade driving motor that causes the movable blade to reciprocate; and a movable blade unit that includes the movable blade, the movable blade driving motor, and an accommodating unit accommodating the movable blade and provided at a printer main body. The printer further includes a mechanism that, when the movable blade protrudes from the accommodating unit and is stopped, widens a space over which the fixed blade and the protruding movable blade face each other before the movable blade driving motor accommodates the protruding movable blade in the accommodating unit, as initiated by operation of a cover opening lever.
摘要翻译：打印机包括附接到盖单元的固定刀片; 当盖单元关闭时，面向固定刀片的可动刀片相对于固定刀片自由往复运动，并且在往复运动期间通过重叠固定刀片而将记录介质与固定刀片一起切割; 使可动刀片往复运动的可动刀片驱动电动机; 以及可动刀片单元，其包括可动刀片，可动刀片驱动电机，以及容纳单元，其容纳可动刀片并设置在打印机主体上。打印机还包括一种机构，当可移动刀片从容纳单元突出并停止时，在可动刀片驱动马达容纳突出的可动刀片之前，使固定刀片和突出的可动刀片面对的空间变宽容纳单元，由盖开启杆的操作开始。

3. 发明申请

US20100025842A1 SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件和半导体器件
公开(公告)号：US20100025842A1
公开(公告)日：2010-02-04
申请号：US12533832
申请日：2009-07-31
申请人： Tetsuya YAMAMOTO , Mayumi NAKASATO , Yoshio OKAYAMA
发明人： Tetsuya YAMAMOTO , Mayumi NAKASATO , Yoshio OKAYAMA
IPC分类号： H01L23/52 , H01L23/488
CPC分类号： H01L24/12 , H01L2224/05001 , H01L2224/05022 , H01L2224/05147 , H01L2224/05155 , H01L2224/05548 , H01L2224/0558 , H01L2224/05644 , H01L2224/05647 , H01L2224/13008 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00014
摘要： A semiconductor module includes an insulating resin layer, a wiring layer provided on one main surface S1 of the insulating layer, and bump electrodes, electrically connected to the wiring layer, which are protruded on the insulating resin layer side from the wiring layer. Element electrodes provided on a semiconductor element are electrically connected to the bump electrodes. Solder parts are provided in predetermined positions of the wiring layer. The ratio (H2/H1) of the height H2 of the bump electrode over the height H1 of the solder part is 50% or below.
摘要翻译：半导体模块包括绝缘树脂层，设置在绝缘层的一个主表面S1上的布线层和在布线层的绝缘树脂层侧突出的与布线层电连接的凸起电极。设置在半导体元件上的元件电极电连接到凸块电极。焊接部件设置在布线层的预定位置。凸块电极的高度H2与焊接部的高度H1的比（H2 / H1）为50％以下。

4. 发明申请

US20090121350A1 BOARD ADAPTED TO MOUNT AN ELECTRONIC DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFORE, AND PORTABLE DEVICE 有权
标题翻译：适合安装电子设备的板，半导体模块及其制造方法和便携式设备
公开(公告)号：US20090121350A1
公开(公告)日：2009-05-14
申请号：US12266907
申请日：2008-11-07
申请人： Tetsuya YAMAMOTO , Yoshio OKAYAMA , Yasuyuki YANASE
发明人： Tetsuya YAMAMOTO , Yoshio OKAYAMA , Yasuyuki YANASE
IPC分类号： H01L23/48 , H01L21/44 , H01L23/498 , H01L21/768
CPC分类号： H01L23/525 , H01L23/3114 , H01L24/11 , H01L24/12 , H01L2224/02311 , H01L2224/02319 , H01L2224/02351 , H01L2224/0401 , H01L2224/13022 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： A board adapted to mount an electronic device includes an insulating resin layer, a wiring layer of a predetermined pattern provided on one surface of the insulating resin layer, a bump electrode provided on an insulating-resin-layer-side surface of the wiring layer, and a covering, formed of a metal layer, which covers a top surface of the bump electrode and a region, at a side surface of the bump electrode, continuous with the top surface excluding a region in contact with the wiring layer.
摘要翻译：适于安装电子装置的板包括绝缘树脂层，设置在绝缘树脂层的一个表面上的预定图案的布线层，设置在布线层的绝缘树脂层侧表面上的凸块电极，以及覆盖突起电极的顶面的金属层的覆盖物和突起电极的侧面的除了与布线层接触的区域之外的与顶面连续的区域。

5. 发明申请

US20110254175A1 SEMICONDUCTOR MEMORY DEVICE 失效
标题翻译：半导体存储器件
公开(公告)号：US20110254175A1
公开(公告)日：2011-10-20
申请号：US13172571
申请日：2011-06-29
申请人： Taku NISHIYAMA , Tetsuya YAMAMOTO , Naohisa OKUMURA
发明人： Taku NISHIYAMA , Tetsuya YAMAMOTO , Naohisa OKUMURA
IPC分类号： H01L23/48
CPC分类号： G11C5/063 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/18 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2924/00014 , H01L2924/01033 , H01L2924/01037 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor memory device includes: a wiring board including an element mounting portion and connection pads; a first element group including a plurality of semiconductor elements each having electrode pads arranged along one of outer sides of the semiconductor element, the plurality of semiconductor elements being layered stepwise on the element mounting portion of the wiring board in a way that pad arrangement sides of the semiconductor elements face in the same direction, and that the electrode pads are exposed; a second element group including a plurality of semiconductor elements each having electrode pads arranged along one of outer sides of the semiconductor element, the plurality of semiconductor elements being layered stepwise on the first element group in a way that pad arrangement sides of the semiconductor elements face in the same direction as that of the first element group, and that the electrode pads are exposed, the second element group being disposed to be offset from the first element group in an arrangement direction of the electrode pads;metallic wires for electrically connecting the electrode pads of the plurality of semiconductor elements included in the first and second element groups to the connection pads of the wiring board; and a sealing resin layer formed on the wiring board so as to seal the first and second element groups together with the metallic wires.
摘要翻译：半导体存储器件包括：布线板，包括元件安装部分和连接焊盘; 包括多个半导体元件的第一元件组，每个半导体元件具有沿着所述半导体元件的一个外侧布置的电极焊盘，所述多个半导体元件以所述布线板的元件安装部分的方式逐层地分层，半导体元件面向相同方向，电极焊盘露出; 包括多个半导体元件的第二元件组，每个半导体元件具有沿着所述半导体元件的一个外侧布置的电极焊盘，所述多个半导体元件以半导体元件的衬垫布置面朝向所述第一元件组逐级分层在与第一元件组相同的方向上，并且电极焊盘被暴露，第二元件组被设置为沿着电极焊盘的布置方向偏离第一元件组; 用于将包括在第一和第二元件组中的多个半导体元件的电极焊盘电连接到布线板的连接焊盘的金属线; 以及密封树脂层，其形成在所述布线板上，以与所述金属线一起密封所述第一和第二元件组。

6. 发明申请

US20100247215A1 NEAR-END OF ROLL DETECTING APPARATUS FOR DETECTING NEAR-END OF ROLL OF RECORDING MEDIUM, AND PRINTER 审中-公开
标题翻译：用于检测记录介质最近的滚筒检测装置的近端和打印机
公开(公告)号：US20100247215A1
公开(公告)日：2010-09-30
申请号：US12722882
申请日：2010-03-12
申请人： Hiroyuki TSUGARU , Tetsuya YAMAMOTO , Katsutoshi MUKAIJIMA , Gen MATSUSHIMA
发明人： Hiroyuki TSUGARU , Tetsuya YAMAMOTO , Katsutoshi MUKAIJIMA , Gen MATSUSHIMA
IPC分类号： B41J15/00 , B65H20/00
CPC分类号： B41J15/042 , B41J11/0075
摘要： A printer includes a recording medium accommodating unit that holds an outer circumferential portion of a recording medium wound in a roll, a printing unit that prints on the recording medium fed from the recording medium accommodating unit, a first detecting lever that is biased to abut a side aspect of the recording medium and that includes on a tip, a first protrusion that enters a space of a roll-core part in the center of the recording medium when the roll-core part is moved to a predetermined position by the weight of the recording medium as the recording medium is consumed, and a detecting switch that converts an action of the first detecting lever into an electric signal, where the first protrusion is provided on the first detecting lever being rotatable in a direction that the roll-core part moves to be detached from the recording medium accommodating unit.
摘要翻译：打印机包括：保持卷绕在卷筒上的记录介质的外圆周部分的记录介质容纳单元;打印单元，其在从记录介质容纳单元供给的记录介质上打印;第一检测杆，并且包括在尖端上的第一突起，当辊芯部分通过所述记录介质的重量移动到预定位置时进入记录介质的中心的辊芯部分的空间的第一突起作为记录介质的记录介质被消耗;以及检测开关，其将第一检测杆的动作转换为电信号，其中设置在第一检测杆上的第一突起能够沿着辊芯部移动的方向旋转与记录介质容纳单元分离。

7. 发明申请

US20090242887A1 Display Substrate Having a Transparent Conductive Layer Made of Zinc Oxide and Manufacturing Method Thereof 审中-公开
标题翻译：具有由氧化锌制成的透明导电层的显示基板及其制造方法
公开(公告)号：US20090242887A1
公开(公告)日：2009-10-01
申请号：US12413318
申请日：2009-03-27
申请人： Tetsuya YAMAMOTO , Naoki YAMAMOTO , Hisao MAKINO , Akira UJIHARA , Yoshinori HIRASHIMA , Hiroaki IWAOKA , Hisashi AOKI , Hitoshi HOKARI , Motohiko YOSHIDA
发明人： Tetsuya YAMAMOTO , Naoki YAMAMOTO , Hisao MAKINO , Akira UJIHARA , Yoshinori HIRASHIMA , Hiroaki IWAOKA , Hisashi AOKI , Hitoshi HOKARI , Motohiko YOSHIDA
IPC分类号： H01L33/00 , H01L21/28 , C23C14/32
CPC分类号： G02F1/13439 , C23C14/086 , C23C14/34 , C23C14/3485 , H01L51/5215
摘要： A display substrate is disclosed comprising: a supporting substrate; an organic resin layer formed on the supporting substrate; and a transparent electrode formed on the organic resin layer, wherein the transparent electrode includes: a first layer containing a zinc oxide and formed in close contact with the organic resin layer; and a second layer containing a zinc oxide and which has a thickness thicker than a thickness of the first layer and is formed on the first layer, wherein the first layer is deposited by either one of a DC sputtering and a DC magnetron sputtering, and the second layer is deposited by any one of a radio frequency sputtering, a radio frequency magnetron sputtering, a radio frequency superimposing a DC sputtering, and a radio frequency superimposing a DC magnetron sputtering, and the display substrate is available, for example, as the substrate having a transparent electrode for counter electrode of liquid crystal display device.
摘要翻译：公开了一种显示基板，包括：支撑基板; 形成在所述支撑基板上的有机树脂层; 和形成在有机树脂层上的透明电极，其中透明电极包括：含有氧化锌并与有机树脂层紧密接触形成的第一层; 和含有氧化锌的第二层，其厚度比第一层的厚度厚，并且形成在第一层上，其中第一层通过DC溅射和DC磁控溅射中的任一种沉积，并且第二层通过射频溅射，射频磁控溅射，射频叠加DC溅射和叠加DC磁控溅射的射频中的任一种沉积，并且显示基板可用作例如基板具有用于液晶显示装置的对电极的透明电极。

8. 发明申请

US20090197654A1 MOBILE APPARATUS AND MOBILE PHONE 审中-公开
标题翻译：移动电话和移动电话
公开(公告)号：US20090197654A1
公开(公告)日：2009-08-06
申请号：US12269446
申请日：2008-11-12
申请人： Masao TESHIMA , Koichi SATO , Hiromichi SUZUKI , Miki MORI , Tetsuya YAMAMOTO
发明人： Masao TESHIMA , Koichi SATO , Hiromichi SUZUKI , Miki MORI , Tetsuya YAMAMOTO
IPC分类号： H04M1/00
CPC分类号： H01Q1/243 , G06K19/07749 , H01Q7/00
摘要： According to one aspect of the invention, there is provided a mobile apparatus including: a resin body having a circumferential portion; a loop antenna disposed along the circumferential portion; and a printed circuit board configured to mount electronic components thereon, wherein the resin body is formed continuously and the loop antenna and the printed circuit board are embedded in the resin body.
摘要翻译：根据本发明的一个方面，提供了一种移动装置，包括：具有圆周部分的树脂体; 沿所述圆周部分设置的环形天线; 以及配置成在其上安装电子部件的印刷电路板，其中树脂体连续地形成，并且环形天线和印刷电路板嵌入树脂体中。

9. 发明申请

US20100310294A1 NEAR-END OF ROLL DETECTING APPARATUS FOR DETECTING NEAR-END OF ROLL OF RECORDING MEDIUM, AND PRINTER 有权
标题翻译：用于检测记录介质最近的滚筒检测装置的近端和打印机
公开(公告)号：US20100310294A1
公开(公告)日：2010-12-09
申请号：US12760143
申请日：2010-04-14
申请人： Hiroyuki TSUGARU , Gen MATSUSHIMA , Katsutoshi MUKAIJIMA , Tetsuya YAMAMOTO
发明人： Hiroyuki TSUGARU , Gen MATSUSHIMA , Katsutoshi MUKAIJIMA , Tetsuya YAMAMOTO
IPC分类号： B41J11/42 , B65H16/00 , B65H26/06
CPC分类号： B65H26/08 , B65H2301/41387 , B65H2301/41522 , B65H2511/142 , B65H2511/22 , B65H2801/12 , B65H2220/02 , B65H2220/03 , B65H2220/01
摘要： To improve precision in identifying the amount that remains of a recording medium, an apparatus includes a paper holder that supports an outer circumferential surface of a recording medium that is biased downward in a vertical direction by the weight of the recording medium, such that a position of a center of the recording medium moves on a straight-line trace, associated with consumption of the recording medium; and a light-reflecting sensor that is provided at a predetermined position at a side face of the paper holder and senses displacement per unit time at a position facing the predetermined position of the recording medium that is rotated by being pulled out of the paper holder, associated with the consumption of the recording medium, where based on the displacement sensed by the light-reflecting sensor, a radius of the recording medium at the time the light reflecting sensor senses the displacement is calculated.
摘要翻译：为了提高识别记录介质的剩余量的精度，一种装置包括：纸支架，其支撑由记录介质的重量沿垂直方向向下偏压的记录介质的外周面，使得位置记录介质的中心在与记录介质的消耗相关联的直线迹线上移动; 以及光反射传感器，其设置在纸保持器的侧面的预定位置处，并且在面向通过从纸保持器拉出而旋转的记录介质的预定位置的位置处感测每单位时间的位移，与记录介质的消耗相关联，其中基于由光反射传感器感测的位移，计算在光反射传感器感测位移时记录介质的半径。

10. 发明申请

US20100078675A1 CIRCUIT DEVICE 有权
标题翻译：电路设备
公开(公告)号：US20100078675A1
公开(公告)日：2010-04-01
申请号：US12568491
申请日：2009-09-28
申请人： Kiyoaki KUDO , Takashi SHIBASAKI , Tetsuya YAMAMOTO
发明人： Kiyoaki KUDO , Takashi SHIBASAKI , Tetsuya YAMAMOTO
IPC分类号： H01L27/06
CPC分类号： H01L23/24 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L25/18 , H01L2224/32225 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/48139 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/73265 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/2076 , H01L2924/00015 , H01L2224/05599
摘要： Provided is a circuit device having a configuration in which thermal interference between built-in elements is suppressed and being miniaturized in total size. A hybrid integrated circuit device of the present invention includes: a circuit substrate, a sealing resin and leads. The circuit substrate in its upper surface is incorporated with a hybrid integrated circuit formed of semiconductor elements and the like respectively fixed to heat spreaders. The sealing resin coats the circuit substrate and thus seals the hybrid integrated circuit. The leads each extend to the outside while being fixed to a pad formed of a conductive pattern. In this hybrid integrated circuit device, the semiconductor elements are mounted on the respective heat spreaders at positions offset from each other, and thereby are arranged to be spaced away from each other.
摘要翻译：提供一种电路装置，其具有抑制内置元件之间的热干扰并使其总体尺寸小型化的结构。本发明的混合集成电路器件包括：电路基板，密封树脂和引线。其上表面的电路基板与分别固定在散热器上的半导体元件等形成的混合集成电路结合。密封树脂涂覆电路基板，从而密封混合集成电路。引线各自延伸到外部，同时固定到由导电图案形成的焊盘。在这种混合集成电路装置中，半导体元件在彼此偏移的位置处安装在相应的散热器上，从而被布置为彼此间隔开。

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